Method of repairing or depositing a pattern of metal plated areas on an insulating substrate
Abstract
Abstract The method comprises depositing a thin layer of a first metal having a relatively high degree of solubility in a particular etchant over both plated areas (if a previously deposited pattern is being repaired) and unplated areas on a substrate, this first metal being catalytic to electroless deposition of a second metal to be subsequently deposited, electrolessly depositing on the first metal either an overall pattern of areas of a second metal which has a relatively low degree of solubility in the etchant or a pattern limited to parts of a previously deposited pattern that were missing or incompletely formed, and then treating the plated areas with the etchant, where desired, so that the first metal is removed where it is not covered by the second metal but the second metal is substantially unaffected.
Inventors
- 👤 N Feldstein
- 👤 H Law
Bibliographic Details
Claims Analysis
Total Claims: 3References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-08-20 | 1977-02-19 | 1977-08-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-08-20 | 1981-02-19 | 1981-08-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-08-20 | 1985-02-19 | 1985-08-21 | $7700.00 | Window Closed / Lapsed |