Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips

Abstract

Abstract AN IMPROVED HERMETICALLY SEALED MODULE IS PROVIDED FOR PACKAGING LARGE SCALE INTEGRATED CIRCUIT (LSI) CHIPS FOR COMPUTERS, AND THE LIKE, AND AN IMPROVED HIGHER LEVEL PACKAGING STRUCTURE IS PROVIDED FOR A MULTIPLICITY OF SUCH MODULES. THE INDIVIDUAL MODULES INCORPORATE A HEAT EXCHANGER BY WHICH COOLING AIR IS BROUGHT WITHIN THE PROXIMITY OF THE HEAT DISSIPATING SEMICONDUCTOR ELEMENT IN THE MODULE WHILE STILL MAINTAINING THE INTEGRITY OF THE HERMETICALLY SEALED ENCLOSURE, AND AN IMPROVED ELECTRICAL TERMINAL ASSEMBLY IS PROVIDED FOR CONNECTING THE SEMICONDUCTOR ELEMENT WITHIN THE MODULE TO OUTSIDE CIRCUITRY. THE HIGHER LEVEL PACKAGING STRUCTURE CONSISTS OF TWO CONTACT BLOCK ASSEMBLIES TO WHICH MOTHERBOARDS, A FRONT PANEL, A REAR PANEL, A BOTTOM INLET AIR PLENUM AND A TOP OUTLET AIR PLENUM ARE MOUNTED, TOGETHER WITH A CONTACT ASSEMBLY FOR ENGAGEMENT WITH THE CONTACTS ON THE INDIVIDUAL MODULES. THE CONTACTS OF THE CONTACT ASSEMBLY ARE CAM OPERATED INTO ENGAGEMENT WITH THE MODULE CONTACTS AFTER THE MODULE IS INSERTED SO AS TO MINIMIZE THE INSERTION FORCE REQUIREMENTS.

Inventors

• 👤 Lothar Laermer
• 👤 Robert J Schenk

Bibliographic Details