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US4559238A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making a field effect transistor with modified Schottky barrier depletion region

Assignee: Leonardo SpA
•
Filing: 1982-07-19
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Granted: 1985-12-17
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Expires: 2002-07-19
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Abstract

Abstract A method of making a field effect transistor with a modified metal semiconductor Schottky barrier depletion region wherein a GaAs semiconductive active layer on a semiinsulating substrate is supplied with a pair of ohmic contacts and with a gate or barrier electrode between the ohmic contacts and spaced therefrom so that below the surface of the active layer upon which the barrier electrode and ohmic contacts are supplied, an electron-depletion region is formed between each ohmic contact and the gate or barrier electrode. According to the invention, this surface region is treated by bombardment with nitrogen or by the application of a layer thereto to modify the depth of the depletion region so that this depth beneath the treated surface region will differ from that beneath the gate or barrier electrode.

Inventors

  • 👤 Marina Bujatti
  • 👤 Antonio Cetronio

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 20:52
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/061; H10D30/0612; H10D30/80; H10D30/87; H10D62/00; H10D62/10; H10D62/17; H10D62/213; H10D62/221

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 180 words
A method of making a field effective transistor with a modified metal semiconductor Schottky barrier depletion zone which comprises: forming a GaAs active semiconductor layer upon a semi-insulating substrate and applying to a surface of said active layer opposite said substrate, a pair of spaced apart ohmic contacts and a barrier electrode forming a gate between said ohmic contacts and at the same level thereof, whereby an electron depletion region is formed below said surface between said ohmic contacts and beneath said electrode; and modifying the depth of said region so that the depth of said region between said ohmic contacts and said electrode differs from the depth of said region below said electrode by at least one of the steps of: subjecting the surface below said barrier electrode prior to the application of said barrier electrode to said surface to an ion bombardment in nitrogen gas for a period of substantially 1 to 2 minutes at an intensity of up to about 100 watts, and depositing a gallium oxide on said surface between said electrode and said ohmic contacts.
Claim 2
Independent Claim 180 words
A method of making a field effective transistor with a modified metal semiconductor Schottky barrier depletion zone which comprises: forming a GaAs active semiconductor layer upon a semi-insulating substrate and applying to a surface of said active layer opposite said substrate, a pair of spaced apart ohmic contacts and a barrier electrode forming a gate between said ohmic contacts and at the same level thereof, whereby an electron depletion region is formed below said surface between said ohmic contacts and beneath said electrode; and modifying the depth of said region so that the depth of said region between said ohmic contacts and said electrode differs from the depth of said region below said electrode by at least one of the steps of: subjecting the surface below said barrier electrode prior to the application of said barrier electrode to said surface to an ion bombardment in nitrogen gas for a period of substantially 1 to 2 minutes at an intensity of up to about 100 watts, and depositing a gallium oxide on said surface between said electrode and said ohmic contacts.
Claim 3
Dependent Claim 28 words
The method defined in claim 1 wherein gallium is initially deposited on said surface between said ohmic contacts and said electrode and is thereafter transformed to gallium oxide.
Claim 4
Dependent Claim 91 words
The method defined in claim 2 wherein the gallium oxide is deposited on said surface by the steps of: masking said layer with a photoresist leaving uncovered only areas of said surface corresponding to areas between said ohmic contacts and said electrode; removing native oxide from said surface in said uncovered areas; vapor depositing a film of gallium upon said surface in the areas in which native oxide has been removed; removing a photoresist from said layer; and oxidizing said gallium film to Ga 2 O 3 in an oxygen atmosphere.
Claim 5
Dependent Claim 75 words
The method defined in claim 1 wherein the ion bombardment is carried out for about 2 minutes and the depth of said region is modified by the steps of: masking said layer with a photoresist leaving uncovered only an area subsequently to be covered by said barrier electrode; subjecting said layer to said bombardment in the uncovered area; removing the photoresist from said layer; and depositing metal on said area to form said barrier electrode.

References Cited (Backward Citations)

US4098921A Cited
US4056642A Cited
US4170666A Cited
US4172906A Cited
US4244097A Cited
US4310362A Cited
US4426765A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1988-12-16 1989-06-17 1989-12-17 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1992-12-16 1993-06-17 1993-12-17 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1996-12-16 1997-06-17 1997-12-17 $7700.00 Window Closed / Lapsed

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