US4254446A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Modular, hybrid integrated circuit assembly
Assignee: Individual
•
Filing: 1979-08-30
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Granted: 1981-03-03
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Expires: 1999-08-30
Abstract
Abstract A modular, hybrid integrated circuit assembly is disclosed which includes a number of integrated circuit modules which can be assembled together to create any number of different hybrid electronic circuits. The modules are designed to minimize semiconductor device interconnect path lengths to increase the speed and reliability of the resultant hybrid electronic circuit. The integrated circuit modules are preferably substantially disk shaped and are provided with a plurality of contacts on both sides as well as four equally spaced notches formed in their edges. the modules are assembled like a stack of coins so that the contacts of adjacent modules are pressed together. The assembled modules are held together under pressure by a module carrier that is provided with lead-pins formed into a standard DIP configuration. Bus-bars of the module carrier engage at least some of the notches of the modules to electrically couple the modules to the lead-pins.
Inventors
- 👤 Ric L. Peoples
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 18:41
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H10; H10W; H10W90/00
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
287 words
A modular, hybrid integrated circuit assembly comprising: a module carrier including a header end portion, a compression end portion, a plurality of bus-bar means extending at least partially between said header end portion and said compression end portion, at least one of said bus-bar means being provided with a plurality of electrical contacts, and a plurality of lead-pins electrically coupled to said contacts, and biasing means coupled to said compression end portion; and at least two integrated circuit modules compressively held between said header end portion and said compression end portion by said biasing means, each module including substrate means provided with a concavity at a first surface thereof, an integrated circuit die positioned within said concavity, said die being provided with a plurality of bonding pads, inter-modular interface means including a first regions of said first surface having a plurality of metalized contacts, a second region of a second surface of said substrate having a plurality of metalized contacts, and a elastomeric coupler including a mass of resistive material interspersed with lengths of conductive material, said elastomeric coupler being attached to one of said first surface and said second surface so said lengths of conductive material are electrically coupled to said metalized contacts, whereby when a first surface side of a first module is pressed against a second surface side of a second module said elastomeric coupler couples said metalized contacts of said first region and said second region together, extra-modular interface means formed on the periphery of said substrate means having at least one contact engagable with a contact of said bus-bar means, and coupling means for coupling said contacts of said inter-modular interface means and of said extra-modular interface means to said bonding pads.
Claim 2
Dependent Claim
287 words
A modular, hybrid integrated circuit assembly comprising: a module carrier including a header end portion, a compression end portion, a plurality of bus-bar means extending at least partially between said header end portion and said compression end portion, at least one of said bus-bar means being provided with a plurality of electrical contacts, and a plurality of lead-pins electrically coupled to said contacts, and biasing means coupled to said compression end portion; and at least two integrated circuit modules compressively held between said header end portion and said compression end portion by said biasing means, each module including substrate means provided with a concavity at a first surface thereof, an integrated circuit die positioned within said concavity, said die being provided with a plurality of bonding pads, inter-modular interface means including a first regions of said first surface having a plurality of metalized contacts, a second region of a second surface of said substrate having a plurality of metalized contacts, and a elastomeric coupler including a mass of resistive material interspersed with lengths of conductive material, said elastomeric coupler being attached to one of said first surface and said second surface so said lengths of conductive material are electrically coupled to said metalized contacts, whereby when a first surface side of a first module is pressed against a second surface side of a second module said elastomeric coupler couples said metalized contacts of said first region and said second region together, extra-modular interface means formed on the periphery of said substrate means having at least one contact engagable with a contact of said bus-bar means, and coupling means for coupling said contacts of said inter-modular interface means and of said extra-modular interface means to said bonding pads.
Claim 3
Dependent Claim
43 words
An assembly as claimed in claim 1 wherein said modular carrier is substantially a rectangular prism in shape, and said plurality of lead pins extend away from at least one of said bus-bar means to electrically couple said circuit assembly to another circuit.
Claim 4
Dependent Claim
26 words
An assembly as claimed in claim 2 wherein said lead pins are configured and spaced so as to be adapted to fit an integrated circuit socket.
Claim 5
Dependent Claim
35 words
An assembly as claimed in claim 2 wherein said biasing means includes a threaded bore provided through said compression end portion, and tensioning screw means engaged with said threaded bore for engaging another end module.
Claim 6
Dependent Claim
50 words
An assembly as claimed in claim 1 wherein said substrate means includes at least one ceramic layer, and said coupling means includes conductive traces formed on a surface of said ceramic layer for providing conductive paths from said bonding pads to said inter-modular interface means and said extra-modular interface means.
