US3681513A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hermetic power package
Assignee: American Lava Corp
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Filing: 1971-01-26
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Granted: 1972-08-01
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Expires: 1991-01-26
Abstract
Abstract Hermetic power packages are devices in which power-consuming chip devices or integrated circuits which generate considerable amounts of heat can be mounted and which provide thermally integral heat sinks.
Inventors
- 👤 Billy M Hargis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 10:43
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/134; H10W40/00; H10W40/70; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
69 words
A package adapted for a power-consuming chip device comprising: A. A metallic heat conductive base B. A low expansion metallic shim brazed to said base and, C. A lead-bearing alumina ceramic collar having metallic surfaces at least partially covering the top and bottom surfaces, said collar being sealed to said base by brazing to said shim and surrounding an area of said base adapted to receive said chip device.
Claim 2
Dependent Claim
69 words
A package adapted for a power-consuming chip device comprising: A. A metallic heat conductive base B. A low expansion metallic shim brazed to said base and, C. A lead-bearing alumina ceramic collar having metallic surfaces at least partially covering the top and bottom surfaces, said collar being sealed to said base by brazing to said shim and surrounding an area of said base adapted to receive said chip device.
Claim 3
Dependent Claim
34 words
A package adapted for a power-consuming chip device according to Claim 1 having a substantially central opening in the low expansion metallic shim approximately corresponding to the area surrounded in the lead-bearing ceramic collar.
Claim 4
Dependent Claim
47 words
A package adapted for a power-consuming chip device according to claim 1, having a bilaterally metal-coated beryllia chip attached to the base within the area surrounded by the ceramic collar and adapted for attachment of a chip device to the base with electrical insulation and thermal conduction.
Claim 5
Dependent Claim
38 words
A package adapted for a power-consuming chip device according to claim 1 wherein a low expansion metallic ring is attached to the upper surface of the ceramic collar to provide a base for attachment of a covering lid.
References Cited (Backward Citations)
US3515952A
Cited
US3479570A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-08-01 | 1976-01-31 | 1976-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-08-01 | 1980-01-31 | 1980-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-08-01 | 1984-01-31 | 1984-08-01 | $7700.00 | Window Closed / Lapsed |