US3839780A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of intermetallic bonding
Assignee: Raytheon Co
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Filing: 1971-04-14
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Granted: 1974-10-08
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Expires: 1991-04-14
Abstract
Abstract An intermetallic compound of a metal such as mercury, gallium or indium plus one of the more nobel metals such as copper, gold, nickel, silver or palladium which is utilized for bonding together two metals without the use of any flux or binder so that an excellent thermally and electrically conductive bond is formed. Methods of producing the bonding agent and fabricating structures therewith are disclosed.
Inventors
- 👤 G Freedman
- 👤 M Vogelsang
- 👤 C Vogelsang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 21:58
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/26; B23K35/02; B23K35/0222; B23K35/30; B23K35/0244
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
100 words
IN AN INTERMETALLIC COMPOUND SYSTEM, A BOND FORMED BY THE METHOD OF: MELTING A FIRST ELEMENT OF SAID INTERMETALLIC COMPOUND; FORMING PARTICLES OF A SECOND ELEMENT OF SAID INTERMETALLIC COMPOUND; IMMERSING SAID PARTICLES IN SAID MOLTEN FIRST ELEMENT TO FORM A MIXTURE OF SAID MOLTEN FIRST ELEMENT AND SAID PARTICLES; COOLING SAID MIXTURE TO A LOWER TEMPERATURE TO ARREST AN INTERACTION BETWEEN SAID FIRST ELEMENT AND SAID SECOND ELEMENT TO PROVIDE SAID BONDGING AGENT; AND APPLYING SAID MIXTURE TO AN INTERFACE OF TWO METAL MEMBERS AT A TEMPERATURE ABOVE SAID LOWER TEMPERATURE TO FORM A BOND BETWEEN SAID TWO MEMBERS.
Claim 2
Dependent Claim
100 words
IN AN INTERMETALLIC COMPOUND SYSTEM, A BOND FORMED BY THE METHOD OF: MELTING A FIRST ELEMENT OF SAID INTERMETALLIC COMPOUND; FORMING PARTICLES OF A SECOND ELEMENT OF SAID INTERMETALLIC COMPOUND; IMMERSING SAID PARTICLES IN SAID MOLTEN FIRST ELEMENT TO FORM A MIXTURE OF SAID MOLTEN FIRST ELEMENT AND SAID PARTICLES; COOLING SAID MIXTURE TO A LOWER TEMPERATURE TO ARREST AN INTERACTION BETWEEN SAID FIRST ELEMENT AND SAID SECOND ELEMENT TO PROVIDE SAID BONDGING AGENT; AND APPLYING SAID MIXTURE TO AN INTERFACE OF TWO METAL MEMBERS AT A TEMPERATURE ABOVE SAID LOWER TEMPERATURE TO FORM A BOND BETWEEN SAID TWO MEMBERS.
Claim 3
Dependent Claim
37 words
The bond according to claim 1 further including the step of dissolving a third element in said molten first element prior to said cooling, saiD third element being of a eutectic system which includes said first element.
Claim 4
Dependent Claim
70 words
In an intermetallic compound system a bond formed by: fragmenting a mixture of two constituents of an intermetallic compound system, one of said constituents having a higher melting point than the other; applying said fragmented mixture by a fluidic vehicle to the interface between two objects to be bonded; and abrading said mixture to stimulate an interaction between said constituents and the materials of said objects to form said bond.
Claim 5
Dependent Claim
70 words
In an intermetallic compound system a bond formed by: fragmenting a mixture of two constituents of an intermetallic compound system, one of said constituents having a higher melting point than the other; applying said fragmented mixture by a fluidic vehicle to the interface between two objects to be bonded; and abrading said mixture to stimulate an interaction between said constituents and the materials of said objects to form said bond.
Claim 6
Dependent Claim
17 words
The bond of claim 3 wherein particles of said fragmented mixture are covered with an oxide coating.
Claim 7
Dependent Claim
78 words
A bonding of aluminum comprising the steps of: storing a solid material at a temperature below room temperature, said solid material comprising elements of a class of elements which interact at room temperature to form an intermetallic compound system, said interaction being arrested at said storing temperature; inserting said material along an aluminum interface; and curing said material at room temperature to form said intermetallic bonding of aluminum, said cured material consisting essentially of aluminum, gallium and copper.
Claim 8
Dependent Claim
78 words
A bonding of aluminum comprising the steps of: storing a solid material at a temperature below room temperature, said solid material comprising elements of a class of elements which interact at room temperature to form an intermetallic compound system, said interaction being arrested at said storing temperature; inserting said material along an aluminum interface; and curing said material at room temperature to form said intermetallic bonding of aluminum, said cured material consisting essentially of aluminum, gallium and copper.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-10-07 | 1978-04-08 | 1978-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-10-07 | 1982-04-08 | 1982-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-10-07 | 1986-04-08 | 1986-10-08 | $7700.00 | Window Closed / Lapsed |