Flat package semiconductor device having high explosion preventing capacity

Claim 1

A semiconductor device comprising: a hollow, cylindrical electrically insulating member having first and second open opposite ends; a semiconductor element positioned within said insulating member and having first and second opposite surfaces facing said first and second open ends, respectively; first and second electrodes contacting said first and second opposite surfaces of said semiconductor element, respectively, said first and second electrodes sandwiching therebetween said semiconductor element within said housing member; first and second diaphragms extending outwardly from said first and second electrodes, respectively, to said insulating member, said first and second diaphragms hermetically sealing said first and second open ends of said insulating member; said first and second diaphragms forming within said insulating member respective first and second annular spaces extending peripherally outwardly of said first and second electrodes, respectively; first and second adhesive, electrically insulating layers attached to said first and second diaphragms, respectively, and at least partially filling said first and second annular spaces, respectively; and first and second high thermally resisting, electrically insulating annular-shaped members embedded in said first and second insulating layers, respectively.