US4096983A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding copper leads to gold film coatings on alumina ceramic substrate
Assignee: Raytheon Co
•
Filing: 1977-04-11
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Granted: 1978-06-27
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Expires: 1997-04-11
Abstract
Abstract A process for thermocompression bonding a copper wire lead to gold film on alumina ceramic substrate by use of a gold interface. The three step process involves: (1) thermocompressing a gold lead with a die-formed head to the gold film, (2) removing the gold lead to form a gold die-formed head bonding pad, and (3) thermocompressing the copper lead to the gold die-formed head bonding pad.
Inventors
- 👤 Loraine F. Beilein
- 👤 Frank S. Burkett, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 18:55
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/55; H01R12/57; B; B23; B23K; B23K20/00; B23K20/02; B23K20/023; B23K20/025; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/50; H10W72/531; H10W72/533; H10W72/534; H10W72/536; H10W72/5363; H10W72/541; H10W72/5434; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/59; H10W72/90; H10W72/951; H10W72/952; Y; Y10; Y10S; Y10S228/00; Y10S228/904
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
81 words
A process for bonding copper wire leads to gold films on alumina ceramic substrates, comprising the steps of: (a) forming a gold die-formed head bonding pad on the gold film by thermocompressing a gold lead wire with a gold die-formed head to the gold film; (b) removing the gold lead wire; and (c) thermocompressing a copper wire to the gold die-formed head bonding pad forming a bond between the copper wire and the gold film with a gold interface in between.
Claim 2
Dependent Claim
81 words
A process for bonding copper wire leads to gold films on alumina ceramic substrates, comprising the steps of: (a) forming a gold die-formed head bonding pad on the gold film by thermocompressing a gold lead wire with a gold die-formed head to the gold film; (b) removing the gold lead wire; and (c) thermocompressing a copper wire to the gold die-formed head bonding pad forming a bond between the copper wire and the gold film with a gold interface in between.
Claim 3
Dependent Claim
13 words
The process described in claim 1 wherein the gold film is vapor deposited.
Claim 4
Dependent Claim
12 words
The process described in claim 1 wherein the gold film is plated-up.
Claim 5
Dependent Claim
24 words
The process described in claim 1 wherein the gold film is applied as a thick film paste and fired onto the alumina ceramic substrate.
Claim 6
Dependent Claim
13 words
The process described in claim 1 wherein the alumina ceramic substrate is glazed.
Claim 7
Dependent Claim
21 words
The process described in claim 1 wherein the thermocompression bonds are formed at stage temperatures ranging from 100° to 200° C.
Claim 8
Dependent Claim
21 words
The process described in claim 1 wherein the thermocompression bonds are formed at compressive forces ranging from 420 to 520 grams.
Claim 9
Dependent Claim
14 words
The process described in claim 1 wherein the copper wire lead is gold plated.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1981-06-26 | 1981-12-26 | 1982-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1985-06-26 | 1985-12-26 | 1986-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1989-06-26 | 1989-12-26 | 1990-06-27 | $7700.00 | Window Closed / Lapsed |