Phenol-free photoresist stripper

Claim 2

A stripping solution for removing polymeric organic substances from an inorganic substrate, said solution being essentially free of phenol compounds and comprising: 30-80 weight percent of an aryl sulfonic acid having the formula ##STR6## wherein R is hydrogen or an alkyl group containing 1 to 14 carbon atoms or mixtures thereof, and 2- 70weight percent of a solvent which includes a chlorinated aryl compound of the formula ##STR7## wherein R 1 , R 2 and R 3 are each independently H, Cl or alkyl, and R 1 , R 2 and R 3 together have 0-5 carbons.

Claim 3

The stripping solution as defined in claim 1 wherein the solvent further includes an alkyl aryl compound of the formula ##STR8## where R 1 is an alkyl group, R 2 , R 3 and R 4 are independently hydrogen or an alkyl group and R 1 , R 2 , R 3 and R 4 together contain 1-14 carbon atoms.

Claim 4

The stripping solution as defined in claim 2 wherein the aryl sulfonic acid includes dodecylbenzene sulfonic acid.

Claim 5

The stripping solution as defined in claim 3 wherein the aryl sulfonic acid further includes toluene sulfonic acid.

Claim 6

The stripping solution as defined in claim 2 including dodecylbenzene as said alkylaryl compound.

Claim 7

The stripping solution as defined in claim 1 including dichlorobenzene as said chlorinated aryl compound.

Claim 8

The stripping solution as defined in claim 1 wherein the aryl sulfonic acid includes dodecylbenzene sulfonic acid.

Claim 9

The stripping solution as defined in claim 7 wherein the aryl sulfonic acid further includes toluene sulfonic acid.

Claim 10

The stripping solution of claim 1 wherein said aryl sulfonic acid is 5-10 weight percent toluene sulfonic acid and the remainder dodecylbenzene sulfonic acid.

Claim 11

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 1.

Claim 12

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 2.

Claim 13

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 3.

Claim 14

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 4.

Claim 15

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 5.

Claim 16

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 6.

Claim 17

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 7.

Claim 18

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 8.

Claim 19

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 9.

Claim 20

A stripping solution for removing polymeric organic substances from an inorganic substrate, said solution being essentially free of phenol compounds and comprising: 30-80 weight percent of a mixture or aryl sulfonic acids of the formula ##STR9## wherein R is hydrogen or an alkyl group containing 1 to 14 carbon atoms, said mixture of aryl sulfonic acids including dodecylbenzene sulfonic acid and toluene sulfonic acid, in admixture with 20-70 weight percent of a solvent which is chlorinated aryl compound of the formula ##STR10## where R 1 , R 2 and R 3 are each independently H, Cl or alkyl, and R 1 , R 2 and R 3 together have 0-5 carbons; an isoparaffinic hydrocarbon having an average molecular weight between 150 and 210 and a boiling point between 160° and 220° C.; an alkylaryl compound of the formula ##STR11## where R 1 is an alkyl group, R 2 , R 3 and R 4 are independently hydrogen or an alkyl group and R 1 , R 2 , and R 3 and R 4 together contain 1-14 carbon atoms; or mixtures thereof; said composition including 10-60 weight percent of at least one of said chlorinated aryl compounds and 10-60 weight percent of at least one of said alkylaryl compounds.

Claim 21

A stripping solution for removing polymeric organic substances from an inorganic substrate, said solution being essentially free of phenol compounds and comprising: 30-80 weight percent of a mixture or aryl sulfonic acids of the formula ##STR9## wherein R is hydrogen or an alkyl group containing 1 to 14 carbon atoms, said mixture of aryl sulfonic acids including dodecylbenzene sulfonic acid and toluene sulfonic acid, in admixture with 20-70 weight percent of a solvent which is chlorinated aryl compound of the formula ##STR10## where R 1 , R 2 and R 3 are each independently H, Cl or alkyl, and R 1 , R 2 and R 3 together have 0-5 carbons; an isoparaffinic hydrocarbon having an average molecular weight between 150 and 210 and a boiling point between 160° and 220° C.; an alkylaryl compound of the formula ##STR11## where R 1 is an alkyl group, R 2 , R 3 and R 4 are independently hydrogen or an alkyl group and R 1 , R 2 , and R 3 and R 4 together contain 1-14 carbon atoms; or mixtures thereof; said composition including 10-60 weight percent of at least one of said chlorinated aryl compounds and 10-60 weight percent of at least one of said alkylaryl compounds.

Claim 22

The stripping solution of claim 19 including 10-60 weight percent dodecylbenzene as said one alkylaryl compound and 10-60 weight percent dichlorobenzene as said one chlorinated aryl compound.

Claim 23

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 19.

Claim 24

A method for removing a photoresist organic polymer coating material from the surface of an inorganic substrate which comprises contacting said coated substrate for a time sufficient to loosen said coating with the stripping composition of claim 20.