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US4354309A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing a metal-insulator-semiconductor device utilizing a graded deposition of polycrystalline silicon

Assignee: International Business Machines Corp
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Filing: 1980-09-12
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Granted: 1982-10-19
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Expires: 2000-09-12
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Abstract

Abstract A method of making a metal-oxide-semiconductor device is disclosed. A thin silicon dioxide insulating layer is formed on the surface of a planar silicon wafer. A first layer of intrinsic polycrystalline silicon is deposited over the dioxide layer, and a second layer of doped polycrystalline silicon is deposited over the intrinsic layer, thereby forming the gate. Subsequent hot processing steps result in diffusion of a portion of the dopant from the doped polycrystalline layer into and throughout the intrinsic layer so as to dope the latter. A metal contact layer is then deposited onto the gate and in superimposed vertical alignment with respect to the thin silicon dioxide insulating layer. The intrinsic nature of the first polycrystalline layer reduces grain growth and void formation in the polycrystalline silicon and thereby prevents the silicon dioxide from being attacked by hydrofluoric acid seeping through voids in the polycrystalline layer during subsequent processing. The yield for the manufacture of devices having thin oxide gates is substantially improved.

Inventors

  • 👤 James R. Gardiner
  • 👤 William A. Pliskin
  • 👤 Martin Revitz
  • 👤 Joseph F. Shepard

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-27 23:26
CPC Classifications
H; H10; H10D; H10D30/00; H10D30/01; H10D30/021; H10D30/0223; H10D30/40; H10D30/47; H10D30/471; H10D30/473; H10D30/4732; H10P; H10P14/00; H10P14/40; H10P14/416; H10P32/00; H10P32/30; H10P32/302; H10P76/00; H10P76/40; Y; Y10; Y10S; Y10S438/00; Y10S438/914

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 117 words
A method of making a metal-oxide-semiconductor field-effect device and comprising the steps of: providing a planar silicon body, forming a thin silicon dioxide insulating layer on a surface of said body, depositing a gate comprising a layer of polycrystalline silicon onto said silicon dioxide insulating layer, said polycrystalline layer being deposited with a substantially intrinsic portion adjacent said insulating layer and having a graded dopant concentration increasing in the direction away from said insulating layer, heating said gate and diffusing the dopant into and throughout said intrinsic portion down to said silicon dioxide insulating layer, and depositing a metal contact onto said gate and in superimposed vertical alignment with respect to said thin silicon dioxide insulating layer.
Claim 2
Independent Claim 117 words
A method of making a metal-oxide-semiconductor field-effect device and comprising the steps of: providing a planar silicon body, forming a thin silicon dioxide insulating layer on a surface of said body, depositing a gate comprising a layer of polycrystalline silicon onto said silicon dioxide insulating layer, said polycrystalline layer being deposited with a substantially intrinsic portion adjacent said insulating layer and having a graded dopant concentration increasing in the direction away from said insulating layer, heating said gate and diffusing the dopant into and throughout said intrinsic portion down to said silicon dioxide insulating layer, and depositing a metal contact onto said gate and in superimposed vertical alignment with respect to said thin silicon dioxide insulating layer.
Claim 3
Independent Claim 101 words
A method of making a metal-insulator-semiconductor device and comprising the steps of: providing a planar semiconductor body, forming a thin insulating layer on a surface of said body, depositing a gate comprising a layer of polycrystalline semiconductive material onto said insulating layer, said polycrystalline layer being deposited with a substantially intrinsic portion adjacent said insulating layer and having a graded dopant concentration increasing in the direction away from said insulating layer, heating said gate and diffusing the dopant into said intrinsic portion, and depositing a metal contact onto said gate and in superimposed vertical alignment with respect to said insulating layer.
Claim 4
Independent Claim 101 words
A method of making a metal-insulator-semiconductor device and comprising the steps of: providing a planar semiconductor body, forming a thin insulating layer on a surface of said body, depositing a gate comprising a layer of polycrystalline semiconductive material onto said insulating layer, said polycrystalline layer being deposited with a substantially intrinsic portion adjacent said insulating layer and having a graded dopant concentration increasing in the direction away from said insulating layer, heating said gate and diffusing the dopant into said intrinsic portion, and depositing a metal contact onto said gate and in superimposed vertical alignment with respect to said insulating layer.
Claim 5
Independent Claim 84 words
A method of making a metal-oxide-semiconductor device and comprising the steps of: providing a planar silicon body, forming a thin insulating layer on a surface of said body, depositing a gate comprising a layer of polycrystalline silicon onto said insulating layer, said polycrystalline layer being deposited with a substantially intrinsic portion adjacent said insulating layer and having a dopant concentration increasing in the direction away from said insulating layer, diffusing the dopant into said intrinsic portion, and depositing a metal contact onto said gate.
Claim 6
Independent Claim 84 words
A method of making a metal-oxide-semiconductor device and comprising the steps of: providing a planar silicon body, forming a thin insulating layer on a surface of said body, depositing a gate comprising a layer of polycrystalline silicon onto said insulating layer, said polycrystalline layer being deposited with a substantially intrinsic portion adjacent said insulating layer and having a dopant concentration increasing in the direction away from said insulating layer, diffusing the dopant into said intrinsic portion, and depositing a metal contact onto said gate.
Claim 7
Independent Claim 86 words
A method of making a metal-oxide-semiconductor device comprising the steps of: providing a planar silicon body, forming a thin insulating layer on a surface of said body, depositing polycrystalline silicon onto said insulating layer to form a gate, said polycrystalline silicon being deposited with a substantially intrinsic portion adjacent said insulating layer and having a dopant concentration increasing in the direction away from said insulating layer, diffusing said dopant into the said intrinsic portion of said polycrystalline silicon, and depositing a metal contact onto said gate.
Claim 8
Independent Claim 86 words
A method of making a metal-oxide-semiconductor device comprising the steps of: providing a planar silicon body, forming a thin insulating layer on a surface of said body, depositing polycrystalline silicon onto said insulating layer to form a gate, said polycrystalline silicon being deposited with a substantially intrinsic portion adjacent said insulating layer and having a dopant concentration increasing in the direction away from said insulating layer, diffusing said dopant into the said intrinsic portion of said polycrystalline silicon, and depositing a metal contact onto said gate.
Claim 9
Dependent Claim 26 words
The method as set forth in claim 4 wherein said dopant concentration increases in the direction away from said insulating layer in a substantially continuous manner.
Claim 10
Dependent Claim 26 words
The method as set forth in claim 5 wherein said dopant concentration increases in the direction away from said insulating layer in a substantially uniform manner.

References Cited (Backward Citations)

US3523838A Cited
US3638301A Cited
US3675319A Cited
US3738880A Cited
US3980507A Cited
US4143178A Cited
US4057895A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-10-18 1986-04-19 1986-10-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-10-18 1990-04-19 1990-10-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-10-18 1994-04-19 1994-10-19 $7700.00 Window Closed / Lapsed

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