Patent US3103847A successfully refreshed from Google Patents.
Patent US4379181A successfully refreshed from Google Patents.
← Back to Patent Explorer
US4379181A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for plasma deposition of amorphous materials

Assignee: United Solar Systems Corp
•
Filing: 1981-03-16
•
Granted: 1983-04-05
•
Expires: 2001-03-16
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Improved method for the generation of and deposition of semiconductor alloys from a plasma are disclosed. The uniformity of deposited layers of amorphous semiconductor material is enhanced by maintaining the frequency of an ionizing a.c. field in the plasma region between the cathode of a glow discharge chamber and the active surface of a substrate at about 50 to 200 kiloHertz to allow the favorable deposition of material at relatively low power. Improved sample quality and deposition control (including uniformity) is realized at even high frequencies by the introduction of a quantity of inert gas into the chamber to alter the energy profile of the plasma.

Inventors

  • 👤 Vincent D. Cannella
  • 👤 Masatsugu Izu

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 14:09
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/22; C23C16/24; C23C16/44; C23C16/50; C23C16/505; C23C16/509

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 156 words
In the method of manufacture of amorphous semiconductor devices including the deposition of at least one layer of amorphous semiconductor grade material of preselected electrical and optical properties upon a large area substrate wherein a reaction gas mixture containing at least silicon and fluorine is introduced into a plasma region between said substrate and a cathode and an alternating electric field is applied therebetween so that said reaction gas mixture is ionized to form a plasma for depositing said layer of amorphous semiconductor grade material of said preselected properties upon said substrate, the improvement comprising the steps of: maintaining the frequency of said alternating electric field between about 50 nd 200 kilo Hertz and maintaining the power density of said plasma at about 0.3-0.5 watt/cm 3 , whereby the amorphous material deposited onto said substrate is a semiconductor grade material which additionally exhibits the characteristics of substantial uniformity of thickness and substantial reduction of tensile stresses.
Claim 2
Dependent Claim 156 words
In the method of manufacture of amorphous semiconductor devices including the deposition of at least one layer of amorphous semiconductor grade material of preselected electrical and optical properties upon a large area substrate wherein a reaction gas mixture containing at least silicon and fluorine is introduced into a plasma region between said substrate and a cathode and an alternating electric field is applied therebetween so that said reaction gas mixture is ionized to form a plasma for depositing said layer of amorphous semiconductor grade material of said preselected properties upon said substrate, the improvement comprising the steps of: maintaining the frequency of said alternating electric field between about 50 nd 200 kilo Hertz and maintaining the power density of said plasma at about 0.3-0.5 watt/cm 3 , whereby the amorphous material deposited onto said substrate is a semiconductor grade material which additionally exhibits the characteristics of substantial uniformity of thickness and substantial reduction of tensile stresses.
Claim 3
Dependent Claim 22 words
The method of claim 1 further characterized by the step of introducing a substantially equal amount of inert gas into said mixture.
Claim 4
Dependent Claim 11 words
The method of claim 2 wherein said inert gas is argon.
Claim 5
Dependent Claim 15 words
The method of claim 3 wherein said mixture includes SiF 4 and H 2 .

References Cited (Backward Citations)

US3485666A Cited
US4064521A Cited
US4178877A Cited
US4226898A Cited
GB2033355A Cited
US4226643A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1986-04-04 1986-10-04 1987-04-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1990-04-04 1990-10-04 1991-04-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1994-04-04 1994-10-04 1995-04-05 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag