Abstract A crack free layer of GaP is epitaxially deposited on a silicon phosphide surface of a silicon substrate having an (III) orientation. The silicon substrate is prebaked on a carbide coated susceptor with palladium diffused hydrogen at about 1200° C. and pretreated with phosphine at about 1140° C. to form the silicon phosphide surface. The temperature is lowered to 800°-900° C. in the presence of phosphine and trimethyl gallium is introduced at a ratio of 1 to 10 with the phosphine. Cracks in the gallium phosphide are prevented by roughing the bottom non-phosphide surface of the silicon substrate such that the roughed surface is under compressive stress and induces tensile stress on the phosphided surface to reduce the compressive stress produce by gallium phosphide layer when the substrate is annealed at about 1200° C.
A semiconductor structure comprising: a silicon substrate having a first and second surface in the (111) plane; said first surface being silicon phosphide to a depth in the range of 2 to 8 microns; and an epitaxial layer of gallium phosphide on said first surface having a thickness of up to eight microns without cracks.
Claim 2
Dependent Claim
55 words
A semiconductor structure comprising: a silicon substrate having a first and second surface in the (111) plane; said first surface being silicon phosphide to a depth in the range of 2 to 8 microns; and an epitaxial layer of gallium phosphide on said first surface having a thickness of up to eight microns without cracks.
Claim 3
Dependent Claim
23 words
The semiconductor structure according to claim 1 wherein said second surface is under compressive stress and induces tensile stress in said first surface.
Claim 4
Dependent Claim
18 words
The semiconductor structure according to claim 1 wherein said epitaxial layer induces compressive stress in said first surface.
Claim 5
Dependent Claim
27 words
The semiconductor structure according to claim 1 wherein said first surface is smooth prior to the epitaxial deposition of gallium phosphide and said second layer is roughened.
Claim 6
Dependent Claim
24 words
The semiconductor structure according to claim 4 wherein the depth damage to said second surface is in the range of 15 to 25 microns.
Claim 7
Dependent Claim
19 words
The semiconductor structure according to claim 1 when said surfaces are up to ten degrees off the (111) plane.
Claim 8
Dependent Claim
21 words
The semiconductor structure according to claim 6 wherein said surfaces are approximately four and one half degrees off the (111) plane.