Claim 7
Dependent Claim
88 words
An assembly as claimed in claim 1 wherein said header end portion is provided with a first pair of bus-bar means extending substantially perpendicularly therefrom, and a first pair of bus-bar apertures spaced from said bus-bar means, and said compression end portion is provided with a second pair of bus-bar means extending substantially perpendicularly therefrom that are engagable with said first pair of bus-bar apertures, and a second pair of bus-bar apertures spaced from said second bus-bar means with which said first pair of bus-bar means are engagable.
Claim 8
Dependent Claim
29 words
An assembly as claimed in claim 6 wherein said module is provided with at least one notch means formed inwardly from its periphery for engagement with a bus-bar means.
Claim 9
Dependent Claim
24 words
An assembly as claimed in claim 6 wherein said bus-bar means is provided with a means for engaging a peripheral surface of said modules.
Claim 10
Dependent Claim
59 words
An assembly as claimed in claim 7 wherein said bus-bar means include a metal tube of rectangular cross-section, a first electrically insulating layer covering at least a portion of an external portion of said tube, a plurality of conductive traces formed on said first layer, and a second electrically insulating layer covering the central portion of said conductive traces.
Claim 11
Dependent Claim
26 words
An assembly as claimed in claim 9 wherein said metal tube is provided with a plurality of perforations to increase heat dissipation capabilities of said bus-bar.
Claim 12
Dependent Claim
153 words
An integrated circuit module for use with a modular, hybrid integrated circuit assembly comprising substrate means provided with a concavity at a first surface thereof, an integrated circuit die positioned within said concavity, said die being provided with a plurality of bonding pads, inter-modular interface means including a first region of said first surface having a pluality of metalized contacts, a second region of a second surface of said substrate having a plurality of metalized contacts, and a elastomeric coupler including a mass of resistive material interspersed with lengths of conductive material, said elastomeric coupler being attached to one of said first surface and said second surface so said lengths of conductive material are electrically coupled to said metalized contacts, extra-modular interface means formed on the periphery of said substrate means, and coupling means for coupling said contacts of said inter-modular interface means and of said extra-modular interface means to said bonding pads.
Claim 13
Dependent Claim
153 words
An integrated circuit module for use with a modular, hybrid integrated circuit assembly comprising substrate means provided with a concavity at a first surface thereof, an integrated circuit die positioned within said concavity, said die being provided with a plurality of bonding pads, inter-modular interface means including a first region of said first surface having a pluality of metalized contacts, a second region of a second surface of said substrate having a plurality of metalized contacts, and a elastomeric coupler including a mass of resistive material interspersed with lengths of conductive material, said elastomeric coupler being attached to one of said first surface and said second surface so said lengths of conductive material are electrically coupled to said metalized contacts, extra-modular interface means formed on the periphery of said substrate means, and coupling means for coupling said contacts of said inter-modular interface means and of said extra-modular interface means to said bonding pads.
Claim 14
Dependent Claim
50 words
A module as claimed in claim 11 wherein said substrate means includes at least one ceramic layer, and said coupling means includes conductive traces formed on a surface of said ceramic layer for providing conductive paths from said connection pads to said inter-modular interface means and said extra-modular interface means.
Claim 15
Dependent Claim
29 words
A module as claimed in claim 11 wherein said module is provided with at least one notch means formed inwardly from its periphery for engagement with a bus-bar means.
Claim 16
Dependent Claim
42 words
A module as claimed in claim 13 wherein said substrate means is substantially disk shaped with a plurality of notch means spaced around its periphery, and said module includes an extra-modular interface means formed on at least one of said notch means.
Claim 17
Dependent Claim
24 words
A module as claimed in claim 14 wherein said coupling means further includes a conductive coupling between said bonding pads and said conductive traces.
Claim 18
Dependent Claim
53 words
A module as claimed in claim 15 wherein said coupling means further includes a plurality of bores formed through said ceramic layer in alignment with the metalized contacts of said first region and said second region, said plurality of bores being provided with a conductive wall coating for electrically connecting respective metalized contacts.
Claim 19
Dependent Claim
22 words
A module as claimed in claim 16 further comprising epoxy sealer means disposed over said die to form a protective, hermetic seal.
Claim 20
Dependent Claim
33 words
A module as claimed in claim 17 further comprising a thermally conductive material covering the portions of said first surface and said second surface that are not covered by said inter-modular interface means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1984-03-02 | 1984-09-01 | 1985-03-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1988-03-02 | 1988-09-01 | 1989-03-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1992-03-02 | 1992-09-01 | 1993-03-03 | $7700.00 | Window Closed / Lapsed |