Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
183 words
In a circuit board for a photoflash array having a lamp firing circuit pattern deposited on a dielectric substrate and radiation sensitive switches connected in said circuitry for sequential firing of a plurality of flash lamps connected thereto, said circuit pattern comprising an organic resin matrix having particulated electrically conductive material dispersed therein and further including radiation sensitive fuse elements located at positions where the dielectric substrate has a reduced thickness relative to the remaining thickness of said dielectric substrate and with said fuse elements being formed by providing a more narrow width of said circuit pattern at the fuse locations than the remaining width of said circuit pattern, the improvement wherein said fuse elements are electrically connected together in a series circuit combination to increase the dielectric breakdown voltage of said combination upon successive actuation of the fuse elements, each of said flashlamps being connected in branch circuits having a radiation sensitive switch connected between one side of each pair of successively connected flashlamps and a radiation sensitive fuse element connected between the remaining side of each pair of successively connected flashlamps.
Claim 2
Dependent Claim
183 words
In a circuit board for a photoflash array having a lamp firing circuit pattern deposited on a dielectric substrate and radiation sensitive switches connected in said circuitry for sequential firing of a plurality of flash lamps connected thereto, said circuit pattern comprising an organic resin matrix having particulated electrically conductive material dispersed therein and further including radiation sensitive fuse elements located at positions where the dielectric substrate has a reduced thickness relative to the remaining thickness of said dielectric substrate and with said fuse elements being formed by providing a more narrow width of said circuit pattern at the fuse locations than the remaining width of said circuit pattern, the improvement wherein said fuse elements are electrically connected together in a series circuit combination to increase the dielectric breakdown voltage of said combination upon successive actuation of the fuse elements, each of said flashlamps being connected in branch circuits having a radiation sensitive switch connected between one side of each pair of successively connected flashlamps and a radiation sensitive fuse element connected between the remaining side of each pair of successively connected flashlamps.
Claim 3
Dependent Claim
19 words
A circuit board as in claim 1 wherein a radiation absorbing material is also dispersed in the circuit pattern.
Claim 4
Dependent Claim
15 words
A circuit board as in claim 2 wherein the radiation absorbing material is a dye.
Claim 5
Dependent Claim
23 words
A circuit board member as in claim 1 wherein a radiation absorbing coating is deposited on the circuit pattern at the fuse locations.
Claim 6
Dependent Claim
34 words
A circuit board as in claim 1 wherein the radiation sensitive switches and the radiation sensitive fuse elements are located adjacent said flash lamps for simultaneous activation of an adjoining switch and fuse element.
Claim 7
Dependent Claim
18 words
A circuit board as in claim 1 wherein the particulated electrically conductive material comprises metal coated glass spheres.
Claim 8
Dependent Claim
17 words
A circuit board as in claim 6 wherein the particulated electrically conductive material further contains metal flakes.
Claim 9
Dependent Claim
244 words
In a circuit board for a photoflash array having a lamp firing circuit pattern deposited on a dielectric substrate and radiation sensitive switches connected in said circuitry for sequential firing of a plurality of flash lamps connected thereto, said circuit pattern comprising a radiation cured organic resin matrix having a particulated electrically conductive material selected from the group consisting of a particulated electrically conductive metal or a particulated electrically conductive metal containing material, including mixtures thereof, and with no more than about 15% by weight of said particulated electrically conductive material having an aspect ratio of diameter to thickness of a value greater than 20 being dispersed in said organic resin matrix, said circuit pattern further including radiation sensitive fuse elements located at positions where the dielectric substrate has a reduced thickness relative to the remaining thickness of said dielectric substrate and with said fuse elements being formed by providing a more narrow width of said circuit pattern at the fuse locations than the remaining width of said circuit pattern, the improvement wherein said fuse elements are electrically connected together in a series circuit combination to increase the dielectric breakdown voltage of said combination upon successive actuation of the fuse elements, each of said flashlamps being connected in branch circuits having a radiation sensitive switch connected between one side of each pair of successively connected flashlamps and a radiation sensitive fuse element connected between the remaining side of each pair of successively connected flashlamps.
Claim 10
Dependent Claim
244 words
In a circuit board for a photoflash array having a lamp firing circuit pattern deposited on a dielectric substrate and radiation sensitive switches connected in said circuitry for sequential firing of a plurality of flash lamps connected thereto, said circuit pattern comprising a radiation cured organic resin matrix having a particulated electrically conductive material selected from the group consisting of a particulated electrically conductive metal or a particulated electrically conductive metal containing material, including mixtures thereof, and with no more than about 15% by weight of said particulated electrically conductive material having an aspect ratio of diameter to thickness of a value greater than 20 being dispersed in said organic resin matrix, said circuit pattern further including radiation sensitive fuse elements located at positions where the dielectric substrate has a reduced thickness relative to the remaining thickness of said dielectric substrate and with said fuse elements being formed by providing a more narrow width of said circuit pattern at the fuse locations than the remaining width of said circuit pattern, the improvement wherein said fuse elements are electrically connected together in a series circuit combination to increase the dielectric breakdown voltage of said combination upon successive actuation of the fuse elements, each of said flashlamps being connected in branch circuits having a radiation sensitive switch connected between one side of each pair of successively connected flashlamps and a radiation sensitive fuse element connected between the remaining side of each pair of successively connected flashlamps.
Claim 11
Dependent Claim
19 words
A circuit board as in claim 8 wherein a radiation absorbing material is also dispersed in the circuit pattern.
Claim 12
Dependent Claim
23 words
A circuit board member as in claim 8 wherein a radiation absorbing coating is deposited on the circuit pattern at the fuse locations.
Claim 13
Dependent Claim
27 words
A circuit board as in claim 8 in which at least 85% by weight of said particulated electrically conductive material is constituted by metal coated glass spheres.
Claim 14
Dependent Claim
31 words
A circuit board as in claim 8 in which at least about 40% and not more than about 90% by weight of said circuit pattern is said particulated electrically conductive material.
Claim 15
Dependent Claim
34 words
A circuit board as in claim 8 wherein the radiation sensitive switches and the radiation sensitive fuse elements are located adjacent said flash lamps for simultaneous activation of an adjoining switch and fuse element.