Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
200 words
A field effect transistor (10) comprising a body (12) of single crystal semiconductor material having a pair of major surfaces (24, 25), a source electrode (34) formed on one major surface (25), a drain elctrode (26) formed on the other major surface (24), and gate electrode means (28) formed on one of said major surfaces (24) for causing a first depletion region (38) to form within said semiconductor body, the extent of said region being controllable by a voltage (V G ) applied to said gate electrode means, said field effect transistor characterized by a plurality of spaced-apart, metal electrodes (14) embedded within said body, each for providing an electrically floating potential, there between into which the depletion regions (36) of said so as to cause at least second and third depletion regions (36) to form within said body, thereby producing a source electrode-to-drain electrode current flow channel within said body between said second and third depletion regions, the flow of current between said source and drain electrodes through said channel being controllable by said voltage (V G ) applied to said gate electrode means through the interaction of said first depletion region with said second and third depletion regions.
Claim 2
Dependent Claim
200 words
A field effect transistor (10) comprising a body (12) of single crystal semiconductor material having a pair of major surfaces (24, 25), a source electrode (34) formed on one major surface (25), a drain elctrode (26) formed on the other major surface (24), and gate electrode means (28) formed on one of said major surfaces (24) for causing a first depletion region (38) to form within said semiconductor body, the extent of said region being controllable by a voltage (V G ) applied to said gate electrode means, said field effect transistor characterized by a plurality of spaced-apart, metal electrodes (14) embedded within said body, each for providing an electrically floating potential, there between into which the depletion regions (36) of said so as to cause at least second and third depletion regions (36) to form within said body, thereby producing a source electrode-to-drain electrode current flow channel within said body between said second and third depletion regions, the flow of current between said source and drain electrodes through said channel being controllable by said voltage (V G ) applied to said gate electrode means through the interaction of said first depletion region with said second and third depletion regions.
Claim 3
Dependent Claim
14 words
The transistor of claim 1 wherein said embedded metal electrodes comprise single crystal material.
Claim 4
Dependent Claim
27 words
The transistor of claim 2 wherein said body comprises a material selected from the group consisting of GaAs and alloys thereof, and said embedded electrode comprises Al.
Claim 5
Dependent Claim
18 words
The transistor of claims 1 or 3 wherein said embedded electrode forms a Schottky barrier with said body.
Claim 6
Dependent Claim
31 words
The transistor of claim 1 wherein said embedded electrodes comprise elongated parallel stripes, and said drain electrode includes a plurality of elongated parallel stripes in substantial registration with said embedded electrodes.
Claim 7
Dependent Claim
78 words
The transistor of claim 3 wherein said semiconductor body comprises a GaAs substrate, at least one epitaxial GaAs layer grown by molecular beam epitaxy on said substrate, said embedded Al electrodes being formed on said epitaxial layer by molecular beam epitaxy growth at a temperature in the range between room temperature and approximately 300 degrees C, and a GaAs single crystal active layer grown by MBE over said embedded electrodes at a temperature of approximately 360-400 degrees C.
Claim 8
Dependent Claim
23 words
The transistor of claim 1, 2, 3, 5, or 6 wherein said drain and gate electrodes are formed on the same major surface.