US4454014A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Etched article
Assignee: Unisys Corp
•
Filing: 1983-01-03
•
Granted: 1984-06-12
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Expires: 2003-01-03
Abstract
Abstract A method for fabricating a metallic pattern on a substrate is disclosed. The method consists of depositing an adhesive and/or plating base material on a substrate upon which a narrow self-supporting border of photoresist is applied. An anodic layer is then deposited and the photoresist removed. The adhesive and plating base material is etched in those areas previously covered by the photoresist and fresh photoresist applied to encapsulate those areas of the anodic layer which form the final pattern of interest. The unwanted anodic material is then etched and the photoresist removed.
Inventors
- 👤 Peter G. Bischoff
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 00:01
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H01; H01F; H01F41/00; H01F41/32; H01F41/34; G; G11; G11B; G11B5/00; G11B5/127; G11B5/31; G11B5/3109; G11B5/3116; G11B5/3163; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0597; H05K3/10; H05K3/108; H05K3/38; H05K3/388; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12465
Claims Analysis
Total Claims: 63
Claim 1
Independent Claim
162 words
A method for fabricating a metallic pattern on a substrate comprising the steps of: a. depositing a first thin metallic layer on an inert substrate; b. depositing a very narrow self-supporting border of a given height of photoresist material on such metallic layer, said border outlining the configuration of a pattern of interest of a subsequent second metal to be deposited on said thin metallic layer, said subsequent second metal becoming anodic with said first metallic layer during its etching; c. depositing said second metal on said first metal, d. removing said self-supporting border of photoresist exposing said first thin metallic layer; e. removing said first thin metallic layer in those areas exposed in step d; f. depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the self-supporting border of photoresist to thus substantially encapsulate the second metal within the pattern of interest; and g. etching away all the anodic material not encapsulated.
Claim 2
Independent Claim
162 words
A method for fabricating a metallic pattern on a substrate comprising the steps of: a. depositing a first thin metallic layer on an inert substrate; b. depositing a very narrow self-supporting border of a given height of photoresist material on such metallic layer, said border outlining the configuration of a pattern of interest of a subsequent second metal to be deposited on said thin metallic layer, said subsequent second metal becoming anodic with said first metallic layer during its etching; c. depositing said second metal on said first metal, d. removing said self-supporting border of photoresist exposing said first thin metallic layer; e. removing said first thin metallic layer in those areas exposed in step d; f. depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the self-supporting border of photoresist to thus substantially encapsulate the second metal within the pattern of interest; and g. etching away all the anodic material not encapsulated.
Claim 3
Independent Claim
150 words
A method for fabricating a metallic pattern on a substrate comprising the steps of: a. depositing an adhesive and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate; b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of a pattern of interest of subsequent anodic material to be deposited on said cathodic material; c. depositing anodic material on said cathodic material; d. removing said self-supporting border of photoresist exposing said cathodic material; e. removing the cathodic material in those areas exposed in step d; f. depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the self-supporting border of photoresist to thus substantially encapsulate the anodic material within the pattern of interest; and g. etching away all the anodic material not encapsulated.
Claim 4
Independent Claim
150 words
A method for fabricating a metallic pattern on a substrate comprising the steps of: a. depositing an adhesive and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate; b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of a pattern of interest of subsequent anodic material to be deposited on said cathodic material; c. depositing anodic material on said cathodic material; d. removing said self-supporting border of photoresist exposing said cathodic material; e. removing the cathodic material in those areas exposed in step d; f. depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the self-supporting border of photoresist to thus substantially encapsulate the anodic material within the pattern of interest; and g. etching away all the anodic material not encapsulated.
Claim 5
Independent Claim
18 words
The method of claims 1 or 2 wherein the anodic material not encapsulated is removed by chemical etching.
Claim 6
Dependent Claim
28 words
The method of claim 1 wherein the first thin metallic layer is removed by back-sputter etching in those areas exposed by removal of the self-supporting border of photoresist.
Claim 7
Dependent Claim
28 words
The method of claim 1 wherein the first thin metallic layer is removed by in milling in those areas exposed by removal of the self-supporting border of photoresist.
Claim 8
Dependent Claim
30 words
The method of claim 2 wherein substantially all adhesive and plating base material is removed by back-sputter etching in those areas exposed by removal of the self-supporting border of photoresist.
