Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
189 words
A process for diffusing a dopant into a III-V type semiconductor body which comprises: (a) placing in a heating chamber which is substantially devoid of any oxidizing substance a deposition substrate possessing a dopant-containing layer which has been vapor deposited upon a major surface thereof in contact with, or in the proximity of, an object substrate fabricated from a III-V type semiconductor material with the dopant-containing layer of the deposition substrate being substantially opposed to a major surface of the object substrate; (b) introducing into the heating chamber a source of Group V element corresponding to the Group V element of the object substrate, said source being capable of providing Group V element in the vapor phase at the diffusion temperature with the vapor pressure of the vapor phase Group V element being at or above the equilibrium vapor pressure of the Group V element present at the surface of the object substrate; and (c) heating the deposition substrate and the object substrate to the diffusion temperature for a period of time sufficient to diffuse a predetermined amount of dopant into the object substrate to a predetermined depth therein.
Claim 2
Dependent Claim
189 words
A process for diffusing a dopant into a III-V type semiconductor body which comprises: (a) placing in a heating chamber which is substantially devoid of any oxidizing substance a deposition substrate possessing a dopant-containing layer which has been vapor deposited upon a major surface thereof in contact with, or in the proximity of, an object substrate fabricated from a III-V type semiconductor material with the dopant-containing layer of the deposition substrate being substantially opposed to a major surface of the object substrate; (b) introducing into the heating chamber a source of Group V element corresponding to the Group V element of the object substrate, said source being capable of providing Group V element in the vapor phase at the diffusion temperature with the vapor pressure of the vapor phase Group V element being at or above the equilibrium vapor pressure of the Group V element present at the surface of the object substrate; and (c) heating the deposition substrate and the object substrate to the diffusion temperature for a period of time sufficient to diffuse a predetermined amount of dopant into the object substrate to a predetermined depth therein.
Claim 3
Dependent Claim
37 words
The process of claim 1 in which the deposition substrate and the object substrate are both provided as wafers with the diameter of the deposition substrate being the same as or slightly larger than the object substrate.
Claim 4
Dependent Claim
17 words
The process of claim 1 wherein the III-V type semiconductor material of the object substrate is GaAs.
Claim 5
Dependent Claim
20 words
The process of claim 3 wherein the deposition substrate is GaAs having a dopant-containing layer of GaAs vapor deposited thereon.
Claim 6
Dependent Claim
17 words
The process of claim 3 wherein the vapor phase group V material is arsenic derived from arsine.
Claim 7
Dependent Claim
12 words
The process of claim 1 wherein the dopant is a P-type impurity.
Claim 8
Dependent Claim
10 words
The process of claim 5 wherein the dopant is zinc.
Claim 9
Dependent Claim
22 words
The process of claim 6 wherein the diffusion temperature is in the range of from about 500° C. to about 800° C.
Claim 10
Dependent Claim
22 words
The process of claim 8 wherein the diffusion temperature is in the range of from about 550° C. to about 750° C.
Claim 11
Dependent Claim
22 words
The process of claim 6 wherein heating at the diffusion temperature is carried out for from about 2 to about 60 minutes.
Claim 12
Dependent Claim
12 words
The process of claim 1 wherein the dopant is an N-type impurity.
Claim 13
Dependent Claim
10 words
The process of claim 11 wherein the dopant is silicon.
Claim 14
Dependent Claim
22 words
The process of claim 11 wherein the diffusion temperature is in the range of from about 700° C. to about 1100° C.
Claim 15
Dependent Claim
22 words
The process of claim 13 wherein the diffusion temperature is in the range of from about 750° C. to about 1050° C.
Claim 16
Dependent Claim
22 words
The process of claim 11 wherein heating at the diffusion temperature is carried out for from about 10 to about 120 minutes.
Claim 17
Dependent Claim
19 words
The process of claim 1 wherein the dopant-containing layer is from about 1 to about 5 microns in thickness.
Claim 18
Dependent Claim
30 words
The process of claim 1 wherein the concentration of dopant in said dopant-containing layer is from about 10 17 to about 10 20 atoms per cubic centimeter of said layer.
Claim 19
Dependent Claim
33 words
The process of claim 17 wherein the surface concentration of dopant in the object substrate following diffusion is from about 5×10 16 to about 5×10 19 atoms per cubic centimeter of said layer.
Claim 20
Dependent Claim
21 words
The process of claim 1 wherein the heating chamber is evacuated of ambient atmosphere prior to heating to the diffusion temperature.
Claim 21
Dependent Claim
26 words
The process of claim 1 wherein the heating chamber is swept free of ambient atmosphere with an inert gas prior to heating to the diffusion temperature.
Claim 22
Dependent Claim
11 words
The process of claim 20 wherein the inert gas is nitrogen.
Claim 23
Dependent Claim
25 words
The process of claim 1 wherein the vapor phase Group V element has a vapor phase pressure fraction of from about 0.1% to about 5%.