Abstract A method for selectively depositing contacts in semiconductor regions. One set of contact openings is protected by a barrier layer during the metallization of another set of exposed contact openings to improve the cleanliness and reliability of the contacts. The barrier layer is then removed and a second layer of metallization is deposited in both sets of openings. In the preferred embodiment a standard diffusion mask is used to define all contact regions and a screen oxide is thermally grown in each of the contact openings. A blocking photoresist mask is then applied and patterned to expose the oxide in those openings in which a first set of contacts is to be formed. The screen oxide is removed and the first layer of metallization, typically platinum silicide, is then formed. The screen oxide is then removed from the protected contact areas and the second layer of metallization, for example, chrome, aluminum, or other metals or combinations thereof are deposited in all openings, thereby forming one layer of metallurgy in the second set of openings and two layers in the first set.
A method for selectively forming conductive contacts to impurity regions of a semiconductor substrate through a set of openings in a mask disposed atop said substrate comprising: forming a protective layer of silicon dioxide within said set of openings; removing said protective layer from a first subset of said openings while protecting a second subset of said openings, so as to expose a first subset of impurity regions; depositing a first metallic silicide conductive contact material in said first subset of exposed impurity regions; removing said protective layer by dip etching from said second subset of openings so as to expose a second subset of impurity regions without applying a resist layer atop said first contact material; and depositing a second conductive contact material in said first and second subsets of impurity regions.
Claim 2
Independent Claim
133 words
A method for selectively forming conductive contacts to impurity regions of a semiconductor substrate through a set of openings in a mask disposed atop said substrate comprising: forming a protective layer of silicon dioxide within said set of openings; removing said protective layer from a first subset of said openings while protecting a second subset of said openings, so as to expose a first subset of impurity regions; depositing a first metallic silicide conductive contact material in said first subset of exposed impurity regions; removing said protective layer by dip etching from said second subset of openings so as to expose a second subset of impurity regions without applying a resist layer atop said first contact material; and depositing a second conductive contact material in said first and second subsets of impurity regions.
Claim 3
Dependent Claim
21 words
A method as in claim 1 wherein said second subset of openings comprises all openings except said first subset of openings.
Claim 4
Dependent Claim
18 words
A method as in claim 1 wherein said mask comprises a composite of silicon dioxide and silicon nitride.
Claim 5
Dependent Claim
19 words
A method as in claim 1 wherein said subset of impurity regions include N- type and N+ type silicon.
Claim 6
Dependent Claim
27 words
A method as in claim 4 wherein said contacts in said first subset of openings comprise both ohmic as well as high barrier height Schottky barrier contacts.
Claim 7
Dependent Claim
17 words
A method as in claim 1 wherein said second subset of impurity regions include N- type silicon.
Claim 8
Dependent Claim
23 words
A method as in claim 7 wherein said contacts in said second subset of openings comprise Schottky barrier diodes having low barrier heights.
Claim 9
Dependent Claim
26 words
A method as in claim 1 wherein said silicon dioxide is selected from the group consisting of thermally grown silicon dioxide and vapor deposited silicon dioxide.
Claim 10
Dependent Claim
15 words
A method as in claim 1 wherein said first conductive contact material is platinum silicide.
Claim 11
Dependent Claim
14 words
A method as in claim 9 wherein said second conductive contact material is tantalum.