US3853715A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Elimination of undercut in an anodically active metal during chemical etching
Assignee: International Business Machines Corp
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Filing: 1973-12-20
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Granted: 1974-12-10
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Expires: 1993-12-20
Abstract
Abstract The preparation of a discrete and well-defined pattern of metal or alloy of uniform thickness and composition of magnetic properties by plating the alloy or metal onto a conductive surface which contains narrow photoresist frames outlining the outer edges of the pattern.
Inventors
- 👤 L Romankiw
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 01:44
CPC Classifications
C; C25; C25D; C25D1/00; C25D1/003; C25D5/00; C25D5/02; C25D5/022; C25D7/00; C25D7/001; H; H01; H01F; H01F41/00; H01F41/32; H01F41/34; H05; H05K; H05K3/00; H05K3/10; H05K3/108; H05K2203/00; H05K2203/05; H05K2203/0562; H05K2203/0574; H05K2203/0597; H05K3/02; H05K3/06; H05K3/061; H05K3/064; H05K3/38; H05K3/388
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
110 words
A METHOD FOR FABRICATING A METALLIC PATTERN ON A SUBSTRATE COMPRISING THE STEPS OF A. DEPOSITING A FIRST THIN METALLIC LAYER ON AN INERT SUBSTRATE, B. PLACING A VERY NARROW SELF-SUPPORTING BORDER OF A GIVEN HIGHT OF PHTORESIST MATERIAL ON SUCH METALLIC LAYER, SAID BORDER OUTLINING THE CONFIGURATION OF SUBSEQUENT SECOND METAL TO BE DEPOSITED ON SAID THIN METALLIC LAYER, SAID SUBSEQUENT SECOND METAL BECOMING ANODIC WITH SAID FIRST METALLIC LAYER DURING ITS ETCHING, C. DEPOSITING SAID SECOND METAL ON SAID FIRST METAL, D. DEPOSITING A PHOTORESIST LAYER ONLY OVER SAID ANODIC MATERIAL THAT FORMS THE PATTERN OF INTEREST, AND E. CHEMICALLY ETCHING AWAY ALL THE ANODIC MATERIAL NOT ENCAPSULATED.
Claim 2
Independent Claim
110 words
A METHOD FOR FABRICATING A METALLIC PATTERN ON A SUBSTRATE COMPRISING THE STEPS OF A. DEPOSITING A FIRST THIN METALLIC LAYER ON AN INERT SUBSTRATE, B. PLACING A VERY NARROW SELF-SUPPORTING BORDER OF A GIVEN HIGHT OF PHTORESIST MATERIAL ON SUCH METALLIC LAYER, SAID BORDER OUTLINING THE CONFIGURATION OF SUBSEQUENT SECOND METAL TO BE DEPOSITED ON SAID THIN METALLIC LAYER, SAID SUBSEQUENT SECOND METAL BECOMING ANODIC WITH SAID FIRST METALLIC LAYER DURING ITS ETCHING, C. DEPOSITING SAID SECOND METAL ON SAID FIRST METAL, D. DEPOSITING A PHOTORESIST LAYER ONLY OVER SAID ANODIC MATERIAL THAT FORMS THE PATTERN OF INTEREST, AND E. CHEMICALLY ETCHING AWAY ALL THE ANODIC MATERIAL NOT ENCAPSULATED.
Claim 3
Independent Claim
139 words
A method for fabricating a metallic pattern on a substrate comprising the steps of a. depositing an adhesion and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate, b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of subsequent anodic material to be deposited on said cathodic material, c. electroplating anodic material on said cathodic material up to a height that is no greater than that of the photoresist material, d. depositing a photoresist layer only over said anodic material that forms the pattern of interests, said photoresist layer extendingto said border of photoresist material so as to encapsulate said anodic material that forms the pattern of interest, and e. chemically etching away all the anodic material not encapsulated.
