Differential cascode voltage switch (DCVS) master slice for high efficiency/custom density physical design

Claim 3

The method of claim 1 comprising further steps to personalize the DCVS master slice wafer from substock for DCVS applications, comprising the steps of: (1) further processing said master slice wafer by opening contact holes for active and passive components, selectively interconnecting said elements with metal wiring planes connecting to logic terminals thereon to thereby produce a completed personalized wafer, the further processing steps being controlled in accordance with a design methodology that comprises developing primitive logic form such as tree networks or gate array interconnects in DCVS cascode logic from generic descriptions such as logic maps and truth tables of various machine functional partitions, producing primitive logic machine diagrams with various logic groups and longest path delays, generating clocks from machine diamgrams validating and optimizing the primitive logic, and determining heirarchical placement, and hierarchical wiring, generating test pattern; and (2) probe testing the completed personalized wafer, sectioning said wafer into die, sorting out good die, assembling each sorted good die into a package, and testing and performing logic model hardward validation.