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US4046660A Expired / Lapsed US ⏱️ 0.0 years remaining

Sputter coating with charged particle flux control

Assignee: AT&T Inc
•
Filing: 1975-12-29
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Granted: 1977-09-06
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Expires: 1995-12-29
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Abstract

Abstract Substrate heating during sputter coating, due to charged particles, is controlled by the use of an auxiliary magnet in the vicinity of the substrate. The magnet is arranged to either increase this charge particle flux, in situations in which additional heating is desired, or reducing this charge particle flux in situations in which heating is detrimental (e.g., the sputter coating of heat sensitive substrates such as polymer films).

Inventors

  • 👤 David Bruce Fraser

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 15:30
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/20; C23C14/205; C23C14/22; C23C14/34; C23C14/35; C23C14/54; C23C14/541

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 111 words
Method for the sputter deposition of a layer on a substrate comprising placing the substrate in the particle beam of a magnetic field aided sputtering source, which said substrate is situated in the residual magnetic field of the sputtering source CHARACTERIZED IN THAT the residual magnetic field is reduced by means of a second magnetic field of the same order of intensity or greater than said residual magnetic field, and, corresponding in geometry to said residual magnetic field, whereby the flux of charged particles incident on the substrate is reduced said second magnetic field being produced by an auxiliary magnet means situated below the plane of said substrate, opposite said source.
Claim 2
Dependent Claim 111 words
Method for the sputter deposition of a layer on a substrate comprising placing the substrate in the particle beam of a magnetic field aided sputtering source, which said substrate is situated in the residual magnetic field of the sputtering source CHARACTERIZED IN THAT the residual magnetic field is reduced by means of a second magnetic field of the same order of intensity or greater than said residual magnetic field, and, corresponding in geometry to said residual magnetic field, whereby the flux of charged particles incident on the substrate is reduced said second magnetic field being produced by an auxiliary magnet means situated below the plane of said substrate, opposite said source.
Claim 3
Dependent Claim 14 words
Method of claim 1 in which the auxiliary magnet means includes a permanent magnet.
Claim 4
Dependent Claim 21 words
Method of claim 2 in which the permanent magnet is ring shaped with magnetization perpendicular to the plane of the ring.
Claim 5
Dependent Claim 10 words
Method of claim 1 in which the layer is metallic.
Claim 6
Dependent Claim 10 words
Method of claim 1 in which the layer is semiconductive.
Claim 7
Dependent Claim 10 words
Method of claim 1 in which the layer is insulating.

References Cited (Backward Citations)

US2239642A Cited
DE1690689A1 Cited
US3616450A Cited
US3669860A Cited
US3711398A Cited
US3884793A Cited
US3897325A Cited
GB1358411A Cited
US3956093A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1980-09-05 1981-03-07 1981-09-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1984-09-05 1985-03-07 1985-09-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1988-09-05 1989-03-07 1989-09-06 $7700.00 Window Closed / Lapsed

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