Abstract A semiconductor chip carrier having a lead frame wherein the ends of each of the inner lead portions, which are closely adjacent to the semiconductor device to which the leads are to be bonded, are manufactured with the inner leads temporarily connected to a common supporting rim which must be removed after the attachment of the lead frame to the ceramic substrate is completed. This provides accurate and constant spacing between the leads of the lead frame during the bonding of the lead frame to the ceramic substrate. The rim is removed from the lead frame after bonding of the lead frame to the ceramic substrate. This is accomplished by reducing the thickness of the rim and a portion of the leads of the lead frame contacting and closely adjacent to the rim. This provides a space between the rim and the substrate during the bonding of the lead frame to the substrate. In this way, the rim and a small portion of the leads do not bond to the substrate, thereby allowing the rim to be later removed quite easily.
A ceramic chip carrier which comprises: (a) a ceramic substrate, (b) a lead frame bonded directly to said ceramic substrate, said lead frame having a copper surface and including a plurality of leads extending from the edge of said substrate toward a center region of said substrate, and (c) a rim connecting together the ends of said leads extending toward the center of said substrate, said rim being coplanar with said lead frame and being disposed in non-contacting relation with said substrate, said rim having a thickness which is less than the thickness of said lead frame.
Claim 2
Dependent Claim
97 words
A ceramic chip carrier which comprises: (a) a ceramic substrate, (b) a lead frame bonded directly to said ceramic substrate, said lead frame having a copper surface and including a plurality of leads extending from the edge of said substrate toward a center region of said substrate, and (c) a rim connecting together the ends of said leads extending toward the center of said substrate, said rim being coplanar with said lead frame and being disposed in non-contacting relation with said substrate, said rim having a thickness which is less than the thickness of said lead frame.
Claim 3
Dependent Claim
21 words
A carrier as set forth in claim 1 wherein said ceramic is taken from the class consisting of alumina and beryllia.
Claim 4
Independent Claim
77 words
A method of forming a ceramic chip carrier comprising the steps of (a) providing a ceramic substrate, (b) providing a planar copper surfaced lead frame having a plurality of leads and a rim coplanar with said lead frame connecting together the interior of each of said leads, the rim being of a thickness less than said lead frame, (c) bonding only the lead frame directly to the substrate, and (d) removing said rim from said lead frame.
Claim 5
Independent Claim
77 words
A method of forming a ceramic chip carrier comprising the steps of (a) providing a ceramic substrate, (b) providing a planar copper surfaced lead frame having a plurality of leads and a rim coplanar with said lead frame connecting together the interior of each of said leads, the rim being of a thickness less than said lead frame, (c) bonding only the lead frame directly to the substrate, and (d) removing said rim from said lead frame.
Claim 6
Dependent Claim
15 words
A method as set forth in claim 3 wherein said step (d) includes mechanical removal.