Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
168 words
A controllable method of making a VLSI SASMESFET structure having a substrate with an implanted channel, an initial oxide layer disposed on the implanted channel of the substrate, a layer of polysilicon doped with phosphorus disposed on the initial substrate oxide layer coincident with an area defined for a Schottky gate, a silicon nitride layer disposed on the polysilicon layer, and source and drain areas implanted in the substrate on either side of the area defined for the Schottky gate, comprising the steps of: a. oxidizing the polysilicon layer at a rate determined by the doping level and thickness at a predetermined temperature thereof to form oxide insulating bumpers at the ends of the polysilicon layer where the width of the oxide bumpers so formed determined the minimal source-to-gate and drain-to-gate separations for reduced series resistance therebetween; and b. etching away of the silicon nitride layer, the polysilicon layer and the initial silicon dioxide layer to expose the implanted channel in the area that defines the Schottky gate.
Claim 2
Dependent Claim
168 words
A controllable method of making a VLSI SASMESFET structure having a substrate with an implanted channel, an initial oxide layer disposed on the implanted channel of the substrate, a layer of polysilicon doped with phosphorus disposed on the initial substrate oxide layer coincident with an area defined for a Schottky gate, a silicon nitride layer disposed on the polysilicon layer, and source and drain areas implanted in the substrate on either side of the area defined for the Schottky gate, comprising the steps of: a. oxidizing the polysilicon layer at a rate determined by the doping level and thickness at a predetermined temperature thereof to form oxide insulating bumpers at the ends of the polysilicon layer where the width of the oxide bumpers so formed determined the minimal source-to-gate and drain-to-gate separations for reduced series resistance therebetween; and b. etching away of the silicon nitride layer, the polysilicon layer and the initial silicon dioxide layer to expose the implanted channel in the area that defines the Schottky gate.
Claim 3
Dependent Claim
39 words
The controllable method of making a VLSI SASMESFET structure according to claim 1 further including the step of photopatterning and etching windows in the initial silicon dioxide layer to expose the source and drain areas implanted in the substrate.
Claim 4
Dependent Claim
56 words
The controllable method of making a VLSI SASMESFET structure according to claim 2 further including the step of depositing a proper metal on the exposed source and drain areas opened up by the etching of the windows in the initial silicon dioxide layer, and also disposed over and on the area defined for the Schottky gate.
Claim 5
Dependent Claim
19 words
The controllable method of making a VLSI SASMESFET structure according to claim 2 wherein the proper metal is platinum.
Claim 6
Dependent Claim
43 words
The controllable method of making a VLSI SASMESFET structure according to claim 3 further including the step of forming through thermal application to proper metal and the substrate an alloy in operative contact with the substrate where the proper metal has been deposited.
Claim 7
Dependent Claim
24 words
The controllable method of making a VLSI SASMESFET structure according to claim 5 further including the step of etching away all unalloyed proper metal.
Claim 8
Dependent Claim
31 words
The controllable method of making a VLSI SASMESFET structure according to claim 6 wherein the proper metal and the substrate alloy formed in the Schottky gate area is a Schottky barrier.
Claim 9
Dependent Claim
41 words
The controllable method of making a VLSI SASMESFET structure according to claim 5 wherein the proper metal and substrate alloy in operative contact with the exposed source and drain areas opened up by the etching of the windows are ohmic contacts.
Claim 10
Dependent Claim
31 words
The controllable method of making a VLSI SASMESFET structure according to claim 5 further including the step of depositing alternating layers of proper metals over the proper metal and substrate alloy.
Claim 11
Dependent Claim
36 words
The controllable method of making a VLSI SASMESFET structure according to claim 9 wherein the alternating proper metal proximate to and disposed on the proper metal and substrate alloy is an alloy of titanium and tungsten.
Claim 12
Dependent Claim
28 words
The controllable method of making a VLSI SASMESFET structure according to claim 10 wherein the alternating proper metal disposed on the alloy of titanium and tungsten is aluminum.