Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
81 words
In a circuit board for a photoflash lamp array having a lamp firing circuit pattern deposited on a dielectric substrate and radiation sensitive switches connected in said circuitry for sequential firing of a plurality of flash lamps connected thereto, the improvement wherein radiation sensitive fuse elements are deposited on said circuit pattern adjacent the associated lamps to physically interrupt the circuit path below upon activation and in a manner which is accompanied by the thermal destruction of the underlying dielectric substrate.
Claim 2
Dependent Claim
81 words
In a circuit board for a photoflash lamp array having a lamp firing circuit pattern deposited on a dielectric substrate and radiation sensitive switches connected in said circuitry for sequential firing of a plurality of flash lamps connected thereto, the improvement wherein radiation sensitive fuse elements are deposited on said circuit pattern adjacent the associated lamps to physically interrupt the circuit path below upon activation and in a manner which is accompanied by the thermal destruction of the underlying dielectric substrate.
Claim 3
Dependent Claim
24 words
A circuit board as in claim 1 wherein the fuse elements comprise a mass of radiation absorbent material adhesively bonded to the circuit pattern.
Claim 4
Dependent Claim
24 words
A circuit board as in claim 2 wherein the fuse elements comprise a mixture of radiation absorbent particulate solids with an organic polymer binder.
Claim 5
Dependent Claim
38 words
A circuit board as in claim 1 wherein the dielectric substrate is an organic polymer and the fuse elements are deposited at circuit board locations wherein said dielectric substrate has a thickness less than the substrate thickness elsewhere.
Claim 6
Dependent Claim
120 words
In a circuit board for a photoflash lamp array having a lamp firing circuit pattern deposited on a dielectric substrate for sequential firing of a plurality of flash lamps connected thereto, the improvement wherein radiation sensitive switches and radiation sensitive fuse elements are deposited on said circuit pattern adjacent said flash lamps for simultaneous activation of each adjoining switch and fuse element by radiation being emitted from the adjacent flash lamp so that the activated switch provides a circuit path to the next flash lamp to be fired while the activated fuse element interrupts the circuit path below to the flash lamp providing said radiation and in a manner which is accompanied by thermal destruction of the underlying dielectric substrate.
Claim 7
Dependent Claim
120 words
In a circuit board for a photoflash lamp array having a lamp firing circuit pattern deposited on a dielectric substrate for sequential firing of a plurality of flash lamps connected thereto, the improvement wherein radiation sensitive switches and radiation sensitive fuse elements are deposited on said circuit pattern adjacent said flash lamps for simultaneous activation of each adjoining switch and fuse element by radiation being emitted from the adjacent flash lamp so that the activated switch provides a circuit path to the next flash lamp to be fired while the activated fuse element interrupts the circuit path below to the flash lamp providing said radiation and in a manner which is accompanied by thermal destruction of the underlying dielectric substrate.
Claim 8
Dependent Claim
24 words
A circuit board as in claim 5 wherein the fuse elements comprise a mass of radiation absorbent material adhesively bonded to the circuit pattern.
Claim 9
Dependent Claim
24 words
A circuit board as in claim 5 wherein the fuse elements comprise a mixture of radiation absorbent particulate solids with an organic polymer binder.
Claim 10
Dependent Claim
38 words
A circuit board as in claim 5 wherein the dielectric substrate is an organic polymer and the fuse elements are deposited at circuit board locations wherein said dielectric substrate has a thickness less than the substrate thickness elsewhere.