US3878007A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of depositing a pattern of metal plated areas on an insulating substrate
Assignee: RCA Corp
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Filing: 1973-06-06
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Granted: 1975-04-15
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Expires: 1993-06-06
Abstract
Abstract The method comprises depositing a thin layer of a first metal having a relatively high degree of solubility in a particular etchant on a substrate, this first metal being catalytic to electroless deposition of a second metal to be subsequently deposited, electrolessly depositing on the first metal a pattern of areas of a second metal which has a relatively low degree of solubility in the etchant, and then treating the plated areas with the etchant, so that the first metal is removed where it is not covered by the second metal but the second metal is substantially unaffected.
Inventors
- 👤 Nathan Feldstein
- 👤 Harold Bell Law
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 00:01
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/68; G03F1/72; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1633; C23C18/1689; H; H05; H05K; H05K3/00; H05K3/02; H05K3/06; H05K3/061; H05K3/062; H05K3/10; H05K3/108; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0344; H05K2203/00; H05K2203/05; H05K2203/0502; H05K2203/0542; H05K2203/07; H05K2203/0703; H05K2203/072; H05K3/18; H05K3/181; H05K3/22; H05K3/225
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
156 words
A METHOD OF DEPOSITING A PATTERN OF METAL PLATED AREAS ON AN INSULATING SUBSTRATE COMPRISING: DEPOSITING A RELATIVELY THIN LAYER OF A FIRST METAL HAVING A RELATIVELY HIGH DEGREE OF SOLUBILITY IN A PARTICULAR ETCHANT ON A SURFACE OF SAID SUBSTRATE, SAID FIRST METAL BEING CATALYTIC TO ELECTROLESS DEPOSITION OF A SECOND METAL TO BE SUBSEQUENTYL DEPOSITED, APPLYING A LAYER OF PHOTORESIST ON SAID FIRST METAL LAYER, EXPOSING AND DEVELOPING SAID PHOTORESIST TO REMOVE PORTIONS THEREOF SO AS TO DEFINE A DESIRED PATTERN ON THE SURFACE OF SAID FIRST METAL LAYER, ELECTROLESSLY DEPOSITING ON SAID DEFINED SURFACE AREAS OF SAID FIRSST METAL LAYER, A RELATIVELY THICK LAYER OF SAID SECOND METAL, SAID SECOND METAL HAVING RELATIVELY LOW DEGREE OF SOLUBILITY IN SAID ETCHANT, REMOVING THE REMAINING PORTIONS OF SAID PHOTORESIST, AND TREATING THE ENTIRE SURFACE TO BE PATTERNED WITH SAID ETCHANT TO REMOVE ONLY THOSE AREAS OF SAID FIRST METAL NOT COVERED WITH SAID SECOND METAL.
Claim 2
Independent Claim
156 words
A METHOD OF DEPOSITING A PATTERN OF METAL PLATED AREAS ON AN INSULATING SUBSTRATE COMPRISING: DEPOSITING A RELATIVELY THIN LAYER OF A FIRST METAL HAVING A RELATIVELY HIGH DEGREE OF SOLUBILITY IN A PARTICULAR ETCHANT ON A SURFACE OF SAID SUBSTRATE, SAID FIRST METAL BEING CATALYTIC TO ELECTROLESS DEPOSITION OF A SECOND METAL TO BE SUBSEQUENTYL DEPOSITED, APPLYING A LAYER OF PHOTORESIST ON SAID FIRST METAL LAYER, EXPOSING AND DEVELOPING SAID PHOTORESIST TO REMOVE PORTIONS THEREOF SO AS TO DEFINE A DESIRED PATTERN ON THE SURFACE OF SAID FIRST METAL LAYER, ELECTROLESSLY DEPOSITING ON SAID DEFINED SURFACE AREAS OF SAID FIRSST METAL LAYER, A RELATIVELY THICK LAYER OF SAID SECOND METAL, SAID SECOND METAL HAVING RELATIVELY LOW DEGREE OF SOLUBILITY IN SAID ETCHANT, REMOVING THE REMAINING PORTIONS OF SAID PHOTORESIST, AND TREATING THE ENTIRE SURFACE TO BE PATTERNED WITH SAID ETCHANT TO REMOVE ONLY THOSE AREAS OF SAID FIRST METAL NOT COVERED WITH SAID SECOND METAL.
Claim 3
Dependent Claim
20 words
A method according to claim 1 in which said layer of first metal is less than about 500 A thick.
Claim 4
Dependent Claim
23 words
A method according to claim 2 in which the total thickness of said first and second metals is at least about 1,500 A.
Claim 5
Dependent Claim
23 words
A method according to claim 1 in which sAid substrate is sensitized and activated and said first layer of metal is deposited electrolessly.
Claim 6
Dependent Claim
23 words
A method according to claim 1 in which said first metal is a nickel-boron alloy and said second metal is a nickel-phosphorus alloy.
Claim 7
Dependent Claim
40 words
A method according to claim 1 in which said layer of first metal is composed of a nickel or cobalt alloy having less than about 5% phosphorus and said second metal is a high-phosphorus content alloy of nickel or cobalt.
Claim 8
Dependent Claim
22 words
A method according to claim 1 in which said substrate is glass and said first and second metals are different nickel alloys.
Claim 9
Dependent Claim
18 words
A method according to claim 7 in which said etchant is a dilute aqueous solution of hydrochloric acid.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-04-14 | 1978-10-14 | 1979-04-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-04-14 | 1982-10-14 | 1983-04-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-04-14 | 1986-10-14 | 1987-04-15 | $7700.00 | Window Closed / Lapsed |