Integrated circuit manufacturing method

Claim 1

A method for forming a semiconductor structure comprising the steps of: (a) forming a semiconductor layer on a substrate; (b) forming an insulating layer over the semiconductor layer; (c) forming a masking layer over the insulating layer; (d) masking a portion of the masking layer with a mask; (e) depositing particles into unmasked portions of the masking layer to form separated regions of such particles; (f) diffusing the particles into masked portions of the masking layer to extend the separated regions, symmetrically, partially into the masked portions of the masking layer to separate such regions a predetermined width, with such separated regions having a predetermined particle concentration; (g) forming an aperture in such masking layer having a predetermined width to expose a portion of a surface of the insulating layer comprising the step of exposing the masking layer to a chemical etchant to selectively remove portions of the masking layer which have a particle concentration below the predetermined particle concentration; (h) removing the entire portion of the surface of the insulating layer exposed by the aperture, forming an aperture in the insulating layer; and (i) depositing a metal through the aperture in the insulating layer onto an exposed portion of the semiconductor layer.

Claim 2

A method for forming a semiconductor structure comprising the steps of: (a) forming a semiconductor layer on a substrate; (b) forming an insulating layer over the semiconductor layer; (c) forming a masking layer over the insulating layer; (d) masking a portion of the masking layer with a mask; (e) depositing particles into unmasked portions of the masking layer to form separated regions of such particles; (f) diffusing the particles into masked portions of the masking layer to extend the separated regions, symmetrically, partially into the masked portions of the masking layer to separate such regions a predetermined width, with such separated regions having a predetermined particle concentration; (g) forming an aperture in such masking layer having a predetermined width to expose a portion of a surface of the insulating layer comprising the step of exposing the masking layer to a chemical etchant to selectively remove portions of the masking layer which have a particle concentration below the predetermined particle concentration; (h) removing the entire portion of the surface of the insulating layer exposed by the aperture, forming an aperture in the insulating layer; and (i) depositing a metal through the aperture in the insulating layer onto an exposed portion of the semiconductor layer.

Claim 4

A method for forming a semiconductor structure comprising the steps of: (a) forming a semiconductor layer on a substrate; (b) forming an insulating layer over the semiconductor layer; (c) forming a masking layer over the insulating layer; (d) masking a portion of the masking layer with a mask; (e) depositing particles into unmasked portions of the masking layer to form separated regions of such particles; (f) diffusing the particles into masked portions of the masking layer to extend the separated regions, symmetrically, partially into the masked portions of the masking layer to separate such regions a predetermined width, with such separated regions having a predetermined particle concentration; (g) forming an aperture in such masking layer having a predetermined width to expose a portion of a surface of the insulating layer comprising the step of exposing the masking layer to a chemical etchant to selectively remove portions of the masking layer which have a particle concentration below the predetermined particle concentration; (h) bringing an etchant into contact with the entire surface portion of the insulating layer exposed by the aperture, removing the entire portion of the surface of the insulating layer exposed by the aperture and forming an aperture in such insulating layer; and (i) depositing a metal through the aperture in the insulating layer onto an exposed portion of the semiconductor layer forming a Schottky gate contact between the metal and the semiconductor layer.

Claim 5

A method for forming a semiconductor structure comprising the steps of: (a) forming a semiconductor layer on a substrate; (b) forming an insulating layer over the semiconductor layer; (c) forming a masking layer over the insulating layer; (d) masking a portion of the masking layer with a mask; (e) depositing particles into unmasked portions of the masking layer to form separated regions of such particles; (f) diffusing the particles into masked portions of the masking layer to extend the separated regions, symmetrically, partially into the masked portions of the masking layer to separate such regions a predetermined width, with such separated regions having a predetermined particle concentration; (g) forming an aperture in such masking layer having a predetermined width to expose a portion of a surface of the insulating layer comprising the step of exposing the masking layer to a chemical etchant to selectively remove portions of the masking layer which have a particle concentration below the predetermined particle concentration; (h) bringing an etchant into contact with the entire surface portion of the insulating layer exposed by the aperture, removing the entire portion of the surface of the insulating layer exposed by the aperture and forming an aperture in such insulating layer; and (i) depositing a metal through the aperture in the insulating layer onto an exposed portion of the semiconductor layer forming a Schottky gate contact between the metal and the semiconductor layer.

Claim 7

A method for forming a semiconductor structure comprising the steps of: (a) forming a first layer of material on a semiconductor; (b) forming a masking layer over the first layer (c) forming a mask over a selected portion of the masking layer; (d) depositing particles into unmasked portions of the masking layer; (e) diffusing the deposited particles into the masking layer a predetermined distance to form two regions having a particle concentration greater than a predetermined concentration, such regions being separated by a region having a particle concentration less than such predetermined concentration; (f) forming an aperture in the masking layer comprising the step of exposing the masking layer to a chemical etchant, selectively removing the region having a particle concentration less than such predetermined concentration to expose a portion of a surface of the first layer of material; and (g) bringing an etchant into contact with the entire portion of the surface of the first layer of material exposed by the aperture, selectively removing the entire exposed portion of the surface of the first layer of material and exposing a portion of a surface of the semiconductor.

