Method of forming ohmic contact on GaAs by Ge film and implanting impurity ions therethrough

Claim 2

In a method of manufacturing a GaAs compound semiconductor device including steps of forming a plurality of semiconductor elements in a GaAs compound semiconductor body by impurity diffusion or ion implantation, forming ohmic electrodes on these semiconductor elements, and forming connection wiring among these elements, the improvement comprising the steps of applying a Ge film on an n+ implanted region for forming ohmic electrodes thereon, implanting impurity ions into the Ge film with a concentration higher than that of the implanted region, applying to the overall surface of the semiconductor body, including the Ge film, a metal comprising a W-AI alloy having a sufficiently high melting point that the Ge film becomes an n++ Ge film and the n+ implanted region of the GaAs substrate is activated by subsequent high temperature annealing treatment, and subjecting the semiconductor body to an annealing treatment after the final ion implantation step.

Claim 3

A method as claimed in claim 1, wherein the impurity ion injected into the Ge film is an As ion.

Claim 4

A method as claimed in claim 1, wherein the n type impurity ion may be implanted into the semiconductor body during a first manufacturing step thereof.

Claim 5

A method as claimed in claim 1, wherein the ohmic electrode coating and a Schottky electrode are formed at once on the semiconductor body with the use of the W-Al alloy having a high melting point.

Claim 6

A method as claimed in claim 1, wherein the annealing treatment is effected when a Schottky electrode and the ohmic electrode are formed and further ion implantation is effected, the whole semiconductor body being covered by a SiO 2 film.

Claim 7

A method as claimed in claim 2, wherein the concentration distribution of the As ion implanted into the Ge film has a maximum value at the center thereof in the direction of film thickness.

Claim 8

In a method of manufacturing a GaAs compound semiconductor device including steps of forming a plurality of semiconductor elements in a GaAs compound semiconductor body by impurity diffusion or ion implantation, forming ohmic electrodes on these semiconductor elements, and forming connection wiring among these elements, the improvement comprising the steps of applying a Ge film on an n+ implanted region for forming ohmic electrodes thereon, implanting impurity ions into the Ge film with a concentration higher than that of the implanted region, then implanting a high concentration of impurity ion into the region of the semiconductor body underneath the Ge film to form an n++ region, applying to the overall surface of the semiconductor body, including the Ge film, a metal comprising a W-Al alloy having a sufficiently high melting point that the Ge film becomes an n++ Ge film and the n+ implanted region of the GaAs substrate is activated by subsequent high temperature annealing treatment, and subjecting the semiconductor body to an annealing treatment after the final ion implantation step.

Claim 9

In a method of manufacturing a GaAs compound semiconductor device including steps of forming a plurality of semiconductor elements in a GaAs compound semiconductor body by impurity diffusion or ion implantation, forming ohmic electrodes on these semiconductor elements, and forming connection wiring among these elements, the improvement comprising the steps of applying a Ge film on an n+ implanted region for forming ohmic electrodes thereon, implanting impurity ions into the Ge film with a concentration higher than that of the implanted region, then implanting a high concentration of impurity ion into the region of the semiconductor body underneath the Ge film to form an n++ region, applying to the overall surface of the semiconductor body, including the Ge film, a metal comprising a W-Al alloy having a sufficiently high melting point that the Ge film becomes an n++ Ge film and the n+ implanted region of the GaAs substrate is activated by subsequent high temperature annealing treatment, and subjecting the semiconductor body to an annealing treatment after the final ion implantation step.

Claim 10

In a method of manufacturing a GaAs compound semiconductor device including steps of forming a plurality of semiconductor elements in a GaAs compound semiconductor body by impurity diffusion or ion implantation, forming ohmic electrodes on these semiconductor elements, and forming connection wiring among these elements, the improvement comprising the steps of applying a Ge film on an n+ implanted region for forming ohmic electrodes thereon, implanting impurity ions into the Ge film with a concentration higher than that of the implanted region, applying to the overall surface of the semiconductor body, including the Ge film, a metal having so high a melting point that the Ge film becomes n++ Ge film and the n+ implanted region of the GaAs substrate is activated by subsequent high temperature annealing treatment, and subjecting the semiconductor body to an annealing treatment when the metal having a high melting point is applied onto the overall surface of the semiconductor body including the Ge film.

Claim 11

In a method of manufacturing a GaAs compound semiconductor device including steps of forming a plurality of semiconductor elements in a GaAs compound semiconductor body by impurity diffusion or ion implantation, forming ohmic electrodes on these semiconductor elements, and forming connection wiring among these elements, the improvement comprising the steps of applying a Ge film on an n+ implanted region for forming ohmic electrodes thereon, implanting impurity ions into the Ge film with a concentration higher than that of the implanted region, applying to the overall surface of the semiconductor body, including the Ge film, a metal having so high a melting point that the Ge film becomes n++ Ge film and the n+ implanted region of the GaAs substrate is activated by subsequent high temperature annealing treatment, and subjecting the semiconductor body to an annealing treatment when the metal having a high melting point is applied onto the overall surface of the semiconductor body including the Ge film.