← Back to Patent Explorer
US3159462A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor and secured metal base and method of making the same

Assignee: Infineon Technologies Americas Corp
•
Filing: 1962-09-24
•
Granted: 1964-12-01
•
Expires: 1982-09-24
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

No abstract record available.

Inventors

  • 👤 Kadelburg Kurt

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 22:37
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336; H10W72/351; H10W72/352; Y; Y10; Y10S; Y10S228/00; Y10S228/903; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/935; Y10S428/939; Y10T; Y10T428/00; Y10T428/12; Y10T428/12486; Y10T428/12493; Y10T428/12528; Y10T428/12674; Y10T428/12771; Y10T428/12806; Y10T428/12826; Y10T428/1284; Y10T428/12861; Y10T428/12889; Y10T428/12944

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 85 words
A SEMICONDUCTOR ELEMENT WHICH COMPRISES: (A) A SILICON SEMICONDUCTOR WAFER; (B) A COPPER BASE OF SAID WAFER; (C) A TUNGSTEN WAFER FOR SECURING THE SILICON WAFER TO THE COPPER BASE, SAID TUNGSTEN WAFER BEING NICKELPLATED AND BEARING A COATING CONSTITUTED OF A GOLDBORON ALLOY THEREOVER; AND (D) A GOLD-GERMANIUM ALLOY SOLDER BONDING THE SILICON WAFER TO THE GOLD-BORON ALLOY COATING ON ONE SIDE OF THE TUNGSTEN WAFER, AND BONDING THE GOLD-BORON ALLOY COATING ON THE OPPOSITE SIDE OF THE TUNGSTEN WAFER TO THE COPPER BASE.
Claim 2
Dependent Claim 85 words
A SEMICONDUCTOR ELEMENT WHICH COMPRISES: (A) A SILICON SEMICONDUCTOR WAFER; (B) A COPPER BASE OF SAID WAFER; (C) A TUNGSTEN WAFER FOR SECURING THE SILICON WAFER TO THE COPPER BASE, SAID TUNGSTEN WAFER BEING NICKELPLATED AND BEARING A COATING CONSTITUTED OF A GOLDBORON ALLOY THEREOVER; AND (D) A GOLD-GERMANIUM ALLOY SOLDER BONDING THE SILICON WAFER TO THE GOLD-BORON ALLOY COATING ON ONE SIDE OF THE TUNGSTEN WAFER, AND BONDING THE GOLD-BORON ALLOY COATING ON THE OPPOSITE SIDE OF THE TUNGSTEN WAFER TO THE COPPER BASE.

References Cited (Backward Citations)

US2402839A Cited
US2816066A Cited
US2964830A Cited
US3062691A Cited
US3068127A Cited
US3050667A Cited
US3025439A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1967-12-01 1968-06-01 1968-12-01 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1971-12-01 1972-06-01 1972-12-01 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1975-12-01 1976-06-01 1976-12-01 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag