Method of making self-aligned metal gate field effect transistors

Claim 2

In a process for making a semiconductor device, the steps of: (a) forming an opaque electrode on a first portion of a first major surface of a transparent semiconductor layer; (b) oxidizing the semiconductor layer to a limited depth at a second, complementary portion of the major surface of the semiconductor layer; (c) bonding said electrode onto a thin metal pad located on a major surface of a transparent insulating body; and (d) directing optical radiation, through both the insulating body and the oxidized portions of the semiconductor layer, to a positive photoresist layer located on a second opposed major surface of said semiconductor layer.

Claim 3

A process for fabricating semiconductor apparatus including a metal gate field effect transistor device comprising the steps of: (a) successively growing first and second epitaxial layers of semiconductor on a major surface of a base, the second layer characterized by a higher electrical conductivity than that of the first; (b) forming a pair of spaced apart opaque electrodes on a pair of separate first portions of the exposed major surface of the second epitaxial layer; (c) oxidizing the second epitaxial layer at second, complementary portions, whereby a source region and a drain region remain in the second epitaxial layer each contiguous with a different one of the separate first portions; (d) attaching said electrodes to bonding pads on a transparent, insulating, rigid body; (e) removing said base to expose a major surface of the first epitaxial layer; (f) directing a beam of ultraviolet optical radiation through both the rigid body, the said oxidized portions of the second epitaxial layer, and the first epitaxial layer onto a radiation sensitive layer on the exposed major surface of said first epitaxial layer; (g) removing those regions of the radiation sensitive layer upon which the optical beam was incident, thereby exposing the corresponding regions of first epitaxial layer; and (h) forming a gate electrode layer in Schottky barrier contact with said first epitaxial layer at the then exposed regions thereof.

Claim 4

A process for fabricating semiconductor apparatus including a metal gate field effect transistor device comprising the steps of: (a) successively growing first and second epitaxial layers of semiconductor on a major surface of a base, the second layer characterized by a higher electrical conductivity than that of the first; (b) forming a pair of spaced apart opaque electrodes on a pair of separate first portions of the exposed major surface of the second epitaxial layer; (c) oxidizing the second epitaxial layer at second, complementary portions, whereby a source region and a drain region remain in the second epitaxial layer each contiguous with a different one of the separate first portions; (d) attaching said electrodes to bonding pads on a transparent, insulating, rigid body; (e) removing said base to expose a major surface of the first epitaxial layer; (f) directing a beam of ultraviolet optical radiation through both the rigid body, the said oxidized portions of the second epitaxial layer, and the first epitaxial layer onto a radiation sensitive layer on the exposed major surface of said first epitaxial layer; (g) removing those regions of the radiation sensitive layer upon which the optical beam was incident, thereby exposing the corresponding regions of first epitaxial layer; and (h) forming a gate electrode layer in Schottky barrier contact with said first epitaxial layer at the then exposed regions thereof.

Claim 5

The process of claim 2 in which the base is essentially a relatively thin layer of aluminum gallium arsenide located on a major surface of a body of gallium arsenide.

Claim 6

The process of claim 3 in which the atomic fraction of aluminum in the thin layer is in the range of about 0.35 to 0.75.

Claim 7

The process of claim 3 in which the first and second layers are essentially gallium arsenide.