US4187191A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Photoresist stripper with dodecylsulfonic acid and chlorinated solvents
Assignee: Motors Liquidation Co
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Filing: 1978-07-26
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Granted: 1980-02-05
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Expires: 1998-07-26
Abstract
Abstract A stripper for removing a photoresist mask. The stripper consists essentially, by volume, of about 50-85% tetrachloroethylene and ortho-dichlorobenzene in generally equal amounts, about 15-50% dodecylsulfonic acid, and up to 3% formic acid.
Inventors
- 👤 George W. Simpson, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 06:55
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/26; G03F7/42; G03F7/422; G03F7/426
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
55 words
A low cost and readily disposable liquid composition for removing an organic solvent strippable polymer and/or colloid photoresist mask from a face on a silicon wafer substantially at room temperature and pressure, said composition including, by volume, about 15-50% dodecylsulfonic acid, and about 25-42% of each of tetrachloroethylene and ortho-dichlorobenzene in generally equal stripper proportions.
Claim 2
Dependent Claim
55 words
A low cost and readily disposable liquid composition for removing an organic solvent strippable polymer and/or colloid photoresist mask from a face on a silicon wafer substantially at room temperature and pressure, said composition including, by volume, about 15-50% dodecylsulfonic acid, and about 25-42% of each of tetrachloroethylene and ortho-dichlorobenzene in generally equal stripper proportions.
Claim 3
Dependent Claim
45 words
A stripper for removing an organic solvent strippable polymer and/or colloid photoresist mask from a semiconductor device surface, said stripper consisting essentially of, by volume, about 50-85% tetrachloroethylene and ortho-dichlorobenzene in generally equal amounts, up to 3% formic acid, and the remainder substantially dodecylsulfonic acid.
Claim 4
Dependent Claim
45 words
A stripper for removing an organic solvent strippable polymer and/or colloid photoresist mask from a semiconductor device surface, said stripper consisting essentially of, by volume, about 50-85% tetrachloroethylene and ortho-dichlorobenzene in generally equal amounts, up to 3% formic acid, and the remainder substantially dodecylsulfonic acid.
Claim 5
Dependent Claim
63 words
A low cost, phenol-less stripper for a hardened, organic solvent strippable polymer and/or colloid photoresist on a silicon wafer surface, said stripper consisting essentially of, by volume, at least about 30% dodecylsulfonic acid, up to 3% formic acid, about 25-35% tetrachloroethylene, and about 25-35% ortho-dichlorobenzene, wherein the stripper percentage of tetrachloroethylene and of ortho-dichlorobenzene are less than about 10 stripper percentage points apart.
Claim 6
Dependent Claim
63 words
A low cost, phenol-less stripper for a hardened, organic solvent strippable polymer and/or colloid photoresist on a silicon wafer surface, said stripper consisting essentially of, by volume, at least about 30% dodecylsulfonic acid, up to 3% formic acid, about 25-35% tetrachloroethylene, and about 25-35% ortho-dichlorobenzene, wherein the stripper percentage of tetrachloroethylene and of ortho-dichlorobenzene are less than about 10 stripper percentage points apart.
Claim 7
Dependent Claim
53 words
A low cost, phenol-less stripper for a hardened, organic solvent strippable polymer and/or colloid photoresist material on a silicon wafer face having no unprotected aluminum layer thereon, said stripper consisting essentially of, by volume, about 50-84% tetrachloroethylene and ortho-dichlorobenzene in generally equal amounts, about 1-3% formic acid, and at least 15% dodecylsulfonic acid.
Claim 8
Dependent Claim
53 words
A low cost, phenol-less stripper for a hardened, organic solvent strippable polymer and/or colloid photoresist material on a silicon wafer face having no unprotected aluminum layer thereon, said stripper consisting essentially of, by volume, about 50-84% tetrachloroethylene and ortho-dichlorobenzene in generally equal amounts, about 1-3% formic acid, and at least 15% dodecylsulfonic acid.
Claim 9
Dependent Claim
69 words
A low cost and readily disposable liquid composition suitable for removing a hardened, organic solvent strippable polymer and/or colloid photoresist material from a face on a silicon wafer substantially at room temperature and pressure, which wafer face has an exposed aluminum layer thereon, said composition consisting of about 30-35%, by volume, of each of dodecylsulfonic acid, tetrachloroethylene, and ortho-dichlorobenzene, with the latter two being present in substantially equal volumes.
Claim 10
Dependent Claim
69 words
A low cost and readily disposable liquid composition suitable for removing a hardened, organic solvent strippable polymer and/or colloid photoresist material from a face on a silicon wafer substantially at room temperature and pressure, which wafer face has an exposed aluminum layer thereon, said composition consisting of about 30-35%, by volume, of each of dodecylsulfonic acid, tetrachloroethylene, and ortho-dichlorobenzene, with the latter two being present in substantially equal volumes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-02-04 | 1983-08-06 | 1984-02-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-02-04 | 1987-08-06 | 1988-02-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-02-04 | 1991-08-06 | 1992-02-05 | $7700.00 | Window Closed / Lapsed |