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US4472206A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of activating implanted impurities in broad area compound semiconductors by short time contact annealing

Assignee: International Business Machines Corp
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Filing: 1982-11-10
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Granted: 1984-09-18
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Expires: 2002-11-10
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Abstract

Abstract Ion implanted impurity activation in a multi-element compound semiconductor crystal such as gallium arsenide, GaAs, over a broad integrated circuit device area, is accomplished using a short time anneal, in the proximity of a uniform concentration of the most volatile element of said crystal, in solid form, over the broad integrated circuit device area surface. A GaAs integrated circuit wafer having ion implanted impurities in the surface for an integrated circuit is annealed in the vicinity of 800°-900° C. for a time of the order of 1-20 seconds in the proximity of a uniform layer of solid arsenic.

Inventors

  • 👤 Rodney T. Hodgson
  • 👤 Thomas N. Jackson
  • 👤 Hans S. Rupprecht
  • 👤 Jerry M. Woodall

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 06:19
CPC Classifications
H; H10; H10P; H10P30/00; H10P30/20; H10P30/21; H10P14/00; H10P14/60; H10P30/202; H10P30/206; H10P30/28; H10P95/00; H10P95/90; H10P95/904

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 84 words
In the formation of an array of semiconductor devices involving regions of specific semiconductor properties imparted by activated implanted ions in a surfaces area of an annealed ion implanted multielement compound semiconductor crystal the improvement for uniform activation of said implanted ions over said surface area comprising maintaining a specific quantity of the most volatile element of said multielement compound in solid evenly distributed over and in contact with said surface area, while, heating and then cooling said crystal in a short time cycle.
Claim 2
Dependent Claim 84 words
In the formation of an array of semiconductor devices involving regions of specific semiconductor properties imparted by activated implanted ions in a surfaces area of an annealed ion implanted multielement compound semiconductor crystal the improvement for uniform activation of said implanted ions over said surface area comprising maintaining a specific quantity of the most volatile element of said multielement compound in solid evenly distributed over and in contact with said surface area, while, heating and then cooling said crystal in a short time cycle.
Claim 3
Dependent Claim 29 words
The improvement of claim 1 wherein said heating is in the 800° to 900° C. range and said time cycle is a period of from 1 to 20 seconds.
Claim 4
Dependent Claim 29 words
The improvement of claim 2 wherein said crystal is GaAs and said specific quantity of said most volatile element is a layer of arsenic on a GaAs wafer backing.
Claim 5
Dependent Claim 65 words
The process of broad area uniform ion implantation activation in a multielement compound semiconductor crystal comprising the steps of: ion implanting semiconductor conductivity determining impurities into said crystal through a device area surface, providing a specific quantity of the most volatile element of said multielement compound in solid form uniformly distributed over and in contact with said surface, while applying a short annealing temperature cycle.
Claim 6
Dependent Claim 65 words
The process of broad area uniform ion implantation activation in a multielement compound semiconductor crystal comprising the steps of: ion implanting semiconductor conductivity determining impurities into said crystal through a device area surface, providing a specific quantity of the most volatile element of said multielement compound in solid form uniformly distributed over and in contact with said surface, while applying a short annealing temperature cycle.
Claim 7
Dependent Claim 19 words
The process of claim 4 wherein said semiconductor is a member of the group of GaAs, InP and GaAlAs.
Claim 8
Dependent Claim 29 words
The process of claim 5 wherein said semiconductor is GaAs and said specific quantity of the most volatile element is a layer of As with a GaAs wafer backing.
Claim 9
Dependent Claim 36 words
The process of claim 6 wherein said implanted impurities are Si Ions implanted to a depth of 100 Å to 2000 Å and said annealing cycle is 800° to 900° C. for 1 to 20 seconds.
Claim 10
Dependent Claim 76 words
The process of broad area uniform ion implantation activation in a multielement compound semiconductor crystal comprising the steps of: implanting semiconductor conductivity determining impurities through a device area surface of said crystal, placing a layer of the most volatile element of said crystal in contact with said surface of said crystal, annealing during a short temperature cycle the combination of said layer and said crystal, while confining the vaporization product of said layer to said surface.
Claim 11
Dependent Claim 76 words
The process of broad area uniform ion implantation activation in a multielement compound semiconductor crystal comprising the steps of: implanting semiconductor conductivity determining impurities through a device area surface of said crystal, placing a layer of the most volatile element of said crystal in contact with said surface of said crystal, annealing during a short temperature cycle the combination of said layer and said crystal, while confining the vaporization product of said layer to said surface.
Claim 12
Dependent Claim 14 words
The process of claim 8 wherein said implantation step is performed through said layer.
Claim 13
Dependent Claim 20 words
The process of claim 8 wherein said crystal as GaAs and said layer is As confined by a GaAs backing.
Claim 14
Dependent Claim 15 words
The process of claim 9 wherein said crystal is GaAs confined by a GaAs backing.

References Cited (Backward Citations)

US3969164A Cited
JPS5273673A Cited
US4174982A Cited
US4135952A Cited
US4226667A Cited
JPS55158628A Cited
US4312681A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-09-18 1988-03-19 1988-09-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-09-18 1992-03-19 1992-09-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-09-18 1996-03-19 1996-09-18 $7700.00 Window Closed / Lapsed

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