Patent US4427478A successfully refreshed from Google Patents.
US4427478A
Expired / Lapsed
US
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Process for making an encapsulated circuit board and products made thereby
Assignee: International Business Machines Corp
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Filing: 1982-06-28
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Granted: 1984-01-24
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Expires: 2002-06-28
Abstract
Abstract A process is described for fabricating an encapsulated circuit board. The process involves use of an adhesive which is photochemically curable to a limited preselected depth so as to rigidly fix the circuit wires in X and Y directions while permitting limited pliability of the adhesive and hence mobility of the wires in the Z direction. The adhesive preferably is one which is also thermally curable so that at a later stage of fabrication (e.g., either as a part of or after lamination of individual circuit boards into a multilayered circuit board), the complete unit may be thermally bulk cured to rigidly fix all wires in the Z direction.
Inventors
- 👤 Barbara D. Grant
- 👤 Carol R. Jones
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 20:11
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/06; H05K3/00; H05K3/38; H05K3/386; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K3/10; H05K3/103; H05K3/46; H05K3/4611
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
93 words
In a process for making an encapsulated circuit board, the improvement which comprises the steps of: depositing on at least one side of a supporting substrate an adhesive which is photochemically curable; disposing a plurality of wires in preselected positions in said adhesive; and exposing the adhesive to light of limited intensity and duration for curing the adhesive to a preselected depth sufficient to maintain the wires registered in X and Y directions on the substrate, while permitting limited pliability of the adhesive and consequent mobility of the wires in the Z direction.
Claim 2
Dependent Claim
93 words
In a process for making an encapsulated circuit board, the improvement which comprises the steps of: depositing on at least one side of a supporting substrate an adhesive which is photochemically curable; disposing a plurality of wires in preselected positions in said adhesive; and exposing the adhesive to light of limited intensity and duration for curing the adhesive to a preselected depth sufficient to maintain the wires registered in X and Y directions on the substrate, while permitting limited pliability of the adhesive and consequent mobility of the wires in the Z direction.
Claim 3
Dependent Claim
25 words
In the process claimed in claim 1, the further step of laminating a plurality of such encapsulated circuit boards together to form a multi-layered structure.
Claim 4
Dependent Claim
47 words
In the process claimed in claim 1, the further step, after the need for mobility of the wires in the Z direction no longer exists, of subjecting the board to an irradiation dosage sufficient to completely cure all the adhesive to prevent any movement of the wires.
Claim 5
Dependent Claim
56 words
In the process claimed in claim 1, the further step, after the need for mobility of the wires in the Z direction no longer exists, of subjecting the board to heat to complete curing of all the adhesive for rigidly maintaining the wires registered in the Z direction as well as the X and Y directions.
Claim 6
Dependent Claim
27 words
In the process claimed in claim 1, adjusting the amount of a photosensitizer in the adhesive as necessary to provide a preselected degree of sensitivity to light.
Claim 7
Dependent Claim
143 words
A process for making an encapsulated multi-layered circuit board, characterized by the steps of: depositing on at least one side of a supporting substrate an adhesive which is both photochemically and thermally curable; disposing a plurality of wires in preselected positions in said adhesive; exposing the adhesive to light for curing the adhesive beside but not under the wires for maintaining the wires registered in X and Y directions while permitting limited pliability of the adhesive and consequent mobility of the wires in the Z direction; laminating a plurality of such encapsulated circuit boards together to form a multi-layered structure; and as a part of or subsequent to the laminating step, subjecting the structure to an irradiation dosage sufficient to completely cure the adhesive for rigidly maintaining the wires registered in the Z direction as well as in the X and Y directions.
Claim 8
Dependent Claim
143 words
A process for making an encapsulated multi-layered circuit board, characterized by the steps of: depositing on at least one side of a supporting substrate an adhesive which is both photochemically and thermally curable; disposing a plurality of wires in preselected positions in said adhesive; exposing the adhesive to light for curing the adhesive beside but not under the wires for maintaining the wires registered in X and Y directions while permitting limited pliability of the adhesive and consequent mobility of the wires in the Z direction; laminating a plurality of such encapsulated circuit boards together to form a multi-layered structure; and as a part of or subsequent to the laminating step, subjecting the structure to an irradiation dosage sufficient to completely cure the adhesive for rigidly maintaining the wires registered in the Z direction as well as in the X and Y directions.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1987-01-23 | 1987-07-25 | 1988-01-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1991-01-23 | 1991-07-25 | 1992-01-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1995-01-23 | 1995-07-25 | 1996-01-24 | $7700.00 | Window Closed / Lapsed |