Patent US4511601A successfully refreshed from Google Patents.
US4511601A
Expired / Lapsed
US
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Copper metallization for dielectric materials
Assignee: Philips North America LLC
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Filing: 1983-05-13
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Granted: 1985-04-16
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Expires: 2003-05-13
Abstract
Abstract A method of providing a copper metallization on a dielectric or semiconductive body, and a dielectric or semiconductive body having a metallization consisting essentially of copper. According to the method, a mixture of copper oxide powder and 0 to 15 weight percent reduction-resistant glass frit is dispersed in an organic vehicle and a solvent to produce a paste. The paste is applied to the body to provide a coating thereon. The coating is dried to remove the solvent, and then the coated body is fired in an oxidizing atmosphere at a temperature below the melting temperature of the glass frit to remove the organic vehicle. Finally, the coated body is fired a second time in an atmosphere which is reducing to the copper oxide but substantially nonreducing to the glass frit. The second firing is at a temperature from 700° to 1050° C. for from 120 to 15 minutes to convert the copper oxide to copper metal. The metallized body may comprise a reduction-resistant dielectric body and a metallization consisting essentially of copper, with no glass frit.
Inventors
- 👤 James R. Akse
- 👤 Stanley A. Long
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 15:41
CPC Classifications
H; H01; H01G; H01G4/00; H01G4/002; H01G4/228; H01G4/232; H01G4/2325; C; C04; C04B; C04B41/00; C04B41/45; C04B41/50; C04B41/51; C04B41/5127; C04B41/5183; H01B; H01B1/00; H01B1/14; H01B1/16; H05; H05K; H05K1/00; H05K1/02; H05K1/09; H05K1/092
Claims Analysis
Total Claims: 29
Claim 1
Independent Claim
200 words
A method for providing a copper metallization on a dielectric or semiconductive body, said method consisting essentially of the steps of: providing copper oxide powder; providing a reduction-resistant glass frit having a melting temperature; mixing the copper oxide powder and the glass frit to produce a mixture having at most 15 weight percent glass frit; dispersing the mixture in an organic vehicle and a solvent for the organic vehicle to produce a paste; applying the paste to the body to provide a coating thereon; drying the coating to remove the solvent; firing the coated body a first time in an oxidizing atmosphere at a temperature below the melting temperature of the glass frit to remove at least a portion of the organic vehicle, said first firing producing substantially no adhesion between the paste and the body; and firing the coated body a second time after the first firing, the second firing being in an atmosphere which is reducing to the copper oxide, said second firing being at a temperature from 700° to 1050° C. for from 120 to 15 minutes to convert the copper oxide to copper metal and to form a bond between the copper metal and the body.
Claim 2
Independent Claim
200 words
A method for providing a copper metallization on a dielectric or semiconductive body, said method consisting essentially of the steps of: providing copper oxide powder; providing a reduction-resistant glass frit having a melting temperature; mixing the copper oxide powder and the glass frit to produce a mixture having at most 15 weight percent glass frit; dispersing the mixture in an organic vehicle and a solvent for the organic vehicle to produce a paste; applying the paste to the body to provide a coating thereon; drying the coating to remove the solvent; firing the coated body a first time in an oxidizing atmosphere at a temperature below the melting temperature of the glass frit to remove at least a portion of the organic vehicle, said first firing producing substantially no adhesion between the paste and the body; and firing the coated body a second time after the first firing, the second firing being in an atmosphere which is reducing to the copper oxide, said second firing being at a temperature from 700° to 1050° C. for from 120 to 15 minutes to convert the copper oxide to copper metal and to form a bond between the copper metal and the body.
Claim 3
Dependent Claim
19 words
A method as claimed in claim 1, characterized in that the body is a ceramic having a perovskite structure.
Claim 4
Dependent Claim
15 words
A method as claimed in claim 2, characterized in that the body comprises barium titanate.
Claim 5
Dependent Claim
23 words
A method as claimed in claim 3, characterized in that the first firing is at a temperature of from 200° to 450° C.
Claim 6
Dependent Claim
29 words
A method as claimed in claim 4, characterized in that in the second firing step the partial oxygen pressure of the firing atmosphere is less than 9.5×10 -6 atmospheres.
Claim 7
Dependent Claim
20 words
A method as claimed in claim 5, characterized in that the powder and the frit particles are subsieve minus 325.
Claim 8
Dependent Claim
22 words
A method as claimed in claim 6, characterized in that the glass frit consists essentially of oxides of barium, boron, and aluminium.
Claim 9
Dependent Claim
22 words
A method as claimed in claim 6, characterized in that the glass frit consists essentially of oxides of sodium, boron, and silicon.
Claim 10
Dependent Claim
22 words
A method as claimed in claim 6, characterized in that the glass frit consists essentially of oxides of lead, boron, and silicon.
Claim 11
Dependent Claim
34 words
A method as claimed in claim 6, characterized in that the second firing is in an atmosphere which is substantially nonreducing to the glass frit, at least for the duration of the second firing.
Claim 12
Independent Claim
164 words
A method of providing a copper metallization on a dielectric or semiconductive body, said method consisting essentially of the steps of: providing a powder consisting essentially of copper oxide; dispersing the copper oxide powder in an organic vehicle and a solvent for the organic vehicle to produce a paste; applying the paste to the body to provide a coating thereon; drying the coating to remove the solvent; firing the coated body a first time, said first firing being in an oxidizing atmosphere to remove the organic vehicle, said first firing producing substantially no adhesion between the paste and the body; and firing the coated body a second time after the first firing, the second firing being in an atmosphere which is reducing to the copper oxide, said second firing being at a temperature from 700° to 1050° C. for from 120 to 15 minutes to convert the copper oxide to copper metal and to form a bond between the copper metal and the body.
