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US4355082A
Expired / Lapsed
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Ultra-thin wire for semiconductor connections
Assignee: WC Heraus GmbH and Co KG
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Filing: 1981-06-17
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Granted: 1982-10-19
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Expires: 2001-06-17
Abstract
Abstract To prevent metal fatique, particularly when making a button loop, or nail head thermo compression bond connection to a semiconductor, the connecting wire has a core of copper, or a copper alloy of at least 60% copper content, and a jacket of aluminum, or aluminum alloy, of at least 95% aluminum content; in a preferred form, the core is 94% copper and 6% tin, and the jacket is, for example, 99% aluminum, 1% silicon; 96% aluminum, 4% copper; or 99% aluminum, 1% magnesium, all percentages by weight.
Inventors
- 👤 Albrecht Bischoff
- 👤 Fritz Aldinger
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:42
CPC Classifications
H; H01; H01B; H01B1/00; H01B1/02; H01B1/026; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/5525; H10W72/555; H10W72/59; H10W72/90; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/923; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/12528; Y10T428/12736; Y10T428/1275
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
71 words
Ultra-thin bonding wire, particularly for connection to a semiconductor, and having a diameter in the order of about 0.01 to 0.06 mm comprising, in accordance with the invention, a core of a material of the group consisting of: copper; copper alloy of at least 60% copper content; and a jacket of a material of the group consisting of: aluminum, or aluminum alloy of at least 95% aluminum; all percentages by weight.
Claim 2
Dependent Claim
71 words
Ultra-thin bonding wire, particularly for connection to a semiconductor, and having a diameter in the order of about 0.01 to 0.06 mm comprising, in accordance with the invention, a core of a material of the group consisting of: copper; copper alloy of at least 60% copper content; and a jacket of a material of the group consisting of: aluminum, or aluminum alloy of at least 95% aluminum; all percentages by weight.
Claim 3
Dependent Claim
17 words
Wire according to claim 1, wherein the core comprises an alloy of 94% copper and 6% tin.
Claim 4
Dependent Claim
17 words
Wire according to claim 1, wherein the jacket comprises an alloy of 99% aluminum and 1% silicon.
Claim 5
Dependent Claim
17 words
Wire according to claim 1, wherein the jacket comprises an alloy of 96% aluminum and 4% copper.
Claim 6
Dependent Claim
17 words
Wire according to claim 1, wherein the jacket comprises an alloy of 99% aluminum and 1% magnesium.
Claim 7
Dependent Claim
15 words
Wire according to claim 1, wherein the core comprises copper, and the jacket comprises aluminum.
Claim 8
Dependent Claim
36 words
Wire according to claim 1, wherein the core comprises copper, and the jacket comprises an alloy of the group consisting of: 99% aluminum and 1% silicon; 96% aluminum and 4% copper; 99% aluminum and 1% magnesium.
Claim 9
Dependent Claim
38 words
Wire according to claim 1, wherein the core comprises an alloy of 94% copper and 6% tin; and the jacket comprises a material of the group consisting of: aluminum, or an alloy of 99% aluminum and 1% silicon.
Claim 10
Dependent Claim
31 words
In combination with a semiconductor silicon substrate (20) having a metallic surface formed thereon, a bonding wire bonded to the metallic surface on the silicon substrate, as claimed in claim 1.
Claim 11
Dependent Claim
65 words
The combination of claim 9, wherein the metallic surface comprises aluminum; and the bonding wire comprises a wire having a core of a material of the group consisting of: copper, a copper alloy of at least 60% copper content; and a jacket comprising an alloy of the group consisting of: 99% aluminum and 1% silicon; 96% aluminum and 4% copper; 99% aluminum and 1% magnesium.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-10-18 | 1986-04-19 | 1986-10-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-10-18 | 1990-04-19 | 1990-10-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-10-18 | 1994-04-19 | 1994-10-19 | $7700.00 | Window Closed / Lapsed |