Patent US4538170A successfully refreshed from Google Patents.
US4538170A
Expired / Lapsed
US
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Power chip package
Assignee: Intersil Corp
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Filing: 1983-01-03
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Granted: 1985-08-27
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Expires: 2003-01-03
Abstract
Abstract A heat-generating power semiconductor chip is mounted in a package to permit testing or use of the chip before or after mounting of the package to a heat spreader plate. A plurality of sheet metal leads are attached to a dielectric substrate, such as beryllia. The leads are patterned in mirror image fashion to a plurality of terminals on one side of the power chip. In one form, a further sheet metal lead is attached to a further dielectric substrate and is adapted to abut a terminal on the other side of the power chip. In another form, heat transfer structure is provided for transferring heat between the pair of dielectric substrates, thereby enabling heat to be removed from both sides of the power chip.
Inventors
- 👤 Alexander J. Yerman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 06:36
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
134 words
A power chip package comprising: a power chip having a first terminal on one side thereof and a second terminal on the opposite side thereof; a first dielectric substrate; a first sheet metal lead attached to one side of said first dielectric substrate and patterned in mirror image fashion to, and attached to, said first terminal; a second dielectric substrate; a second sheet metal lead attached to one side of said second dielectric substrate and patterned in mirror image fashion to, and attached to, said second terminal; and a heat transfer means in heat flow communication with said first and second dielectric substrates for transferring heat between said first and second dielectric substrates, said heat transfer means comprising a plurality of compacted folds of sheet metal interposed between said first and second dielectric substrates.
Claim 2
Dependent Claim
134 words
A power chip package comprising: a power chip having a first terminal on one side thereof and a second terminal on the opposite side thereof; a first dielectric substrate; a first sheet metal lead attached to one side of said first dielectric substrate and patterned in mirror image fashion to, and attached to, said first terminal; a second dielectric substrate; a second sheet metal lead attached to one side of said second dielectric substrate and patterned in mirror image fashion to, and attached to, said second terminal; and a heat transfer means in heat flow communication with said first and second dielectric substrates for transferring heat between said first and second dielectric substrates, said heat transfer means comprising a plurality of compacted folds of sheet metal interposed between said first and second dielectric substrates.
Claim 3
Dependent Claim
25 words
The power chip package of claim 1 wherein said first and second dielectric substrates are each selected from the group consisting of alumina and beryllia.
Claim 4
Dependent Claim
17 words
The power chip package of claim 1 wherein said first and second dielectric substrates each comprise beryllia.
Claim 5
Dependent Claim
18 words
The power chip package of claim 1 wherein said first and second sheet metal leads each comprise copper.
Claim 6
Dependent Claim
49 words
The power chip package of claim 1 further comprising: a first eutectic composition situated between and integrally bonding together said first sheet metal lead and said first dielectric substrate; and a second eutectic composition situated between and integrally bonding together said second sheet metal lead and said second substrate.
Claim 7
Dependent Claim
23 words
The power chip package of claim 1 further comprising a solderable metal layer attached to a further side of said first dielectric substrate.
Claim 8
Dependent Claim
23 words
The power chip package of claim 1 further comprising a solderable metal layer attached to a further side of said second dielectric substrate.
Claim 9
Dependent Claim
59 words
The power chip package of claim 1 wherein said power chip has a third terminal, said third terminal being formed on said one side of said power chip, and further comprising a third sheet metal lead attached to said one side of said first dielectric substrate and patterned in mirror image fashion to, and attached to, said third terminal.
Claim 10
Dependent Claim
37 words
The power chip package of claim 8 wherein: said first and second dielectric substrates are each selected from the group consisting of alumina and beryllia; and said first, second and third sheet metal leads each comprises copper.
Claim 11
Dependent Claim
70 words
The power chip package of claim 9 further comprising: a first eutectic composition situated between and integrally bonding together said first sheet metal lead and said first dielectric substrate; a second eutectic composition situated between and integrally bonding together said second sheet metal lead and said second dielectric substrate; and a third eutectic composition situated between and integrally bonding together said third sheet metal lead and said first dielectric substrate.
Claim 12
Dependent Claim
29 words
The power chip package of claim 1 wherein said compacted folds of sheet metal interposed between said first and second dielectric substrates comprise leads of the power chip package.
Claim 13
Dependent Claim
112 words
A package for a power chip comprising: a first dielectric substrate; a plurality of sheet metal leads attached to one side of said first dielectric substrate and patterned in mirror image fashion to the terminal pattern on one side of a power chip; a second dielectric substrate; a further sheet metal lead attached to one side of said second dielectric substrate and patterned in mirror image fashion to a terminal on another side of the power chip; and heat transfer means for transferring heat between said first and second dielectric substrates, said heat transfer means comprising a plurality of compacted folds of sheet metal interposed between said first and second dielectric substrates.
Claim 14
Dependent Claim
112 words
A package for a power chip comprising: a first dielectric substrate; a plurality of sheet metal leads attached to one side of said first dielectric substrate and patterned in mirror image fashion to the terminal pattern on one side of a power chip; a second dielectric substrate; a further sheet metal lead attached to one side of said second dielectric substrate and patterned in mirror image fashion to a terminal on another side of the power chip; and heat transfer means for transferring heat between said first and second dielectric substrates, said heat transfer means comprising a plurality of compacted folds of sheet metal interposed between said first and second dielectric substrates.
Claim 15
Dependent Claim
55 words
The power chip package of claim 11 further comprising: a plurality of eutectic compositions respectively situated between and integrally bonding together each of said plurality of sheet metal leads and said first dielectric substrate; and a further eutectic composition situated between an integrally bonding together said further sheet metal lead and said second dielectric substrate.
Claim 16
Dependent Claim
25 words
The power chip package of claim 13 wherein said first and second dielectric substrates each comprise one of the group consisting of alumina and beryllia.
Claim 17
Dependent Claim
29 words
The power chip package of claim 12 wherein said compacted folds of sheet metal interposed between said first and second dielectric substrates comprise leads of the power chip package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-08-26 | 1989-02-25 | 1989-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-08-26 | 1993-02-25 | 1993-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-08-26 | 1997-02-25 | 1997-08-27 | $7700.00 | Window Closed / Lapsed |