Novel polyetheramide-imide phenolic resin blends

Claim 2

A polyetheramide-imide phenolic resin blend comprising a polyetheramide-imide resin and a phenolic resin of the formula, respectively, ##STR15## wherein A represents a polyamide unit and B represents a polyimide unit of a polyetheramide-imide resin, m represents a mole fraction number greater than or equal to zero, C represents a phenolic resin, a represents a resin blend proportion number greater than zero and less than 1, the sum of a plus b equals 1.0, further wherein said polyamide unit is of the formula: ##STR16## and said polyimide unit is of the formula: ##STR17## wherein the O--Z--O units of said polyamide or said polyimide units are in the 3 or 3' or 4 or 4' positions and Z is a member of the class consisting of (1) ##STR18## and (2) divalent organic radicals of the general formula ##STR19## where X is a member selected from the class consisting of divalent radicals of the formulas ##STR20## where q is 0 or 1, y is a whole number from 1, to 5, and R is a divalent organic radical selected from the class consisting of (a) aromatic hydrocarbon radicals having from 6-20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals and cycloalkylene radicals having from 2-20 carbon atoms, C.sub.(2-8) alkylene terminated polydiorganosiloxane, and (c) divalent radicals included by the formula ##STR21## where Q is a member selected from the class consisting of ##STR22## and x is a whole number from 1 to 5 inclusive and further wherein said phenolic resin has an average molecular weight in excess of 125.

Claim 3

A solventless-dry powder comprising a polyetheramide-imide phenolic resin blend comprising a polyetheramide-imide resin and a phenolic resin of the formula, respectively,: ##STR23## wherein A represents a polyamide unit and B represents a polyimide unit of a polyetheramide-imide resin, m represents a mole fraction number greater than or equal to zero, C represents a phenolic resin, a represents a resin blend proportion number greater than zero and less than 1, the sum of a plus b equals 1.0, further wherein said polyamide unit is of the formula: ##STR24## and said polyimide unit is of the formula: ##STR25## wherein the O--Z--O units of said polyamide or said polyimide units are in the 3 or 3' or 4 or 4' positions and Z is a member of the class consisting of (1) ##STR26## and (2) divalent organic radicals of the general formula ##STR27## where X is a member selected from the class consisting of divalent radicals of the formulas ##STR28## where q is 0 or 1, y is a whole number from 1 to 5, and R is a divalent organic radical selected from the class consisting of (a) aromatic hydrocarbon radicals having from 6-20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals and cycloalkylene radicals having from 2-20 carbon atoms, C.sub.(2-8) alkylene terminated polydiorganosiloxane, and (c) divalent radicals included by the formula ##STR29## where Q is a member selected from the class consisting of ##STR30## and x is a whole number from 1 to 5 inclusive and further wherein said phenolic resin has an average molecular weight in excess of 125.

Claim 4

A solventless-dry powder comprising a polyetheramide-imide phenolic resin blend comprising a polyetheramide-imide resin and a phenolic resin of the formula, respectively,: ##STR23## wherein A represents a polyamide unit and B represents a polyimide unit of a polyetheramide-imide resin, m represents a mole fraction number greater than or equal to zero, C represents a phenolic resin, a represents a resin blend proportion number greater than zero and less than 1, the sum of a plus b equals 1.0, further wherein said polyamide unit is of the formula: ##STR24## and said polyimide unit is of the formula: ##STR25## wherein the O--Z--O units of said polyamide or said polyimide units are in the 3 or 3' or 4 or 4' positions and Z is a member of the class consisting of (1) ##STR26## and (2) divalent organic radicals of the general formula ##STR27## where X is a member selected from the class consisting of divalent radicals of the formulas ##STR28## where q is 0 or 1, y is a whole number from 1 to 5, and R is a divalent organic radical selected from the class consisting of (a) aromatic hydrocarbon radicals having from 6-20 carbon atoms and halogenated derivatives thereof, (b) alkylene radicals and cycloalkylene radicals having from 2-20 carbon atoms, C.sub.(2-8) alkylene terminated polydiorganosiloxane, and (c) divalent radicals included by the formula ##STR29## where Q is a member selected from the class consisting of ##STR30## and x is a whole number from 1 to 5 inclusive and further wherein said phenolic resin has an average molecular weight in excess of 125.

Claim 5

A solventless-dry powder of the composition of claim 2, wherein the powder particles have a diameter within the range of from about 5 to about 200 microns, a sintering temperature range (STR) of from about 75° to about 200° C., a viscous flow temperature range (VFTR) of from about 75° to about 240° C., and a leveling temperature range (LTR) of from about 160° to 280° C.

Claim 6

A solventless-dry powder of the composition of claim 3, wherein the phenolic resin has an average molecular weight within the range of from about 350 to 1,000.

Claim 7

A solventless-dry powder coating of the composition of claim 4, wherein the powder particles have a diameter of from about 5 to about 60 microns, a "STR" of 140° to 190° C., a "VFTR" of 155° to 220° C., and a "LTR" of from 200° to 250° C.

Claim 8

A solventless-dry powder of the composition of claim 4, wherein the phenolic resin has a melting point range of from about 40° to about 180° C.

Claim 9

A solventless-dry powder of the composition of claim 2, wherein a is at least equal to the number 0.5.

Claim 10

A claim 2 composition, wherein said phenolic resin is an oil soluble thermoplastic phenolic resin.

Claim 11

A claim 8 composition, wherein said resin is a substantially linear phenolic resin having an average molecular weight of about 350-1000.

Claim 12

The claim 9 composition wherein said resin has a melting point range of from about 40° C. to about 200° C.

Claim 13

The claim 10 composition, wherein said melting point range is from 60° C. to 125° C.

Claim 14

The claim 11 composition, wherein said resins re substantially prepared from phenols having tertiary acyclic or cyclic hydrocarbon para substituents.

Claim 15

The claim 12 composition, wherein said substituents are C 4-30 tertiary alkyl or alkylene radicals.

Claim 16

The claim 13 compositions, wherein said radicals are tertiary butyl radicals.

Claim 17

The claim 12 compositions, wherein "a" represents a resin blend proportion number equal to or greater than 0.75.

Claim 18

The claim 15 composition, wherein the --O--Z--O-- units of said polyamide or said polyimide units are situated in the 3,3'-, 3,4'-, 4,3'- or the 4,4'-positions and Z is the divalent radical of the general formula ##STR31## where X is a divalent radical of the formula --C.sub.y H.sub.2y --, where y is a whole number of from 1 to 5.

Claim 19

A claim 1 composition wherein the polyetheramide-imide resin is a reaction product of (i) an aromatic bis(ether anhydride) of the formula ##STR32## where Z is as defined hereinbefore and (ii) a diamino compound of the formula H.sub.2 N--R--NH.sub.2, where R is as previously defined.

Claim 20

A claim 17 composition wherein the anhydride is 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride and the diamino compound is m-phenylene diamine.

Claim 21

A claim 17 composition wherein the anhydride is 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride and the diamino compound is p-phenylenediamine.

Claim 22

A claim 17 composition wherein the anhydride is 2,2-bis[4-(2,3-dicarboxyphenoxy)phenyl]propane dianhydride and the diamino compound is 4,4'-diaminodiphenylmethane.