Semiconductor apparatus with integral heat sink tab

Claim 1

A thermally protected semiconductor package and printed circuit board mounting assembly comprising: a semiconductor element bonded to a first major surface of a slab of metal and encapsulated in epoxy so as to form a parallelepiped-shaped body for said semiconductor package which encloses said semiconductor element, the second major surface of which serves as a substantial portion of a first side of said body and extends outwardly from a second side of said body which is substantially perpendicular to said first side, said extended portion of said slab of metal serving as a heat sink tab for said element which is integral with said body, and a plurality of lead terminals connected to said semiconductor element within said body and also extending outwardly from said second side of said body; a printed circuit board having a plurality of lead holes which receive said lead terminals, a first hole, and a second hole located intermediate said lead and first holes which receives said integral heat sink tab; and a supplemental heat sink comprising a sheet of metal contoured at the center with a first end of said sheet inserted in said first hold and a second, opposite end of said sheet inserted in said second hole with a surface of the second end of said supplemental heat sink forcibly contacting said second major surface of said integral heat sink tab so as to urge said integral heat sink into contact with said printed circuit board in said second hole and thereby retain said supplemental heat sink and said semiconductor package on said printed circuit board.