Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
150 words
A method for growing a resistive epitaxial layer on a short lifetime EPI-layer, comprising the steps of: forming a first thin single-crystal semiconductor layer on a semiconductor substrate of one conductivity type which contains oxygen, said first thin single-crystal semiconductor layer having a higher resistivity than that of said semiconductor substrate and the same conductivity type as that of said semiconductor substrate; ion-implanting an electrically inactive impurity in said first thin single-crystal semiconductor layer; forming a second thin single-crystal semiconductor layer on said first thin single-crystal semiconductor layer, said second thin single-crystal semiconductor layer having the same conductivity type as that of said semiconductor substrate and a higher resistivity than that of said semiconductor substrate; performing annealing for not less than four hours at a temperature of 550° C. to 900° C. after the electrically inactive impurity is ion-implanted; and forming an element in said second thin single-crystal semiconductor layer.
Claim 2
Independent Claim
150 words
A method for growing a resistive epitaxial layer on a short lifetime EPI-layer, comprising the steps of: forming a first thin single-crystal semiconductor layer on a semiconductor substrate of one conductivity type which contains oxygen, said first thin single-crystal semiconductor layer having a higher resistivity than that of said semiconductor substrate and the same conductivity type as that of said semiconductor substrate; ion-implanting an electrically inactive impurity in said first thin single-crystal semiconductor layer; forming a second thin single-crystal semiconductor layer on said first thin single-crystal semiconductor layer, said second thin single-crystal semiconductor layer having the same conductivity type as that of said semiconductor substrate and a higher resistivity than that of said semiconductor substrate; performing annealing for not less than four hours at a temperature of 550° C. to 900° C. after the electrically inactive impurity is ion-implanted; and forming an element in said second thin single-crystal semiconductor layer.
Claim 3
Dependent Claim
23 words
The method according to claim 1, wherein said semiconductor substrate has an oxygen concentration of not less than 7×10 17 cm -3 .
Claim 4
Dependent Claim
19 words
The method according to claim 1, wherein said semiconductor substrate has a resistivity of not more than 0.5 Ωcm.
Claim 5
Dependent Claim
25 words
The method according to claim 1, wherein said first and second thin single-crystal semiconductor layers respectively have a resistivity of not less than 1 Ωcm.
Claim 6
Dependent Claim
22 words
The method according to claim 1, wherein said first thin single-crystal semiconductor layer has a thickness of not more than 3 μm.
Claim 7
Dependent Claim
26 words
The method according to claim 1, wherein said second thin single-crystal semiconductor layer has a thickness falling within a range between 3 μm and 10 μm.
Claim 8
Dependent Claim
33 words
The method according to claim 1, wherein the electrically inactive impurity is at least one material selected from the group consisting of oxygen, carbon, nitrogen, silicon, germanium, tin, argon, xenon, neon, and krypton.
Claim 9
Dependent Claim
19 words
The method according to claim 1, wherein the annealing is performed immediately after the electrically inactive impurity is ion-implanted.
Claim 10
Dependent Claim
21 words
The method according to claim 1, wherein the annealing is performed immediately after said second thin single-crystal semiconductor layer is formed.
Claim 11
Dependent Claim
26 words
The method according to claim 1, wherein said element comprises a cell of a dynamic random access memory, said cell comprising one transistor and one capacitor.
Claim 12
Dependent Claim
16 words
The method according to claim 1, wherein said element comprises a complementary metal oxide semiconductor transistor.