Electrochemically eroding semiconductor device

Claim 2

A process of electrochemically eroding a semiconductor member to a specific dimension comprising in combination the steps of: immersing at least the region to be eroded of a semiconductor body in a fluid, said region being unbiased with respect to said fluid and said fluid having the property that erosion of said semiconductor by said fluid occurs only in the presence of electric current flowing from said semiconductor into said fluid, and illuminating said semiconductor with light having a frequency capable of penetrating into said semiconductor in the vicinity of said specific dimension.

Claim 3

The process of claim 1 wherein the semiconductor is GaAs.

Claim 4

In a process of uniformly electrochemically eroding simultaneously, each to a precise dimension, each device in an array of semiconductor devices in a layer epitaxial with a supporting substrate layer together comprising a semiconductor wafer, the improvement comprising: immersing at least the layer of said wafer containing said devices in a fluid, said layer being unbiased with respect to said fluid and said fluid having the property of being able to erode said immersed layer only in the presence of an electric current flowing from said layer into said fluid, and illuminating said layer with light having a frequency capable of penetrating into said layer in the vicinity of said precise dimension.

Claim 5

In a process of uniformly electrochemically eroding simultaneously, each to a precise dimension, each device in an array of semiconductor devices in a layer epitaxial with a supporting substrate layer together comprising a semiconductor wafer, the improvement comprising: immersing at least the layer of said wafer containing said devices in a fluid, said layer being unbiased with respect to said fluid and said fluid having the property of being able to erode said immersed layer only in the presence of an electric current flowing from said layer into said fluid, and illuminating said layer with light having a frequency capable of penetrating into said layer in the vicinity of said precise dimension.

Claim 6

The process of claim 3 wherein said layer is GaAs.

Claim 7

The process of claim 4 wherein said substrate layer is semi-insulating GaAs doped with Cr.

Claim 8

In the process of electrochemically eroding a semiconductor member to a precise dimension, the improvement comprising: applying light to a wafer made up of gallium arsenide semiconductor layer that is epitaxial with a semi-insulating gallium arsenide layer doped with chromium whereby photogenerated carriers are produced therein, said light being capable of penetration of said gallium arsenide to the vicinity of said precise dimension, and maintaining said wafer in the presence of said light with at least said gallium aresenide layer immersed in an electrolytic erosion solution capable of eroding said GaAs only in the presence of electric current flowing from said GaAs to said solution, said gallium arsenide layer being unbiased with respect to said solution.

Claim 9

In the process of electrochemically eroding a semiconductor member to a precise dimension, the improvement comprising: applying light to a wafer made up of gallium arsenide semiconductor layer that is epitaxial with a semi-insulating gallium arsenide layer doped with chromium whereby photogenerated carriers are produced therein, said light being capable of penetration of said gallium arsenide to the vicinity of said precise dimension, and maintaining said wafer in the presence of said light with at least said gallium aresenide layer immersed in an electrolytic erosion solution capable of eroding said GaAs only in the presence of electric current flowing from said GaAs to said solution, said gallium arsenide layer being unbiased with respect to said solution.

Claim 10

The process of claim 6 wherein said etching solution is 10% HCl and said light wavelength is 6328 A.

Claim 11

The process of providing self-alignment in a transistor structure of the type wherein a first electrode is positioned adjacent to but insulated from a second electrode on a semiconductor body comprising the steps of: masking a portion of the surface of said semiconductor body to define said first electrode, electrochemically eroding a region of said semiconductor body adjacent said masked electrode simultaneously thereby providing an undercut region under said first electrode mask by immersing at least the region to be eroded of a semiconductor body in a fluid, said region being unbiased with respect to said fluid and said fluid having the property that erosion of said semiconductor by said fluid occurs only in the presence of electric current flowing from said semiconductor into said fluid, and illuminating said semiconductor with light having a frequency capable of penetrating into said semiconductor in the vicinity of said specific dimension, and positioning said second electrode at a location defined by said first electrode mask and the vertical level of said etched region.

Claim 12

The process of providing self-alignment in a transistor structure of the type wherein a first electrode is positioned adjacent to but insulated from a second electrode on a semiconductor body comprising the steps of: masking a portion of the surface of said semiconductor body to define said first electrode, electrochemically eroding a region of said semiconductor body adjacent said masked electrode simultaneously thereby providing an undercut region under said first electrode mask by immersing at least the region to be eroded of a semiconductor body in a fluid, said region being unbiased with respect to said fluid and said fluid having the property that erosion of said semiconductor by said fluid occurs only in the presence of electric current flowing from said semiconductor into said fluid, and illuminating said semiconductor with light having a frequency capable of penetrating into said semiconductor in the vicinity of said specific dimension, and positioning said second electrode at a location defined by said first electrode mask and the vertical level of said etched region.

Claim 13

The process of providing self-alignment in a MESFET transistor structure of the type wherein at least one of a source and drain first electrode is positioned adjacent to but insulated from a gate second electrode comprising the steps of: masking the surface of a semiconductor member to define said first electrode, etching the region adjacent said masked electrode simultaneously thereby providing an undercut region under said first electrode mask, and positioning said second electrode at a location defined by said first electrode mask and the vertical level of said etched region.

Claim 14

The process of providing self-alignment in a MESFET transistor structure of the type wherein at least one of a source and drain first electrode is positioned adjacent to but insulated from a gate second electrode comprising the steps of: masking the surface of a semiconductor member to define said first electrode, etching the region adjacent said masked electrode simultaneously thereby providing an undercut region under said first electrode mask, and positioning said second electrode at a location defined by said first electrode mask and the vertical level of said etched region.