Semiconductor device with pressure connection electrodes and with headers cemented to insulation ring

Claim 1

A semiconductor device comprising, in combination: a semiconductor wafer assembly having opposed flat parallel surfaces; first and second conductive pole pieces each having first surfaces in surface-to-surface contact with said opposed flat parallel surfaces, respectively, of said wafer assembly and second outer surfaces for connection to exterior circuits; first and second headers connected to said first and second pole pieces and each having disk portions and axially directed cylindrical flange portions extending from the outer peripheries of said disk portions, at least one of said headers having axial flexibility; an insulation ring surrounding said first and second pole pieces and said wafer assembly; said insulation ring having first and second opposing end surfaces; and first and second cylindrical slots entering said first and second end surfaces of said ring and being coaxial with one another; said slots having bottoms which are spaced from one another by the material of said insulation ring; said cylindrical flange portions of said first and second headers extending into said first and second slots, respectively; and a cured adhesive means which is sufficiently fluid in its uncured state to conform to the shapes of said first and second slots; said adhesive means disposed in said first and second slots and permanently connecting said insulation ring and said cylindrical flange portions of said first and second headers; and wherein said slots have tapered openings to permit the easy insertion of said cylindrical flange portions therein during the assembly of said device, and wherein bottom portions of said slots have a constant width only slightly larger than the thickness of said cylindrical flange portions, thereby to accurately center said headers relative to said ring.