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Patent US4521476A successfully refreshed from Google Patents.
US4521476A
Expired / Lapsed
US
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Hybrid integrated circuit and preparation thereof
Assignee: Denka Co Ltd
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Filing: 1983-06-22
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Granted: 1985-06-04
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Expires: 2003-06-22
Abstract
Abstract A hybrid integrated circuit is prepared by laminating an aluminum-copper clad foil on an insulating layer, etching the aluminum-copper clad foil with etching agents to form an aluminum circuit and a copper circuit and connecting a semiconductor element to the aluminum circuit through an aluminum wire or a gold wire while connecting a circuit element to the copper circuit by soldering.
Inventors
- 👤 Shinichiro Asai
- 👤 Kazuo Katoh
- 👤 Tatsuo Nakano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 18:46
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K3/00; H05K3/22; H05K3/24; H05K3/243; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/67; H10W70/68; H10W70/6875; H10W90/00; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0338; H05K2201/0355; H05K2201/0388; H05K2201/0391; H05K2201/20; H05K2201/2081; H05K2203/00; H05K2203/03; H05K2203/0361; H05K2203/04; H05K2203/049; H05K3/02; H05K3/06; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754; H10W99/00; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/12736; Y10T428/1275; Y10T428/12771; Y10T428/12861; Y10T428/12903; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
112 words
A hybrid integrated circuit, comprising: an aluminum-copper clad foil on an insulating layer, wherein the upper metal foil of said aluminum-copper clad foil is etched into a predetermined circuit pattern by an etching agent which selectivity dissolves only the metal of said upper metal foil and then the lower metal foil is etched into a predetermined circuit pattern by an etching agent which selectivity dissolves only the metal of said lower metal foil, thereby forming a device having an aluminum circuit pattern and a copper circuit pattern, a semiconductor element connected to said aluminum circuit through an aluminum wire or a gold wire and a circuit element soldered to said copper circuit.
Claim 2
Dependent Claim
112 words
A hybrid integrated circuit, comprising: an aluminum-copper clad foil on an insulating layer, wherein the upper metal foil of said aluminum-copper clad foil is etched into a predetermined circuit pattern by an etching agent which selectivity dissolves only the metal of said upper metal foil and then the lower metal foil is etched into a predetermined circuit pattern by an etching agent which selectivity dissolves only the metal of said lower metal foil, thereby forming a device having an aluminum circuit pattern and a copper circuit pattern, a semiconductor element connected to said aluminum circuit through an aluminum wire or a gold wire and a circuit element soldered to said copper circuit.
Claim 3
Dependent Claim
18 words
The hybrid integrated circuit of claim 1, wherein said insulating layer is provided with a laminated metal substrate.
Claim 4
Dependent Claim
22 words
The hybrid integrated circuit of claim 1, wherein said copper foil of said aluminum-copper clad foil is attached to said insulating layer.
Claim 5
Dependent Claim
22 words
The hybrid integrated circuit of claim 1, wherein said aluminum foil of said aluminum-copper clad foil is attached to said insulating layer.
Claim 6
Dependent Claim
26 words
The hybrid integrated circuit of claim 1, wherein each of the laminated copper and aluminum foils has a thickness ranging from 0.1 μm to 100 μm.
Claim 7
Dependent Claim
32 words
The hybrid integrated circuit of claim 1, wherein said insulating layer is formed of an organic polymer selected from the group consisting of epoxy resins, phenol resins, silicone resins and polyimide resins.
Claim 8
Dependent Claim
28 words
The hybrid integrated circuit of claim 1, wherein said insulating layer is an inorganic material or a composite material formed from an inorganic material and an organic polymer.
References Cited (Backward Citations)
US3967371A
Cited
US3801388A
Cited
US3791858A
Cited
US3983284A
Cited
JPS5236502A
Cited
US4190474A
Cited
US4404059A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-06-03 | 1988-12-03 | 1989-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-06-03 | 1992-12-03 | 1993-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-06-03 | 1996-12-03 | 1997-06-04 | $7700.00 | Window Closed / Lapsed |