Process for forming a high density metallurgy system on a substrate and structure thereof

Claim 1

A high density multiple interconnection solder pad and fan-out metalurgy system for a multi-layer ceramic module comprising, a multi-layer ceramic substrate having an internal metallurgy system, a plurality of vias arranged in a closely spaced matrix, and an outer ring of vias surrounding said matrix in the top surface of said substrate, a plurality of small indented areas arranged in a closely spaced matrix arranged within and with attending areas in the spaces between said matrix of vias, said matrix of vias and matrix of indented areas collectively defining an interconnection pad configuration, a plurality of indented lines in said surface of said substrate, each of said indented lines terminating at one end at an indented area of said matrix, and at the opposite end at one of said vias in said outer ring of vias, conductive metal material disposed in said indented lines and in said indented areas forming a surface metallurgy fan-out pattern, a dielectric layer of material provided with openings over each of said vias in said matrix of vias, and each of said metal filled indented areas in said matrix of indented areas, and a plurality of solder pads, each pad located over a via of said matrix of vias, and over an indented area of said matrix of indented areas.