Compression-assembled semiconductor device with nesting circular flanges and flexible locating ring

Claim 2

A compression bonded assembly for a semiconductor device comprising, in combination: first and second spaced pole pieces; said first and second pole pieces having respective facing surfaces which are flat and parallel and which are adapted to engage corresponding surfaces of a semiconductor wafer; a semiconductor wafer having flat parallel opposing surfaces disposed between and engaging said respective surfaces of said first and second pole pieces; an insulation housing ring radially spaced from and concentrically surrounding said first and second pole pieces and enclosing at least the volume between said spaced pole pieces; said insulation housing ring having first and second ends; first circular flange ring means extending from said first pole piece and connected to said first end of said insulation housing; second circular flange ring means extending from said second pole piece; third circular flange ring means extending outwardly from said second end of said insulation housing ring; said third flange ring means having substantially the same diameter as said second flange ring means; said third flange ring means engaging said second flange ring means in surface-to-surface contact; at least three discrete bent tabs extending across the outer circumferential peripheries of said second and third flange ring means for centering said second and third flange ring means relative to one another; said at least three bent tabs being circumferentially spaced from one another; each of said at least three bent tabs extending from the same one of said second or third flange ring means, the other of said second or third flange ring means defining a circular disc without extensions thereon.

Claim 3

The device of claim 1 wherein at least one of said at least three bent tabs has a radially extending terminal extending therefrom.

Claim 4

The device of claim 1 wherein each of said first, second and third flange ring means are relatively flexible.

Claim 5

The device of claim 1 wherein said first and second pole pieces are identical to one another.

Claim 6

The device of claim 1 wherein said semiconductor wafer has a thin gate lead extending from a surface thereof which is exclusively outside the area of engagement of said wafer by said first and second pole pieces, and wherein said insulation housing ring contains gate lead terminal means extending therethrough and connected to said gate lead.

Claim 7

The device of claim 5 which further includes a shallow cup-shaped body of flexible insulation material; said cup-shaped body having an opening in the bottom thereof sufficiently large to receive said first pole piece; said cup-shaped body having a shallow cylindrical wall of diameter sufficiently large to receive said semiconductor wafer; said semiconductor wafer being disposed within and gripped within said cup; and said first pole piece engaging said semiconductor wafer through said opening in the bottom of said cup; at least a portion of the body of said cup being elastically compressed against the interior wall of said insulation housing ring, thereby to prevent accidental movement of said wafer relative to said first and second pole pieces after said second and third flange ring means are joined together.

Claim 8

The device of claim 6 wherein said cup-shaped body has a slot in the bottom thereof for receiving said gate lead, and wherein said cup-shaped body has a plurality of notches in its cylindrical wall to assist the elastic compression of said body between said first and second pole pieces.

Claim 9

A compression bonded assembly for a semiconductor device comprising, in combination: first and second spaced pole pieces; said first and second pole pieces having respective facing surfaces which are flat and parallel and which are adapted to engage corresponding surfaces of a semiconductor wafer; an insulation housing ring radially spaced from and concentrically surrounding said first and second pole pieces and enclosing at least the volume between said spaced pole pieces; said insulation housing ring having first and second ends; first circular flange ring means extending from said first pole piece and connected to said first end of said insulation housing ring; second circular flange ring means extending from said second pole piece and connected to said second end of said insulation housing ring; and a shallow cup-shaped body of flexible insulation material; said cup-shaped body having an opening in the bottom thereof sufficiently large to receive said first pole piece; said cup-shaped body having a shallow cylindrical wall of diameter sufficiently large to receive said semiconductor wafer; said semiconductor wafer being disposed within and gripped within said cup, and said first pole piece engaging said semiconductor wafer through said opening in the bottom of said cup-shaped body; at least a portion of the body of said cup being elastically compressed against the interior wall of said insulation housing ring, thereby to prevent accidental movement of said wafer relative to said first and second pole pieces, said cup-shaped body further having a slot in the bottom thereof for receiving said gate lead, and said cup-shaped body having a plurality of notches in its cylindrical wall to assist the elastic compression of said body between said first and second pole pieces.

Claim 10

A compression bonded assembly for a semiconductor device comprising, in combination: first and second spaced pole pieces; said first and second pole pieces having respective facing surfaces which are flat and parallel and which are adapted to engage corresponding surfaces of a semiconductor wafer; an insulation housing ring radially spaced from and concentrically surrounding said first and second pole pieces and enclosing at least the volume between said spaced pole pieces; said insulation housing ring having first and second ends; first circular flange ring means extending from said first pole piece and connected to said first end of said insulation housing ring; second circular flange ring means extending from said second pole piece and connected to said second end of said insulation housing ring; and a shallow cup-shaped body of flexible insulation material; said cup-shaped body having an opening in the bottom thereof sufficiently large to receive said first pole piece; said cup-shaped body having a shallow cylindrical wall of diameter sufficiently large to receive said semiconductor wafer; said semiconductor wafer being disposed within and gripped within said cup, and said first pole piece engaging said semiconductor wafer through said opening in the bottom of said cup-shaped body; at least a portion of the body of said cup being elastically compressed against the interior wall of said insulation housing ring, thereby to prevent accidental movement of said wafer relative to said first and second pole pieces, said cup-shaped body further having a slot in the bottom thereof for receiving said gate lead, and said cup-shaped body having a plurality of notches in its cylindrical wall to assist the elastic compression of said body between said first and second pole pieces.