Claim 9
Dependent Claim
30 words
The method of claim 2 wherein substantially all adhesive and plating base material is removed by ion milling in those areas exposed by removal of the self-supporting border of photoresist.
Claim 10
Dependent Claim
18 words
The methods of claims 1 or 2 wherein the anodic material comprises an alloy of nickel and iron.
Claim 11
Dependent Claim
17 words
A pole piece for a thin film head made by the method of claims 1 or 2.
Claim 12
Dependent Claim
15 words
The method of claim 1 wherein said second metal is electroplated on said first metal.
Claim 13
Dependent Claim
18 words
The method of claim 2 wherein said anodic material is electroplated on said adhesive and/or plating base material.
Claim 14
Dependent Claim
32 words
The method of claim 1 wherein said second metal is deposited upon said first metal to a height that is substantially no greater than the height of the self-supporting border of photoresist.
Claim 15
Dependent Claim
32 words
The method of claim 2 wherein said anodic material is deposited upon said cathodic material to a height that is substantially no greater than the height of the self-supporting border of photoresist.
Claim 16
Independent Claim
18 words
The method of claims 1 or 2 wherein said narrow area is approximately 0.1 to 0.2 mils wide.
Claim 17
Dependent Claim
121 words
A novel in-process pattern for a thin film transducer comprising: at least one first thin layer on a relatively non-etchable substrate; deposit of a second thin metal film on said first metal(s); this second metal being characterized in tending to become anodic with said first metallic layer(s) during etching; and deposit of photoresist adapted and located to substantially cover the pattern of interest and to substantially fill the regions previously occupied by a prescribed previously applied photoresist border down to the substrate, whereby to encapsulate the first metal substantially completely within the pattern of interest except for its contact area with the substrate; the second metal being etched-away where it is not so encapsulated; said photoresist being subject to subsequent removal.
Claim 18
Dependent Claim
121 words
A novel in-process pattern for a thin film transducer comprising: at least one first thin layer on a relatively non-etchable substrate; deposit of a second thin metal film on said first metal(s); this second metal being characterized in tending to become anodic with said first metallic layer(s) during etching; and deposit of photoresist adapted and located to substantially cover the pattern of interest and to substantially fill the regions previously occupied by a prescribed previously applied photoresist border down to the substrate, whereby to encapsulate the first metal substantially completely within the pattern of interest except for its contact area with the substrate; the second metal being etched-away where it is not so encapsulated; said photoresist being subject to subsequent removal.
Claim 19
Dependent Claim
33 words
The combination as recited in claim 15 wherein the first metallic layers comprise a layer of adhesion-metal applied on the substrate and a layer of plateable metal applied on the layer of adhesion-metal.
Claim 20
Dependent Claim
16 words
The combination as recited in claim 16 wherein the second metal is magnetic and relatively anodic.
Claim 21
Dependent Claim
19 words
The combination as recited in claim 17 wherein the second metal comprises a thin layer of magnetic ferrous metal.
Claim 22
Dependent Claim
33 words
The combination as recited in claim 18 wherein the "adhesion-metal" comprises a metal such as Cr, Ti, Ta, Wf, Ni, Van or Zr, apt for joining said ferrous metal firmly to the substrate.
Claim 23
Dependent Claim
45 words
The combination as recited in claim 19 wherein the substrate surface is comprised of a non-metal and the "plateable metal" layer comprises Au, Pt, Pd, Cu, Ni, Fe, and alloys thereof or like metal, and tends to be relatively more plateable than said adhesion metal.
Claim 24
Dependent Claim
25 words
The combination as recited in claim 20 wherein the substrate surface comprises glass or a similar non-metal and the second metal includes Ni and Fe.
Claim 25
Dependent Claim
30 words
The combination of claim 21 wherein the adhesion metal and plateable metal layer(s) have been "back-sputter etched" in those areas exposed by prior removal of a prescribed border of photoresist.
Claim 26
Dependent Claim
32 words
The combination of claim 19 wherein certain portions of the first metallic layer(s) have been removed by ion milling in those areas exposed by prior removal of a prescribed border of photoresist.
Claim 27
Dependent Claim
36 words
The combination of claim 23 wherein a prescribed locus of adhesion and plateable metal has been removed, down to the substrate, by back-sputter etching in areas exposed by prior removal of a prescribed border of photoresist.