Claim 8

A method for forming a semiconductor structure comprising the steps of: (a) forming a first layer of material on a semiconductor; (b) forming a masking layer over the first layer (c) forming a mask over a selected portion of the masking layer; (d) depositing particles into unmasked portions of the masking layer; (e) diffusing the deposited particles into the masking layer a predetermined distance to form two regions having a particle concentration greater than a predetermined concentration, such regions being separated by a region having a particle concentration less than such predetermined concentration; (f) forming an aperture in the masking layer comprising the step of exposing the masking layer to a chemical etchant, selectively removing the region having a particle concentration less than such predetermined concentration to expose a portion of a surface of the first layer of material; and (g) bringing an etchant into contact with the entire portion of the surface of the first layer of material exposed by the aperture, selectively removing the entire exposed portion of the surface of the first layer of material and exposing a portion of a surface of the semiconductor.

Claim 9

A method of forming a semiconductor structure comprising the steps of: (a) forming a layer of insulating material over a semiconductor; (b) forming a layer of a second material over the insulating layer; (c) diffusing particles into separate regions of the layer of the second material to provide such separate regions with a predetermined particle concentration; (d) forming an aperture in such layer of the second material to expose a portion of a surface of the layer of insulating material comprising the step of exposing the layer of the second material to an etchant to selectively remove a portion of the layer of the second material having a particle concentration below the predetermined particle concentration; (e) bringing an etchant into contact with the entire portion of the surface of the insulating material exposed by the aperture and removing the entire exposed portion of the surface of the layer of insulating material to form an aperture in the insulating layer and to expose a portion of the semiconductor; and (f) depositing a metal through the aperture in the insulating layer and onto the exposed portion of the semiconductor.

Claim 10

A method of forming a semiconductor structure comprising the steps of: (a) forming a layer of insulating material over a semiconductor; (b) forming a layer of a second material over the insulating layer; (c) diffusing particles into separate regions of the layer of the second material to provide such separate regions with a predetermined particle concentration; (d) forming an aperture in such layer of the second material to expose a portion of a surface of the layer of insulating material comprising the step of exposing the layer of the second material to an etchant to selectively remove a portion of the layer of the second material having a particle concentration below the predetermined particle concentration; (e) bringing an etchant into contact with the entire portion of the surface of the insulating material exposed by the aperture and removing the entire exposed portion of the surface of the layer of insulating material to form an aperture in the insulating layer and to expose a portion of the semiconductor; and (f) depositing a metal through the aperture in the insulating layer and onto the exposed portion of the semiconductor.

Claim 11

A method for forming a field effect device comprising the steps of: (a) forming a layer of insulating material over a surface of a semiconductor; (b) forming a masking layer of a second material over the insulating layer; (c) forming a mask over a selected portion of the masking layer; (d) selectively ion implanting first particles into unmasked portions of the masking layer; (e) diffusing such ion implanted first particles laterally into masked portions of the masking layer to form separate regions in the masking layer having a predetermined first particle concentration; (f) selectively removing the unmasked portions of the masking layer; (g) selectively ion implanting second particles into unmasked portions of the semiconductor, such second particles being capable of forming source and drain regions for the field effect device; (h) forming an aperture in the masking layer intermediate the source and drain regions to expose a portion of the insulating material comprising the step of exposing the masking layer to an etchant to selectively remove a portion of such masking layer having a first particle concentration below the predetermined particle concentration; and (i) forming a gate electrode through such aperture.

Claim 12

A method for forming a field effect device comprising the steps of: (a) forming a layer of insulating material over a surface of a semiconductor; (b) forming a masking layer of a second material over the insulating layer; (c) forming a mask over a selected portion of the masking layer; (d) selectively ion implanting first particles into unmasked portions of the masking layer; (e) diffusing such ion implanted first particles laterally into masked portions of the masking layer to form separate regions in the masking layer having a predetermined first particle concentration; (f) selectively removing the unmasked portions of the masking layer; (g) selectively ion implanting second particles into unmasked portions of the semiconductor, such second particles being capable of forming source and drain regions for the field effect device; (h) forming an aperture in the masking layer intermediate the source and drain regions to expose a portion of the insulating material comprising the step of exposing the masking layer to an etchant to selectively remove a portion of such masking layer having a first particle concentration below the predetermined particle concentration; and (i) forming a gate electrode through such aperture.

Claim 15

A method for forming a semiconductor structure comprising the steps of: (a) forming a first layer of material over a first surface; (b) forming a masking layer over the first layer; (c) forming a mask over a selected portion of the masking layer; (d) depositing particles into unmasked portions of the masking layer; (e) diffusing the deposited particles into the masking layer a predetermined distance to form two regions having a particle concentration greater than a predetermined concentration, such regions being separated by a region having a particle concentration less than such predetermined concentration; (f) forming an aperture in the masking layer comprising the step of exposing the masking layer to a chemical etchant, selectively removing the region having a particle concentration less than such predetermined concentration to expose a portion of a surface of the first layer of material; and (g) bringing an etchant into contact with the entire portion of the surface of the first layer of material exposed by the aperture, selectively removing the entire portion of the surface of the first layer of material and exposing a portion of the first surface.

Claim 16

A method for forming a semiconductor structure comprising the steps of: (a) forming a first layer of material over a first surface; (b) forming a masking layer over the first layer; (c) forming a mask over a selected portion of the masking layer; (d) depositing particles into unmasked portions of the masking layer; (e) diffusing the deposited particles into the masking layer a predetermined distance to form two regions having a particle concentration greater than a predetermined concentration, such regions being separated by a region having a particle concentration less than such predetermined concentration; (f) forming an aperture in the masking layer comprising the step of exposing the masking layer to a chemical etchant, selectively removing the region having a particle concentration less than such predetermined concentration to expose a portion of a surface of the first layer of material; and (g) bringing an etchant into contact with the entire portion of the surface of the first layer of material exposed by the aperture, selectively removing the entire portion of the surface of the first layer of material and exposing a portion of the first surface.