US3697666A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Enclosure for incapsulating electronic components
Assignee: Diacon Inc
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Filing: 1971-09-24
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Granted: 1972-10-10
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Expires: 1991-09-24
Abstract
Abstract An enclosure for encapsulating an electronic component including a substrate and a conductive lead frame attached to the substrate and embedded in a composite glass layer, the layer having two portions. The lower portion is a substantially devitrified glass and the upper portion is a substantially non-devitrified glass. The lead frame has surfaces exposed for electrical contact both within and without the perimeter of the substrate, the intermediate part of the lead frame between the exposed portions being embedded in the composite glass layer.
Inventors
- 👤 Wilbur T Wakley
- 👤 Michael T Leeds
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:16
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134; H10W76/15; H10W76/157; H10W76/60; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
83 words
Enclosure for encapsulating an electronic component comprising: a substrate; a conductive lead frame attached to said substrate and embedded in a composite glass layer on said substrate, said layer having a first lower portion which is substantially devitrified and a second upper portion which is substantially non-devitrified, said lead frame having surfaces exposed for electrical contact both within and without the perimeter of said substrate, the intermediate part of said lead frame between said exposed portions being embedded in said composite glass layer.
Claim 2
Dependent Claim
83 words
Enclosure for encapsulating an electronic component comprising: a substrate; a conductive lead frame attached to said substrate and embedded in a composite glass layer on said substrate, said layer having a first lower portion which is substantially devitrified and a second upper portion which is substantially non-devitrified, said lead frame having surfaces exposed for electrical contact both within and without the perimeter of said substrate, the intermediate part of said lead frame between said exposed portions being embedded in said composite glass layer.
Claim 3
Dependent Claim
41 words
The enclosure of claim 1 further characterized by the addition of a semiconductor device attached to said substrate and electrically connected to said lead frame, and a cap covering said semiconductor device and sealed to said glass layer on said substrate.
Claim 4
Dependent Claim
31 words
The enclosure of claim 2 further characterized by said cap having a coating of glass which forms part of the seal together with said upper portion of said composite glass layer.
Claim 5
Dependent Claim
24 words
The enclosure of claim 1 further characterized by said upper portion of said composite glass layer covering said intermediate portion of said lead frame.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-10 | 1976-04-10 | 1976-10-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-10 | 1980-04-10 | 1980-10-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-10 | 1984-04-10 | 1984-10-10 | $7700.00 | Window Closed / Lapsed |