US4229758A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Package for semiconductor devices with first and second metal layers on the substrate of said package
Assignee: Kyoto Ceramic Co Ltd
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Filing: 1979-02-09
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Granted: 1980-10-21
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Expires: 1999-02-09
Abstract
Abstract A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal having a good bondability to aluminum metal, which is electrically connected to the first metal layer.
Inventors
- 👤 Kouji Ikari
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 07:32
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W76/17; H10W76/18; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
45 words
A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal a good bondability to aluminum metal, which is electrically connected to the first metal layer.
Claim 2
Dependent Claim
45 words
A package for sealing an MOS type semiconductor element having a die-attach area comprising a first metal layer composed of gold and a second metal layer composed of a metal a good bondability to aluminum metal, which is electrically connected to the first metal layer.
Claim 3
Dependent Claim
60 words
A package for sealing an MOS type semiconductor element according to claim 1 wherein the MOS type semiconductor element is fixed onto the first metal layer, a common grounding electrode of said semiconductor element is connected to the second metal layer through an aluminum fine wire and common grounding of said semiconductor element is accomplished through the second metal layer.
Claim 4
Dependent Claim
40 words
A package for sealing an MOS type semiconductor element according to claim 1, wherein the second metal layer is composed of a metal selected from the group consisting of silver, a silver-platinum mixture, a silver-palladium mixture and a silver-palladium-platinum mixture.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-10-21 | 1984-04-21 | 1984-10-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-10-21 | 1988-04-21 | 1988-10-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-10-21 | 1992-04-21 | 1992-10-21 | $7700.00 | Window Closed / Lapsed |