Integrated circuit heat dissipator

Claim 2

A thermally protected integrated circuit chip and printed circuit board mounting arrangement comprising: a perforated printed circuit board; an integrated circuit package enclosing said integrated circuit chip, mounted on said printed circuit board, and including a heat conductor extending from said enclosure and inserted into a first perforation in said printed circuit board; and a metallic heat dissipator mounted on said printed circuit board adjacent to said integrated circuit package and including two oppositely facing sides joined by a fold at the upper end of said dissipator, said fold, said sides and a portion of said printed circuit board defining an air space therebetween which is exclusive of said integrated circuit package, and first and second tabs extending from the lower ends of said sides, one of said tabs being inserted into said first perforation so as to be in contact with said heat conductor, and the other of said tabs being inserted into a second perforation spaced apart from, and located in a plane substantially parallel to, that of said first perforation, wherein said tabs exert an opposing spring force with respect to each other so that said one tab forcibly contacts said heat conductor within said first perforation, thereby retaining said heat dissipator and said integrated circuit package on said printed circuit board.

Claim 3

The mounting arrangement of claim 1, wherein said integrated circuit package comprises a rectangular molded body having a plurality of leads and said heat conductor extending from the longest sides of said body, which are bent so as to be suitable for insertion in perforations in said printed circuit board, said heat conductor having leads adjacent to it along the sides of said body, and said tabs are each comprised of a first section connected to one of said oppositely facing sides and having a given width which is substantially equal to the width of said integrated circuit heat conductor, and a second section connected to the end of said first section remote from said oppositely facing side and having a width which is less than said given width.

Claim 4

The mounting arrangement of claim 2, wherein said heat conductor has a given width and said leads located immediately adjacent on both sides of said conductor are separated by a given distance which is greater than said given width, and said first sections each have a width which is greater than said given width and less than said given distance; and said second sections each have a width which is substantially equal to said given width; and said first and second perforations have a length which is substantially equal to said given width.

Claim 5

The mounting arrangement of claim 2, or 3, wherein said heat conductor is comprised of a plurality of adjacent conductors each having a shape similar to that of said leads.

Claim 6

The mounting arrangement of claim 1, wherein said tabs are separated by a distance prior to insertion in said printed circuit board which is greater than the distance between said first and second perforation.

Claim 7

The mounting arrangement of claim 1, wherein said first and second tabs are folded at their junctions with said oppositely facing sides so as to be located in substantially parallel planes which are substantially perpendicular to the plane of said printed circuit board.

Claim 8

A thermally protected integrated circuit chip comprising: a perforated printed circuit board; an integrated circuit package enclosing said integrated circuit chip, mounted on said printed circuit board, and including a heat conductor having opposite ends extending from said enclosure and inserted into first and second perforations in said printed circuit board; a first metallic heat dissipator mounted on said printed circuit board on one side of said integrated circuit package and including two oppositely facing sides joined by a fold at the upper end of said dissipator, and first and second tabs extending from the lower ends of said sides, said first tab being inserted into said first perforation so as to be in contact with one of the ends of said heat conductor, and said second tab being inserted into a third perforation spaced apart from said first perforation; and a second metallic heat dissipator mounted on said printed circuit board on the other side of said integrated circuit package with respect to said first metallic heat dissipator, and including two oppositely facing sides joined by a fold at the upper end of said dissipator, and first and second tabs extending from the lower ends of said sides, said first tab being inserted into said second perforation so as to be in contact with the other of said ends of said heat conductor, and said second tab being inserted into a fourth perforation spaced apart from said second perforation.

Claim 9

A thermally protected integrated circuit chip comprising: a perforated printed circuit board; an integrated circuit package enclosing said integrated circuit chip, mounted on said printed circuit board, and including a heat conductor having opposite ends extending from said enclosure and inserted into first and second perforations in said printed circuit board; a first metallic heat dissipator mounted on said printed circuit board on one side of said integrated circuit package and including two oppositely facing sides joined by a fold at the upper end of said dissipator, and first and second tabs extending from the lower ends of said sides, said first tab being inserted into said first perforation so as to be in contact with one of the ends of said heat conductor, and said second tab being inserted into a third perforation spaced apart from said first perforation; and a second metallic heat dissipator mounted on said printed circuit board on the other side of said integrated circuit package with respect to said first metallic heat dissipator, and including two oppositely facing sides joined by a fold at the upper end of said dissipator, and first and second tabs extending from the lower ends of said sides, said first tab being inserted into said second perforation so as to be in contact with the other of said ends of said heat conductor, and said second tab being inserted into a fourth perforation spaced apart from said second perforation.

Claim 10

The mounting arrangement of claim 1, wherein said integrated circuit package further includes a plurality of non heat-conducting leads, and said heat dissipator comprises: a rectangular metallic body folded at the center to form two oppositely facing sides; and first and second tabs formed at the respective ends of said oppositely facing sides and having widths suitable for contacting said heat conductor to the exclusion of said non heat-conducting leads of said integrated circuit package when the dissipator is mounted alongside said package.

Claim 11

The mounting arrangement of claim 1, wherein said integrated circuit package further includes a plurality of non heat-conducting leads, and said heat dissipator comprises: a rectangular metallic body folded at the center to form two oppositely facing sides, having respective ends, said sides being folded inwardly intermediate said first fold and said ends such that the relative angle defined by said sides is smaller between said first and second folds than between said second folds and said ends; and first and second tabs formed at the respective ends of said oppositely facing sides and having widths suitable for contacting said heat conductor of said integrated circuit package to the exclusion of said non heat-conducting leads when the dissipator is mounted alongside said package.

Claim 12

The mounting arrangement of claim 1, wherein said integrated circuit package further includes a plurality of non heat-conducting leads, and said heat dissipator comprises: a rectangular metallic body folded at the center to form two oppositely facing sides having respective ends; a flap cut from one of said sides and folded inwardly from said one side toward the other of said sides; and first and second tabs formed at the respective ends of said oppositely facing sides and having widths suitable for contacting said heat conductor of said integrated circuit package to the exclusion of said non heat-conducting leads when the dissipator is mounted alongside said package.

Claim 13

The mounting arrangement of claims 8, 9, or 10, wherein said first and second tabs each comprise a first section connected to one of said ends and having a given width substantially equal to the width of said heat conductor, and a second section coupled to the end of said first section remote from the end of said side and having a width which is less than said given width.

Claim 14

The mounting arrangement of claims 8, 9, or 10, wherein said first and second tabs are folded at their junctions with said sides so as to be located in substantially parallel planes with respect to each other.