Claim 13
Independent Claim
164 words
A method of providing a copper metallization on a dielectric or semiconductive body, said method consisting essentially of the steps of: providing a powder consisting essentially of copper oxide; dispersing the copper oxide powder in an organic vehicle and a solvent for the organic vehicle to produce a paste; applying the paste to the body to provide a coating thereon; drying the coating to remove the solvent; firing the coated body a first time, said first firing being in an oxidizing atmosphere to remove the organic vehicle, said first firing producing substantially no adhesion between the paste and the body; and firing the coated body a second time after the first firing, the second firing being in an atmosphere which is reducing to the copper oxide, said second firing being at a temperature from 700° to 1050° C. for from 120 to 15 minutes to convert the copper oxide to copper metal and to form a bond between the copper metal and the body.
Claim 14
Dependent Claim
19 words
A method as claimed in claim 11, characterized in that the body is a ceramic having a perovskite structure.
Claim 15
Dependent Claim
15 words
A method as claimed in claim 12, characterized in that the body comprises barium titanate.
Claim 16
Dependent Claim
23 words
A method as claimed in claim 13, characterized in that the first firing is at a temperature of from 200° to 450° C.
Claim 17
Dependent Claim
29 words
A method as claimed in claim 14, characterized in that in the second firing step the partial oxygen pressure of the firing atmosphere is less than 9.5×10 -6 atmospheres.
Claim 18
Dependent Claim
16 words
A method as claimed in claim 15, characterized in that the powder is subsieve minus 325.
Claim 19
Independent Claim
233 words
A method of providing a copper metallization on a base metal electrode mulitlayer capacitor, said method consisting essentially of the steps of: providing a multilayer capacitor consisting essentially of alternate layers of a reduction-resistant dielectric and a base metal electrode; providing copper oxide powder; providing a reduction-resistant glass frit having a melting temperature; mixing the copper oxide powder and the glass frit to produce a mixture having, 0-15 weight percent glass frit; dispersing the mixture in an organic vehicle and a solvent for the organic vehicle to produce a paste; applying the paste to the capacitor to provide a coating thereon; drying the coating to remove the solvent; firing the coated capacitor a first time in an oxidizing atmosphere at a temperature below the melting temperature of the glass frit to remove the organic vehicle, said first firing producing substantially no adhesion between the paste and the body, the temperature of the first firing being in a range where there is no substantial oxidation of the base metal electrodes; and firing the coated capacitor a second time after the first firing, the second firing being in an atmosphere which is reducing to the copper oxide, said second firing being at a temperature from 700° to 1050° C. for from 120 to 15 minutes to convert the copper oxide to copper metal and to form a bond between the copper metal and the body.
Claim 20
Independent Claim
233 words
A method of providing a copper metallization on a base metal electrode mulitlayer capacitor, said method consisting essentially of the steps of: providing a multilayer capacitor consisting essentially of alternate layers of a reduction-resistant dielectric and a base metal electrode; providing copper oxide powder; providing a reduction-resistant glass frit having a melting temperature; mixing the copper oxide powder and the glass frit to produce a mixture having, 0-15 weight percent glass frit; dispersing the mixture in an organic vehicle and a solvent for the organic vehicle to produce a paste; applying the paste to the capacitor to provide a coating thereon; drying the coating to remove the solvent; firing the coated capacitor a first time in an oxidizing atmosphere at a temperature below the melting temperature of the glass frit to remove the organic vehicle, said first firing producing substantially no adhesion between the paste and the body, the temperature of the first firing being in a range where there is no substantial oxidation of the base metal electrodes; and firing the coated capacitor a second time after the first firing, the second firing being in an atmosphere which is reducing to the copper oxide, said second firing being at a temperature from 700° to 1050° C. for from 120 to 15 minutes to convert the copper oxide to copper metal and to form a bond between the copper metal and the body.
Claim 21
Dependent Claim
19 words
A method as claimed in claim 17, characterized in that the dielectric is a ceramic having a perovskite structure.
Claim 22
Dependent Claim
15 words
A method as claimed in claim 18, characterized in that the dielectric comprises barium titanate.
Claim 23
Dependent Claim
23 words
A method as claimed in claim 19, characterized in that the first firing is at a temperature of from 200° to 450° C.
Claim 24
Dependent Claim
29 words
A method as claimed in claim 20, characterized in that in the second firing step the partial oxygen pressure of the firing atmosphere is less than 9.5×10 6 atmospheres.
Claim 25
Dependent Claim
20 words
A method as claimed in claim 21, characterized in that the powder and the frit particles are subsieve minus 325.
Claim 26
Dependent Claim
34 words
A method as claimed in claim 22, characterized in that the second firing is in an atmosphere which is substantially nonreducing to the glass frit, at least for the duration of the second firing.
Claim 27
Dependent Claim
22 words
A method as claimed in claim 22, characterized in that the glass frit consists essentially of oxides of barium, boron, and aluminum.
Claim 28
Dependent Claim
22 words
A method as claimed in claim 22, characterized in that the glass frit consists essentially of oxides of sodium, boron, and silicon.
Claim 29
Dependent Claim
22 words
A method as claimed in claim 22, characterized in that the glass frit consists essentially of oxides of lead, boron, and silicon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-04-15 | 1988-10-15 | 1989-04-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-04-15 | 1992-10-15 | 1993-04-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-04-15 | 1996-10-15 | 1997-04-16 | $7700.00 | Window Closed / Lapsed |