Claim 28
Dependent Claim
33 words
The combination of claim 23 wherein a prescribed portion of adhesion and plateable metal has been removed by ion milling in certain areas exposed by prior removal of a prescribed border of photoresist.
Claim 29
Dependent Claim
23 words
The combination of claim 20 wherein the anodic material comprises an alloy of nickel and iron laid down in a very thin film.
Claim 30
Dependent Claim
16 words
The combination as in claim 26, configured as a pole piece for a thin film head.
Claim 31
Dependent Claim
15 words
The combination of claim 15 wherein said second metal is electroplated on said first metal.
Claim 32
Dependent Claim
17 words
The combination of claim 17 wherein said anodic material is electroplated on said adhesion and/or plateable material.
Claim 33
Dependent Claim
36 words
The combination of claim 17 wherein said anodic material is deposited upon said cathodic material to a height that is substantially no greater than the height of a prescribed border of photoresist present only during fabrication.
Claim 34
Dependent Claim
36 words
The combination of claim 15 wherein said second metal is deposited upon said first metal to a height that is substantially no greater than the height of a prescribed border of photoresist, present only during fabrication.
Claim 35
Dependent Claim
19 words
The combination of claims 30 or 31 wherein the transitory photoresist border is approximately 0.1 to 0.2 mils wide.
Claim 36
Independent Claim
178 words
A method for fabricating a pattern of a prescribed first metal on a substrate comprising the steps of: depositing at least one second thin metallic layer on a relatively non-etchable substrate; depositing a relatively narrow border of a given height of photoresist material on such metallic layer(s), said border outlining the configuration of a pattern of interest; depositing said first metal on said second metal(s); said subsequent first metal characterized in tending to become anodic with said second metallic layer during a later etching; removing said border of photoresist and thus exposing underlying portions of said second metallic layer(s); removing said second thin metallic layer(s) in those areas exposed as above down to said substrate; depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the border of photoresist down to the substrate, whereby to encapsulate the second metal substantially completely within the pattern of interest except for its contact area with the substrate; etching away at least the first metal which is not so encapsulated; and removing all photoresist.
Claim 37
Independent Claim
178 words
A method for fabricating a pattern of a prescribed first metal on a substrate comprising the steps of: depositing at least one second thin metallic layer on a relatively non-etchable substrate; depositing a relatively narrow border of a given height of photoresist material on such metallic layer(s), said border outlining the configuration of a pattern of interest; depositing said first metal on said second metal(s); said subsequent first metal characterized in tending to become anodic with said second metallic layer during a later etching; removing said border of photoresist and thus exposing underlying portions of said second metallic layer(s); removing said second thin metallic layer(s) in those areas exposed as above down to said substrate; depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the border of photoresist down to the substrate, whereby to encapsulate the second metal substantially completely within the pattern of interest except for its contact area with the substrate; etching away at least the first metal which is not so encapsulated; and removing all photoresist.
Claim 38
Dependent Claim
34 words
The combination as recited in claim 33 wherein the second metallic layers comprise a layer of adhesion metal applied on the substrate and a layer of plateable metal applied on the layer of adhesion-metal.
Claim 39
Dependent Claim
16 words
The combination as recited in claim 34 wherein the first metal is magnetic and relatively anodic.
Claim 40
Dependent Claim
19 words
The combination as recited in claim 35 wherein the first metal comprises a thin layer of magnetic ferrous metal.
Claim 41
Dependent Claim
34 words
The combination as recited in claim 36 wherein the adhesion metal comprises a metal such as Cr, Ti, Ta, Wf, Ni, Van or Zr apt for joining said ferrous metal firmly to the substrate.
Claim 42
Dependent Claim
48 words
The combination as recited in claim 37 wherein the substrate surface is comprised of a non-metal and the plateable metal is comprised of a layer of plateable metal like Au, Pt, Pd, Cu, Ni, Fe, or alloys thereof, tending to be relatively more plateable than said adhesion metal.
Claim 43
Dependent Claim
25 words
The combination as recited in claim 38 wherein the substrate surface comprises glass or a similar non-metal and the first metal includes Ni and Fe.
Claim 44
Dependent Claim
20 words
The combination as recited in claim 39 wherein the metal etching is done with FeCl 3 or a like etchant.
