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US4397887A Expired / Lapsed US ⏱️ 0.0 years remaining

Postponed ROM programming

Assignee: National Semiconductor Corp
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Filing: 1982-08-18
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Granted: 1983-08-09
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Expires: 2002-08-18
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Abstract

Abstract A process to program ROM's after the insulation, gates, and interconnect circuitry have been formed by using a contact mask to define openings at the depletion cells, which openings extend beside the gates to the sources and drain so as to allow phosphorus dopant to be diffused sideways under the gates to short out the cell.

Inventors

  • 👤 Haluk M. Aytac
  • 👤 John F. MacDonald

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-30 12:59
CPC Classifications
G; G11; G11C; G11C17/00; G11C17/08; H; H10; H10B; H10B20/00; H10B20/27; H10B20/30; H10B20/38; H10B20/383

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 122 words
In the fabrication of a silicon semiconductor field effect memory device wherein spaced apart source and drain areas are formed on a substrate with a channel extending therebetween and a control gate is formed above the channel with an oxide insulating layer covering the gate and device, an improvement to the process that allows the device to be converted into a normally conducting device late in the fabrication process comprising: masking and etching the device so as to create openings to the source and drain areas on the substrate beside the control gate; and doping said source and drain areas through said openings so as to expand said areas toward each other, under said gate, until they form a continuous conduction path.
Claim 2
Dependent Claim 122 words
In the fabrication of a silicon semiconductor field effect memory device wherein spaced apart source and drain areas are formed on a substrate with a channel extending therebetween and a control gate is formed above the channel with an oxide insulating layer covering the gate and device, an improvement to the process that allows the device to be converted into a normally conducting device late in the fabrication process comprising: masking and etching the device so as to create openings to the source and drain areas on the substrate beside the control gate; and doping said source and drain areas through said openings so as to expand said areas toward each other, under said gate, until they form a continuous conduction path.
Claim 3
Dependent Claim 29 words
The process of claim 1 in which said source and drain areas are additionally doped by forming a doped oxide insulating layer on said device and in said opening.
Claim 4
Dependent Claim 19 words
The process of claim 2 in which said doped oxide comprises silicon oxide with about 8 percent phosphorus therein.
Claim 5
Dependent Claim 35 words
The process of claim 1 in which the source and drain areas are additionally doped with phosphorus through said openings and thereafter an insulating oxide layer is formed on said device and in said openings.

References Cited (Backward Citations)

US4135289A Cited
US4354309A Cited
US4347654A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-08-08 1987-02-07 1987-08-09 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-08-08 1991-02-07 1991-08-09 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-08-08 1995-02-07 1995-08-09 $7700.00 Window Closed / Lapsed

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