US3457472A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor devices adapted for pressure mounting
Assignee: General Electric Co
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Filing: 1966-10-12
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Granted: 1969-07-22
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Expires: 1986-10-12
Abstract
Abstract In a solderless semiconductor device, a disc of semiconductor material is sandwiched between opposing electrodes of a sealed housing where it is centered by a metal ring which is removably seated on a peripheral flange of one of the electrodes.
Inventors
- 👤 Francis P Mulski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 03:42
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W40/00; H10W40/60; H10W40/611; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/138
Claims Analysis
Total Claims: 0
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References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1972-07-21 | 1973-01-20 | 1973-07-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1976-07-21 | 1977-01-20 | 1977-07-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1980-07-21 | 1981-01-20 | 1981-07-22 | $7700.00 | Window Closed / Lapsed |