Claim 45
Dependent Claim
9 words
The product resulting from the method of claim 33.
Claim 46
Dependent Claim
9 words
The product resulting from the method of claim 40.
Claim 47
Independent Claim
172 words
A method for fabricating a thin magnetic ferrous metal layer pattern on a substrate comprising the steps of: depositing an adhesive and/or plating base material, which becomes cathodic during a subsequent etching process, upon a relatively non-etchable substrate surface; placing a border of a given height of photoresist material on such cathodic material, said border outlining the configuration of a pattern of interest of subsequent anodic material to be deposited on said cathodic material; depositing said relatively anodic magnetic ferrous material as a thin film on said cathodic material; removing said border of photoresist and thus exposing said cathodic material; removing all cathodic material in those areas underlying said border and exposed as above; depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the border of photoresist whereby to substantially encapsulate the anodic material and underlying cathodic material within the pattern of interest; etching away all the anodic and cathodic material not so encapsulated down to the substrate surface; and removing all photoresist.
Claim 48
Independent Claim
172 words
A method for fabricating a thin magnetic ferrous metal layer pattern on a substrate comprising the steps of: depositing an adhesive and/or plating base material, which becomes cathodic during a subsequent etching process, upon a relatively non-etchable substrate surface; placing a border of a given height of photoresist material on such cathodic material, said border outlining the configuration of a pattern of interest of subsequent anodic material to be deposited on said cathodic material; depositing said relatively anodic magnetic ferrous material as a thin film on said cathodic material; removing said border of photoresist and thus exposing said cathodic material; removing all cathodic material in those areas underlying said border and exposed as above; depositing photoresist to substantially cover the pattern of interest and to substantially fill the regions previously occupied by the border of photoresist whereby to substantially encapsulate the anodic material and underlying cathodic material within the pattern of interest; etching away all the anodic and cathodic material not so encapsulated down to the substrate surface; and removing all photoresist.
Claim 49
Dependent Claim
15 words
The method of claim 43 wherein the material not encapsulated is removed by chemical etching.
Claim 50
Dependent Claim
29 words
The method of claim 36 wherein the adhesion metal and plateable metal layer(s) are removed by back-sputter etching in those areas exposed by removal of the border of photoresist.
Claim 51
Dependent Claim
26 words
The method of claim 34 wherein the second metallic layer(s) are removed by ion milling in those areas exposed by removal of the border of photoresist.
Claim 52
Dependent Claim
35 words
The method of claim 41 or 34 wherein substantially all adhesion and plateable base material is removed, down to the substrate, by back-sputter etching in those areas exposed by removal of the border of photoresist.
Claim 53
Dependent Claim
31 words
The method of claim 41 or 34 wherein substantially all adhesion and plateable base material is removed by ion milling in those areas exposed by removal of the border of photoresist.
Claim 54
Dependent Claim
25 words
The methods of claims 33 or 41 wherein the anodic material comprises an alloy of nickel and iron laid down in a very thin film.
Claim 55
Dependent Claim
18 words
A pole piece for a thin film head fabricated according to the method of claims 34 or 41.
Claim 56
Dependent Claim
15 words
The method of claim 33 wherein said first metal is electroplated on said second metal.
Claim 57
Dependent Claim
18 words
The method of claim 41 whrein said anodic material is electroplated on said adhesion and/or plateable base material.
Claim 58
Dependent Claim
31 words
The method of claim 33 wherein said first metal is deposited upon said second metal to a height that is substantially no greater than the height of the border of photoresist.
Claim 59
Dependent Claim
31 words
The method of claim 41 wherein said anodic material is deposited upon said cathodic material to a height that is substantially no greater than the height of the border of photoresist.
Claim 60
Independent Claim
18 words
The method of claims 33 or 41 wherein the photoresist border is approximately 0.1 to 0.2 mils wide.
Claim 61
Dependent Claim
8 words
The product of the method of claim 43.
Claim 62
Dependent Claim
8 words
The product of the method of claim 49.
Claim 63
Dependent Claim
8 words
The product of the method of claim 55.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1987-06-12 | 1987-12-12 | 1988-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-06-12 | 1991-12-12 | 1992-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-06-12 | 1995-12-12 | 1996-06-12 | $7700.00 | Window Closed / Lapsed |