Method of making high density dynamic memory cell

Claim 1

A method of making a dynamic semiconductor memory cell of the one-transistor type comprising the steps of: applying a first layer of conductive material on a face of a body of semiconductor material, said first layer being separated from a capacitor region of said face by thin insulator, applying a second layer of conductive material onto said face partially overlying the first layer but separated therefrom by an insulator, the second layer being patterned to define an elongated strip and a transistor gate, the gate overlying a channel region of said face but being separated therefrom by thin insulator, forming a heavily-doped region in said face adjacent said channel region, applying a third layer of conductive material onto said face overlying a part of said heavily-doped region, the third layer being wider than said heavily-doped region but being spaced from said first and second layers along the face, and applying a layer of metal over said face contacting said third layer at a contact window over said part of said region.

Claim 2

A method of making a dynamic semiconductor memory cell of the one-transistor type comprising the steps of: applying a first layer of conductive material on a face of a body of semiconductor material, said first layer being separated from a capacitor region of said face by thin insulator, applying a second layer of conductive material onto said face partially overlying the first layer but separated therefrom by an insulator, the second layer being patterned to define an elongated strip and a transistor gate, the gate overlying a channel region of said face but being separated therefrom by thin insulator, forming a heavily-doped region in said face adjacent said channel region, applying a third layer of conductive material onto said face overlying a part of said heavily-doped region, the third layer being wider than said heavily-doped region but being spaced from said first and second layers along the face, and applying a layer of metal over said face contacting said third layer at a contact window over said part of said region.

Claim 10

A method of making a semiconductor device comprising the steps of: applying a first layer of conductive material over a face of a semiconductor body to form electrodes overlying first semiconductor regions, applying a second layer of conductive material on said face partially overlying the first layer and also overlying second semiconductor regions, each of the second semiconductor regions being adjacent a first semiconductor region, forming a plurality of heavily-doped regions in said face each adjacent one of said second semiconductor regions, applying a third layer of conductive material on said face contacting a plurality of said heavily-doped regions, and applying a metal layer to said face to define a plurality of elongated strips overlying the first and second regions and making contact to the heavily-doped regions via said third layer.

Claim 11

A method of making a semiconductor device comprising the steps of: applying a first layer of conductive material over a face of a semiconductor body to form electrodes overlying first semiconductor regions, applying a second layer of conductive material on said face partially overlying the first layer and also overlying second semiconductor regions, each of the second semiconductor regions being adjacent a first semiconductor region, forming a plurality of heavily-doped regions in said face each adjacent one of said second semiconductor regions, applying a third layer of conductive material on said face contacting a plurality of said heavily-doped regions, and applying a metal layer to said face to define a plurality of elongated strips overlying the first and second regions and making contact to the heavily-doped regions via said third layer.

Claim 15

A method of making an array of rows and columns of dynamic memory cells comprising the steps of: forming a field insulator coating on a face of a semiconductor body surrounding a plurality of elongated cell areas on said face, said elongated cell areas extending parallel with said columns, applying a first layer of conductive material onto said face patterned to cover capacitor regions of the face at the opposite ends of each of said cell areas, said first layer being insulated from the face by a capacitor dielectric, applying a second layer of conductive material onto said face patterned to form a plurality of elongated row lines extending across said cell areas perpendicular to said columns and over said field insulator, row lines providing transistor gates above channel regions of the face in the cell areas between a central part of each cell area and said opposite ends, said second layer being insulated from the first layer by a insulative coating, applying a third layer of conductive material onto said face patterned to form a plurality of column lines extending across said cell areas and over said first and second layers but insulated therefrom, each of such column lines making electrical connection to said central parts of a plurality of said cell areas in a column.

Claim 16

A method of making an array of rows and columns of dynamic memory cells comprising the steps of: forming a field insulator coating on a face of a semiconductor body surrounding a plurality of elongated cell areas on said face, said elongated cell areas extending parallel with said columns, applying a first layer of conductive material onto said face patterned to cover capacitor regions of the face at the opposite ends of each of said cell areas, said first layer being insulated from the face by a capacitor dielectric, applying a second layer of conductive material onto said face patterned to form a plurality of elongated row lines extending across said cell areas perpendicular to said columns and over said field insulator, row lines providing transistor gates above channel regions of the face in the cell areas between a central part of each cell area and said opposite ends, said second layer being insulated from the first layer by a insulative coating, applying a third layer of conductive material onto said face patterned to form a plurality of column lines extending across said cell areas and over said first and second layers but insulated therefrom, each of such column lines making electrical connection to said central parts of a plurality of said cell areas in a column.