Claim 4
Independent Claim
139 words
A method for fabricating a metallic pattern on a substrate comprising the steps of a. depositing an adhesion and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate, b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of subsequent anodic material to be deposited on said cathodic material, c. electroplating anodic material on said cathodic material up to a height that is no greater than that of the photoresist material, d. depositing a photoresist layer only over said anodic material that forms the pattern of interests, said photoresist layer extendingto said border of photoresist material so as to encapsulate said anodic material that forms the pattern of interest, and e. chemically etching away all the anodic material not encapsulated.
Claim 5
Dependent Claim
26 words
The method of claim 2 wherein said anodic material is a transition metal alloy from the family that includes Fe-Ni, Fe-Ni-Cr, Fe-Ni-W, Fe-Ni-Mo, Fe-Ni-Co, and Ni-Co.
Claim 6
Dependent Claim
23 words
The method of claim 1 wherein the said self-supporting border that outlines the desired pattern is as small as 0.5 Mu in width.
Claim 7
Dependent Claim
27 words
The method of claim 1 wherein the border width is less than 10 percent of the area of the anodic material that forms the pattern of interest.
Claim 8
Dependent Claim
26 words
The method of claim 1 wherein the border width is between 1-2 percent of the area of the anodic material that forms the pattern of interest.
Claim 9
Independent Claim
159 words
A method for fabricating a metallic pattern on a substrate comprising the steps of a. depositing an adhesion and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate, b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of subsequent anodic material to be deposited on said cathodic material, c. heating said photoresist for 1 to 2 minutes to seal said photoresist layers to one another, and d. electroplating anodic material on said cathodic material up to a height that is approximately equal to the height of the self-supporting border, e. depositing a photoresist layer only over said anodic material that forms the pattern of interest, said photoresist layer extending to said border of photoresist material so as to encapsulate said anodic material that forms the pattern of interest, and f. chemically etching away all the anodic material not encapsulated.
Claim 10
Independent Claim
159 words
A method for fabricating a metallic pattern on a substrate comprising the steps of a. depositing an adhesion and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate, b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of subsequent anodic material to be deposited on said cathodic material, c. heating said photoresist for 1 to 2 minutes to seal said photoresist layers to one another, and d. electroplating anodic material on said cathodic material up to a height that is approximately equal to the height of the self-supporting border, e. depositing a photoresist layer only over said anodic material that forms the pattern of interest, said photoresist layer extending to said border of photoresist material so as to encapsulate said anodic material that forms the pattern of interest, and f. chemically etching away all the anodic material not encapsulated.
Claim 11
Independent Claim
159 words
A method for fabricating a metallic pattern on a substrate comprising the steps of a. depositing an adhesion and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate, b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of subsequent anodic material to be deposited on said cathodic material, c. heating and photoresist for one to two minutes to seal said photoresist layers to one another, and d. electroplating anodic material on said cathodic material up to a height that is approximately equal to the height of the self-supporting border, e. depositing a photoresist layer only over said anodic material that forms the pattern of interest, said photoresist layer extending to said border of photoresist material so as to encapsulate said anodic material that forms the pattern of interest, and f. sputter etching away the adhesion and plating base layers.
Claim 12
Independent Claim
159 words
A method for fabricating a metallic pattern on a substrate comprising the steps of a. depositing an adhesion and/or plating base material which becomes cathodic during a subsequent etching process on an inert substrate, b. placing a very narrow self-supporting border of a given height of photoresist material on such cathodic material, said border outlining the configuration of subsequent anodic material to be deposited on said cathodic material, c. heating and photoresist for one to two minutes to seal said photoresist layers to one another, and d. electroplating anodic material on said cathodic material up to a height that is approximately equal to the height of the self-supporting border, e. depositing a photoresist layer only over said anodic material that forms the pattern of interest, said photoresist layer extending to said border of photoresist material so as to encapsulate said anodic material that forms the pattern of interest, and f. sputter etching away the adhesion and plating base layers.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-12-09 | 1978-06-10 | 1978-12-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-12-09 | 1982-06-10 | 1982-12-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-12-09 | 1986-06-10 | 1986-12-10 | $7700.00 | Window Closed / Lapsed |