US4514751A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compressively stresses titanium metallurgy for contacting passivated semiconductor devices
Assignee: International Business Machines Corp
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Filing: 1982-12-23
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Granted: 1985-04-30
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Expires: 2002-12-23
Abstract
Abstract Contact metallurgy is disclosed for passivated semiconductor devices. The metallurgy comprises a compressively stressed, oxygen-containing titanium underlayer covered by a solder-bondable layer extending through via holes in dielectric material on the semiconductor device. The solder bondable layer is either nickel or ruthenium, where lower current densities are encountered or a composite of layers of copper, titanium, copper and gold for higher current densities.
Inventors
- 👤 Somnath Bhattacharya
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 00:00
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/45; H10W20/48; B; B23; B23K; B23K35/00; B23K35/001; H10W72/00; H10W72/90; H10W72/20; H10W72/251; H10W72/29; H10W72/921; H10W72/923; H10W72/941; H10W72/942
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
83 words
Contact metallurgy for an integrated semiconductor substrate having circuit elements therein, comprising: a dielectric coating on said substrate having an aperture therethrough for electrical connection to a said element in said substrate; a contact pad comprising a first layer of compressively stressed titanium covering said aperture and having peripheral portions extending on and bonded to said coating externally of said aperture, with said titanium having oxygen dispersed therein, and a second layer of solder bondable contact metallurgy concentrically formed on said first layer.
Claim 2
Dependent Claim
83 words
Contact metallurgy for an integrated semiconductor substrate having circuit elements therein, comprising: a dielectric coating on said substrate having an aperture therethrough for electrical connection to a said element in said substrate; a contact pad comprising a first layer of compressively stressed titanium covering said aperture and having peripheral portions extending on and bonded to said coating externally of said aperture, with said titanium having oxygen dispersed therein, and a second layer of solder bondable contact metallurgy concentrically formed on said first layer.
Claim 3
Dependent Claim
20 words
The structure of claim 1 wherein the thickness of said titanium is in the range of 2 to 20K angstroms.
Claim 4
Dependent Claim
12 words
The structure of claim 1 including a solder mound on said pad.
Claim 5
Dependent Claim
21 words
The structure of claim 1 wherein said coating is selected from the group of glass, quartz, silicon dioxide and polymide compositions.
Claim 6
Dependent Claim
18 words
The structure of claim 1 wherein said second layer comprises sequential films of copper, titanium, copper and gold.
Claim 7
Dependent Claim
12 words
The structure of claim 5 including a solder mound on said pad.
Claim 8
Dependent Claim
23 words
The structure of claim 5 wherein the thicknesses of said films are in the ranges of 10K-30K, 2K-5K, 1K-3K and 1K angstroms, respectively.
Claim 9
Dependent Claim
16 words
The structure of claim 1 wherein said second layer comprises a layer of nickel or ruthenium.
Claim 10
Dependent Claim
12 words
The structure of claim 8 including a solder mound on said pad.
Claim 11
Dependent Claim
21 words
The structure of claim 8 wherein the thickness of said second layer is in the range of 2-5K angstroms of ruthenium.
Claim 12
Dependent Claim
44 words
The structure of claim 1 wherein the oxygen is dispersed in said compressively stressed titanium by evaporation in an oxygen-containing ambient at a partial pressure between 5×10 -5 and 5×10 -6 Torr at a temperature in the range of 100° C. to 300° C.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-04-29 | 1988-10-29 | 1989-04-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-04-29 | 1992-10-29 | 1993-04-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-04-29 | 1996-10-29 | 1997-04-30 | $7700.00 | Window Closed / Lapsed |