US3961996A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of producing semiconductor laser device
Assignee: Mitsubishi Electric Corp
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Filing: 1974-10-17
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Granted: 1976-06-08
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Expires: 1994-10-17
Abstract
Abstract N type Ga 0 .7 Al 0 .3 As, N type GaAs, N type Ga 0 .7 Al 0 .3 As and P type Ga 1-0 .3 Al 0 .3 As are epitaxially grown on an N type GaAs substrate in the named order one after another to form superposed layers. A selected portion of the uppermost layer is etched away along with those portions of the following two layers and one part of the lowermost layer located below the selected uppermost layer portion. P type Ga 1-0 .3 Al 0 .3 As highly doped with zinc is epitaxially grown to fill the removed portions of the layers. Then the zinc is diffused into the adjacent portions of the layers to form a radiative recombination region of a layer on that portion of the GaAs layer converted to the P type.
Inventors
- 👤 Hirofumi Namizaki
- 👤 Hirofumi Kan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 13:07
CPC Classifications
H; H01; H01S; H01S5/00; H01S5/20; H01S5/22; H01S5/2203; H01S5/2054; H01S5/2059; Y; Y10; Y10S; Y10S148/00; Y10S148/039; Y10S148/05; Y10S148/051; Y10S148/065; Y10S148/067; Y10S148/072; Y10S148/145
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
225 words
A process of producing a semiconductor laser device comprising the steps of forming, on a semiconductor substrate of a first type conductivity, a first semiconductor layer of the first type conductivity, a second semiconductor layer of the first type conductivity and a third semiconductor layer of the first type conductivity in the named order one after another, each of said semiconductor substrate and said second semiconductor layer being of a semiconductive material relatively narrow in a forbidden band width, each of said first semiconductor layer and said third semiconductor layer being of a semiconductor material relatively broad in a forbidden band, selectively etching said third semiconductor layer from the exposed surface thereof to remove a region including the etched portion of said third semiconductor layer and that portion of said second semiconductor layer located below the latter and reaching said first semiconductor layer, forming a fourth semiconductor layer of a second type conductivity so as to completely fill the removed region said fourth semiconductor layer being of a semiconductive material relatively broad in a forbidden band width, converting those portions of said first, second and third semiconductor layers adjacent to said fourth semiconductor layer to the second type semiconductivity, disposing a first electrical connection in ohmic contact with said semiconductor substrate, and disposing a second electrical connection in ohmic contact with said fourth semiconductor layer.
Claim 2
Dependent Claim
225 words
A process of producing a semiconductor laser device comprising the steps of forming, on a semiconductor substrate of a first type conductivity, a first semiconductor layer of the first type conductivity, a second semiconductor layer of the first type conductivity and a third semiconductor layer of the first type conductivity in the named order one after another, each of said semiconductor substrate and said second semiconductor layer being of a semiconductive material relatively narrow in a forbidden band width, each of said first semiconductor layer and said third semiconductor layer being of a semiconductor material relatively broad in a forbidden band, selectively etching said third semiconductor layer from the exposed surface thereof to remove a region including the etched portion of said third semiconductor layer and that portion of said second semiconductor layer located below the latter and reaching said first semiconductor layer, forming a fourth semiconductor layer of a second type conductivity so as to completely fill the removed region said fourth semiconductor layer being of a semiconductive material relatively broad in a forbidden band width, converting those portions of said first, second and third semiconductor layers adjacent to said fourth semiconductor layer to the second type semiconductivity, disposing a first electrical connection in ohmic contact with said semiconductor substrate, and disposing a second electrical connection in ohmic contact with said fourth semiconductor layer.
Claim 3
Dependent Claim
49 words
A process of producing a semiconductor laser device as claimed in claim 1 wherein said substrate and second layer are of N type gallium arsenide and said first and third layers are of N type gallium aluminum arsenide while said fourth layer is of P type gallium aluminum arsenide.
Claim 4
Dependent Claim
24 words
A process of producing a semiconductor laser device as claimed in claim 1 wherein said step of converting the conductivity includes a heat treatment.
Claim 5
Dependent Claim
237 words
A process of producing a semiconductor laser device, comprising the steps of forming, on a semiconductor substrate of a first type conductivity, a first semiconductor layer of the first type conductivity, a second semiconductor layer of the first type conductivity, a third semiconductor layer of the first type conductivity and a fourth semiconductor layer of a second type conductivity in the named order one after another, each of said substrate and said second layer being of a semiconductive material relatively narrow in a forbidden band width, each of said first, third and fourth layers being of a semiconductive material relatively broad in a forbidden band width, selectively etching said fourth semiconductor layer from the exposed surface thereof to remove a region including the etched portion of said fourth semiconductor layer and those portions of said third and second semiconductor layers located below the latter and reaching said first semiconductor layer, forming a fifth semiconductor layer of the second type conductivity so as to fill the removed region, said fifth semiconductor layer being of a semiconductive material relatively broad in a forbidden band width, converting those portions of said first, second and third semiconductor layers adjacent to said fifth semiconductor layer to the second type conductivity, disposing a first electrical connection in ohmic contact with said semiconductor substrate, and disposing a second electrical connection in ohmic contact with both said fourth semiconductor layer and said fifth semiconductor layer.
Claim 6
Dependent Claim
237 words
A process of producing a semiconductor laser device, comprising the steps of forming, on a semiconductor substrate of a first type conductivity, a first semiconductor layer of the first type conductivity, a second semiconductor layer of the first type conductivity, a third semiconductor layer of the first type conductivity and a fourth semiconductor layer of a second type conductivity in the named order one after another, each of said substrate and said second layer being of a semiconductive material relatively narrow in a forbidden band width, each of said first, third and fourth layers being of a semiconductive material relatively broad in a forbidden band width, selectively etching said fourth semiconductor layer from the exposed surface thereof to remove a region including the etched portion of said fourth semiconductor layer and those portions of said third and second semiconductor layers located below the latter and reaching said first semiconductor layer, forming a fifth semiconductor layer of the second type conductivity so as to fill the removed region, said fifth semiconductor layer being of a semiconductive material relatively broad in a forbidden band width, converting those portions of said first, second and third semiconductor layers adjacent to said fifth semiconductor layer to the second type conductivity, disposing a first electrical connection in ohmic contact with said semiconductor substrate, and disposing a second electrical connection in ohmic contact with both said fourth semiconductor layer and said fifth semiconductor layer.
Claim 7
Dependent Claim
57 words
A process of producing a semiconductor laser device as claimed in claim 4 wherein each of said substrate and second layer is of N type gallium arsenide and each of said first and third layers is of N type gallium aluminum arsenide while each of said fourth and fifth layers is of P type gallium aluminum arsenide.
Claim 8
Dependent Claim
24 words
A process of producing a semiconductor laser device as claimed in claim 4 wherein said step of converting the conductivity includes a heat treatment.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-06-08 | 1979-12-08 | 1980-06-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-06-08 | 1983-12-08 | 1984-06-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-06-08 | 1987-12-08 | 1988-06-08 | $7700.00 | Window Closed / Lapsed |